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Monolithic Power Systems Inc. MP3360DG-LF-Z

Part No.:
MP3360DG-LF-Z
Manufacturer:
Monolithic Power Systems Inc.
Category:
LED Drivers
Package:
10-TFQFN
Datasheet:
AetrixMP3360DG-LF-Z.pdf
Description:
IC LED DRIVER RGLTR 10QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,841

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Product details

Overview

MP3360DG-LF-Z from Monolithic Power Systems is a highly integrated photo-flash charger IC with integrated 60V/0.5Ω power switch and IGBT driver, designed for xenon flash in mobile phones and digital cameras. It delivers programmable peak charging currents from 0.4A to 1.5A, achieves ±2.5% output voltage accuracy via internal 300:1 feedback divider, and regulates VIGBT to 2.7V for reliable IGBT gate drive.

For engineers reviewing the MP3360DG-LF-Z datasheet, MP3360DG-LF-Z pinout, MP3360DG-LF-Z application, or MP3360DG-LF-Z equivalent, key selection criteria include flyback boundary-mode operation, single-wire CHG-pin current programming, <1µA shutdown current, RDYB open-drain ready signal, and 2×2 mm flip-chip QFN thermal performance.

Technical Context

The MP3360 operates in critical conduction mode (CrCM) with programmable peak current control and fixed 20µs TOFF below 20V output to limit inrush, transitioning to boundary-mode above 20V for minimal charge time. Its internal 300:1 resistive divider at FB references a 1.2V threshold to achieve 298V nominal charge completion detection.

The integrated IGBT driver supplies regulated 2.7V from VIGBT with dedicated IGBTIN logic input and IGBTOUT gate-drive output, while SW pin connects directly to the primary of the flyback transformer and supports up to 60V drain-source voltage swing with 0.5Ω RDS(on).

Key Specifications

Parameter Value and Actual Design Meaning
VIN Range 2.5V to 6V - Enables direct integration with Li-ion battery or USB-powered camera modules without external LDO.
SW RDS(on) 0.5Ω - Reduces primary-side conduction loss and allows lower transformer turns ratio, minimizing leakage inductance impact.
Charge Accuracy ±2.5% - Achieved via factory-trimmed internal 300:1 FB divider and 1.2V reference, eliminating need for external precision resistors.
Peak Current Range 0.4A to 1.5A - Programmable in 50mA/100mA steps via CHG pin pulses, supporting diverse flash capacitor sizes and brightness requirements.
Shutdown Current <1µA - Minimizes battery drain during standby in portable devices with infrequent flash usage.
RDYB Output Open-drain, low when VFB ≥298V - Provides direct system-level flash-ready indication without external level-shifting or pull-up.
VIGBT Output 2.7V regulated - Supplies stable gate drive to IGBT independent of VIN fluctuations, ensuring consistent turn-on characteristics.

Pinout & Package

MP3360DG-LF-Z is housed in a 10-pin, 2 mm × 2 mm flip-chip QFN package with exposed thermal pad (PGND-connected), optimized for compact camera phone PCB layouts and thermal dissipation in space-constrained modules.

Pin/Terminal Circuit Role Design Meaning
1 IGBTIN Logic input for IGBT gate driver enable Accepts CMOS-level signal to activate IGBTOUT; high-impedance when inactive, enabling precise flash timing control.
2 IGBTOUT IGBT gate drive output Delivers regulated 2.7V to IGBT gate with sufficient peak current to charge/discharge gate capacitance rapidly.
3 SW Switch node (drain of internal MOSFET) Connects to transformer primary; rated for 60V max, supports fast switching with low RDS(on) and minimized ringing.
4 RDYB Open-drain "flash ready" status output Pulled low when FB ≥298V; requires external pull-up; enables direct microcontroller interrupt or LED driver enable.
5 FB High-voltage feedback input Monitors flash capacitor voltage via internal 300:1 resistor divider; trip point set by 1.2V internal reference.
6 CHG Charge enable & current programming input Rising edge initiates charge cycle; pulse sequence programs IPEAK; low state forces shutdown and discharges SW.
7 PGND Power ground return Low-impedance path for high-current switch return; must be connected to thermal pad for optimal power dissipation.
8 AGND Analog ground reference Separate ground for FB, CHG, and internal reference; requires star-point connection to minimize noise coupling into feedback path.
9 VIN Main supply input Accepts 2.5–6V input; bypassed with ≥0.1µF ceramic capacitor close to pin for stable switching operation.
10 VIGBT Regulated 2.7V LDO output Supplies IGBT gate driver only; bypassed with 0.1µF capacitor to suppress gate-drive transients and ensure stability.

