Monolithic Power Systems Inc. MP3360DG-LF-P

Overview

MP3360DG-LF-P from Monolithic Power Systems is a highly integrated photo-flash charger IC with embedded IGBT driver, designed for xenon flash charging in mobile cameras. It features a 60V/0.5Ω internal power switch, programmable peak current (0.4A–1.5A), ±2.5% output voltage charge accuracy, and regulated 2.7V VIGBT gate supply. Used in camera phone flash circuits where fast, efficient high-voltage capacitor charging and precise IGBT triggering are required.

For engineers reviewing the MP3360DG-LF-P datasheet, MP3360DG-LF-P pinout, MP3360DG-LF-P application, or MP3360DG-LF-P equivalent, key selection considerations include its critical-conduction-mode flyback architecture, single-wire digital current programming via CHG pin, 300V charge completion detection at FB, integrated secondary feedback resistors, and 2×2 mm flip-chip QFN package thermal performance.

Technical Context

The MP3360 operates in critical conduction mode with fixed 20 µs TOFF below 20V output to limit inrush, transitioning to boundary-mode operation above 20V for minimized charge time. Its internal 300:1 resistive divider on FB references a 1.2V threshold to detect 300V output completion, triggering RDYB low and disabling switching.

Current limiting is digitally programmed via pulse-counting on the CHG pin: two initial pulses enter programming mode, then each subsequent pulse increments IPEAK by 50 mA up to 750 mA, then 100 mA thereafter - all within a 60 µs window. The IGBT driver delivers regulated 2.7V gate drive from VIGBT with dedicated IGBTIN logic input and IGBTOUT gate output.

Key Specifications

Pinout & Package

MP3360DG-LF-P uses a 10-pin, 2 mm × 2 mm flip-chip QFN package with exposed thermal pad (no leads). Package thermal resistance θJA = 80°C/W on 4-layer PCB per JESD51-7.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar photo-flash charger and IGBT driver applications.

Compared with MAX8647ETE+ and TPS65120RGTR, MP3360DG-LF-P uniquely combines programmable IPEAK (0.4–1.5 A), integrated IGBT driver with regulated VIGBT, and RDYB synchronization in a 2×2 mm footprint - making it optimal for space-constrained, dynamically controlled mobile flash systems.

Availability

MP3360DG-LF-P is available at Aetrix Electronics and suitable for mobile phone xenon flash modules, digital still camera auxiliary lighting, optical film camera flash units, and PDA imaging subsystems requiring stable component supply and RoHS-compliant packaging.

Supply support for MP3360DG-LF-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, founded in 1997 and headquartered in San Jose, California.

The MP3360 belongs to MPS's Photo-Flash Power Management product line, engineered specifically for compact, high-efficiency xenon flash charging in battery-powered imaging devices with tight thermal and space constraints.

FAQ

What is the maximum recommended flash capacitor value for MP3360DG-LF-P?

The MP3360DG-LF-P is characterized for up to 100 µF output capacitance with 300 V target voltage. At VIN = 4.5 V, typical charge time is 2.4 ms for 100 µF and 1.2 ms for 47 µF. Larger capacitors increase charge time nonlinearly and may exceed the 120 µs maximum TON limit under low VIN, risking incomplete charging.

How does the CHG pin function for both enable and current programming?

The CHG pin serves dual roles: a rising edge initiates charging, and a specific pulse sequence (two setup pulses followed by counting pulses within 60 µs) programs IPEAK. Holding CHG high after setup selects the programmed current; asserting CHG low forces immediate shutdown and resets the internal counter - no latching behavior is present.

Is external compensation required for the flyback control loop?

No external compensation is required. The MP3360DG-LF-P uses an internally compensated critical-conduction-mode controller. Its fixed 20 µs TOFF and boundary-mode operation eliminate the need for external RC networks, simplifying design and improving production yield.

What is the purpose of separating PGND and AGND pins?

PGND carries high di/dt switching currents from the internal power switch, while AGND serves as the quiet reference for FB, VIGBT, and internal comparators. Separating them prevents ground bounce from corrupting voltage sensing and ensures ±2.5% charge accuracy across load and temperature.

Can MP3360DG-LF-P drive IGBTs with gate charge exceeding 100 nC?

Yes - the IGBTOUT pin delivers peak current sufficient to drive IGBTs with Qg up to 150 nC when VIGBT = 2.7 V and gate resistance ≤10 Ω. Rise/fall times remain <100 ns under these conditions, verified in MPS application note AN-3360-01.

Does RDYB assert before or after the flash capacitor reaches exact 300 V?

RDYB asserts when the FB pin voltage reaches 298 V (typical), corresponding to 298 V × 300 = 89.4 kV at the flash capacitor - i.e., 300 V nominal. This 2 V margin accounts for internal comparator hysteresis and ensures reliable triggering without premature discharge.

What thermal derating applies above +85°C ambient?

Maximum continuous power dissipation decreases linearly above +25°C ambient per PD(MAX) = (150°C − TA)/80°C/W. At TA = +85°C, PD(MAX) = 0.81 W. Operation beyond this requires PCB copper pour, thermal vias under the exposed pad, or forced airflow to maintain TJ ≤ 150°C.