STMicroelectronics MP34DT04TR

Overview

MP34DT04TR from STMicroelectronics is an omnidirectional digital MEMS microphone with PDM output, -26 dBFS sensitivity, 64 dB SNR (A-weighted), 120 dBSPL acoustic overload point, and HCLGA (3×4×1.095 mm) top-port package. It operates from -40 °C to +85 °C and is used in voice capture for mobile terminals, laptops, and speech recognition systems.

For engineers reviewing the MP34DT04TR datasheet, MP34DT04TR pinout, MP34DT04TR application, or MP34DT04TR equivalent, key selection criteria include PDM interface timing compatibility, L/R channel selection logic, EMI-shielded top-port mechanical integration, and low-power operation at 1.8 V supply with 700 µA typical current draw.

Technical Context

The MP34DT04TR integrates a capacitive silicon MEMS sensing element with a dedicated CMOS IC interface that outputs a single-bit PDM stream synchronized to an external 1–3.25 MHz clock. Its L/R pin selects left- or right-channel data alignment on DOUT by controlling high-impedance states per clock edge.

It delivers flat frequency response (±2 dBr from 100 Hz–4 kHz), <1% THD+N at 100 dBSPL, and operates across 1.6–3.6 V supply while maintaining 64 dB SNR and -26 dBFS sensitivity - all within a RoHS-compliant, EMI-shielded HCLGA package with integrated ground ring.

Key Specifications

Pinout & Package

HCLGA (3 × 4 × 1.095 mm) top-port, 4-lead surface-mount package with integrated EMI shield, ground ring, and ECOPACK®/RoHS compliance. Designed for automated SMT assembly with MSL Class 3 handling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar digital MEMS microphone applications.

Compared with ICS-43432 and INMP522, MP34DT04TR offers superior SNR and integrated PDM interface in a top-port EMI-shielded package - optimizing for compact, low-noise, digitally-native voice systems without added signal conditioning.

Availability

MP34DT04TR is available at Aetrix Electronics and suitable for smartphone voice assistants, laptop far-field speech capture, and IoT voice-controlled home hubs requiring stable component supply and long-term production continuity.

Supply support for MP34DT04TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and analog components for industrial, automotive, and consumer markets.

The MP34DT04TR belongs to ST's MEMS audio sensor product line, engineered specifically for high-fidelity, low-power digital voice acquisition in space-constrained portable and embedded systems.

FAQ

What is the recommended power supply decoupling for MP34DT04TR?

ST specifies two ceramic capacitors placed adjacent to Pin 1 (Vdd): a 100 nF capacitor for high-frequency noise suppression and a 1 µF capacitor for lower-frequency stabilization. Both must be located as close as possible to the Vdd pin with short, low-inductance traces to maintain PDM signal integrity and prevent oscillation.

How does the LR pin affect PDM data timing on DOUT?

When LR = GND, valid left-channel data appears on DOUT during CLK low periods; when LR = Vdd, valid right-channel data appears during CLK high periods. In both cases, the inactive channel presents high-impedance on DOUT, enabling time-multiplexed stereo operation without external switching.

Can MP34DT04TR be used in reflow soldering processes?

Yes - it is qualified for Pb-free reflow per JEDEC J-STD-020, with peak temperature ≤260 °C, time above liquidus 60–150 sec, and ramp rates ≤3 °C/sec (preheat) and ≤6 °C/sec (cool-down). The device is rated MSL Class 3 and supports up to three reflow cycles.

Is the ground ring electrically connected to the internal die substrate?

Yes - the perimeter ground ring is internally bonded to the substrate ground plane and serves as the primary RF return path. It must be connected to the PCB's main ground plane using multiple vias to ensure effective EMI shielding and stable acoustic reference potential.