Key Features

Feature Design Value
Integrated 60V/0.5Ω power switch Eliminates external high-voltage MOSFET, reduces BOM count, and lowers primary-side conduction loss in flyback topology.
Single-wire CHG-pin current programming Enables dynamic IPEAK adjustment (0.4–1.5A) using only one GPIO, avoiding extra DACs or I²C interfaces in resource-limited baseband processors.
±2.5% output voltage accuracy Guarantees consistent flash brightness across units and temperature without calibration, leveraging trimmed internal resistive divider.
<1µA shutdown current Extends standby battery life in mobile devices where flash is used intermittently-critical for user experience in camera applications.
Integrated 2.7V VIGBT LDO Provides stable, noise-immune gate drive for IGBT, decoupling flash timing from VIN ripple and improving flash trigger reliability.

Applications

Mobile Phone Xenon Flash Digital Still Camera Flash

Use Scenario: High-brightness flash illumination in smartphone rear/front cameras during low-light capture.

IC Role / Device Role / Timing Role: Flyback charger IC generating 300V across 100µF flash capacitor; triggers IGBT via VIGBT-regulated gate drive to discharge flash tube.

Use Value: Delivers sub-2-second full-charge time at 3.6V input and enables precise, repeatable flash intensity via programmable IPEAK.

Use Scenario: Manual or auto-triggered flash burst in compact DSLR or mirrorless camera bodies.

IC Role / Device Role / Timing Role: Primary high-voltage charge controller interfacing with optical sensor and shutter logic; RDYB signals readiness to MCU before exposure.

Use Value: Supports rapid sequential flash bursts via CHG pin toggling, with <1µA shutdown current preserving battery between shots.

Optical Film Camera Flash PDA with Xenon Flash

Use Scenario: Battery-powered film SLR or rangefinder requiring self-contained flash charging without external boost converters.

IC Role / Device Role / Timing Role: Standalone flash charger with integrated IGBT driver, accepting 3–6V alkaline or NiMH supply and delivering 300V to xenon tube.

Use Value: Eliminates discrete HV generator + driver design; 2×2 mm QFN fits tight mechanical envelopes typical in legacy film camera modules.

Use Scenario: Flash-enabled enterprise PDA used for barcode scanning or document imaging in field service applications.

IC Role / Device Role / Timing Role: Low-quiescent-power flash subsystem co-located with ARM-based application processor; CHG pin synchronized to image capture interrupt.

Use Value: Enables flash functionality in power-sensitive PDAs with long idle periods-<1µA shutdown current prevents measurable battery drain over weeks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar photo-flash charger and IGBT driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
MAX8647ETE+ 40V internal switch, no integrated IGBT driver; requires external gate driver and separate 2.7V LDO. Lacks monolithic IGBT interface; suitable only when discrete gate drive is already present in design. Select when redesigning legacy systems with existing IGBT drivers and lower voltage flash stacks (<250V).
TPS65120RGTR Charges to 350V but uses external MOSFET; no IGBT driver; supports dual-output (positive/negative) for LCD bias. Designed for display bias, not flash; lacks RDYB, CHG-programmability, and flash-specific safety features. Choose only if reusing display-bias IC footprint and adding external IGBT driver and feedback scaling network.

Compared with MAX8647ETE+ and TPS65120RGTR, MP3360DG-LF-Z uniquely integrates both high-efficiency flyback charging and IGBT gate drive in a single 2×2 mm package, reducing component count by ≥4 and eliminating layout-sensitive analog feedback networks required by alternatives.

Availability

MP3360DG-LF-Z is available at Aetrix Electronics and suitable for mobile phone camera modules, digital still camera subsystems, and optical film camera flash circuits requiring stable component supply, RoHS-compliant packaging, and guaranteed long-term availability through MPS's qualified product lifecycle program.

Supply support for MP3360DG-LF-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with core expertise in DC/DC conversion, LED drivers, and battery management solutions.

The MP3360 belongs to MPS's Photo-Flash Power Management product line, engineered specifically for compact, high-efficiency xenon flash charging in battery-powered imaging devices where size, efficiency, and integration are critical.

FAQ

What is the maximum output voltage the MP3360DG-LF-Z can charge to?

The MP3360DG-LF-Z charges flash capacitors to a nominal 300V, determined by its internal 300:1 feedback divider and 1.2V reference. The FB pin trips at 298V (typical), with tolerance specified as 290V to 308V across temperature and process variation.

How is peak charging current programmed on the MP3360DG-LF-Z?

Peak current is programmed via pulse sequences on the CHG pin: after initial enable, two pulses initiate programming mode, and each subsequent pulse increments IPEAK by 50mA (up to 750mA) or 100mA (above). A single high assertion sets 1.5A directly.

Does the MP3360DG-LF-Z require external components for feedback sensing?

No. The MP3360DG-LF-Z includes fully integrated secondary-side feedback resistors with 300:1 division ratio and ±2.5% accuracy. No external resistors are needed at the FB pin-only the flash capacitor connects directly to the transformer secondary.

What is the purpose of the VIGBT pin, and how should it be decoupled?

VIGBT provides a regulated 2.7V supply exclusively for the internal IGBT gate driver. It must be bypassed with a 0.1µF ceramic capacitor placed as close as possible to the VIGBT and GND pins to suppress gate-drive transients and maintain regulation stability.

Can the MP3360DG-LF-Z operate from a 2.5V input supply?

Yes. The MP3360DG-LF-Z supports VIN from 2.5V to 6V. At 2.5V, charge time increases due to reduced power transfer capability, but all functions-including RDYB assertion, IGBT drive, and shutdown-remain fully operational per datasheet specifications.

Is the RDYB output compatible with 1.8V logic systems?

Yes. RDYB is an open-drain output referenced to AGND. When pulled up to any logic rail (1.8V, 3.3V, or 5V), it sinks current to indicate flash readiness. Its leakage current is ≤0.1µA, making it compatible with ultra-low-power microcontrollers.

What thermal considerations apply to the 2×2 mm flip-chip QFN package?

The MP3360DG-LF-Z has θJA = 80°C/W on a 4-layer PCB (JESD51-7). For continuous operation at full load, the exposed thermal pad must be soldered to a solid PGND plane. Thermal shutdown activates at TJ = 150°C with 15°C hysteresis to prevent damage.

MP3360DG-LF-Z Specifications

Product attributes
Attribute value
Manufacturer:
Monolithic Power Systems Inc.
Series:
-
Package/Case:
10-TFQFN
Packaging:
Tape & Reel (TR)
Product Status:
Not For New Designs
Type:
DC DC Regulator
Topology:
Flyback
Internal Switch(s):
Yes
Number of Outputs:
1
Voltage - Supply (Min):
2.5V
Voltage - Supply (Max):
6V
Voltage - Output:
60V
Current - Output / Channel:
-
Frequency:
-
Dimming:
-
Applications:
Camera Flash
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
10-QFN (2x2)

MP3360DG-LF-Z FAQ

1.How can I place an order for MP3360DG-LF-Z through Aetrix?

Please submit a Request for Quotation (RFQ) for MP3360DG-LF-Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MP3360DG-LF-Z reliable?

The price and inventory of MP3360DG-LF-Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP3360DG-LF-Z is usually 5 days.

3.What payment methods are accepted for MP3360DG-LF-Z?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP3360DG-LF-Z transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MP3360DG-LF-Z?

MP3360DG-LF-Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MP3360DG-LF-Z order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MP3360DG-LF-Z?

For technical support, including MP3360DG-LF-Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP3360DG-LF-Z requirements.

6.How does Aetrix verify that MP3360DG-LF-Z is sourced from the original manufacturer or authorized distributors?

All MP3360DG-LF-Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP3360DG-LF-Z meets industry standards.

7.What is the process for return or replacement of MP3360DG-LF-Z?

All MP3360DG-LF-Z units undergo pre-shipment inspection (PSI). If there is an issue with MP3360DG-LF-Z, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MP3360DG-LF-Z part is unused and in its original packaging.

Return procedure for MP3360DG-LF-Z:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MP3360DG-LF-Z Tags

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