Monolithic Power Systems Inc. MP4833AGBN-T

Overview

MP4833AGBN-T from Monolithic Power Systems is a 32-channel, high-voltage SPST analog switch with integrated output bleed resistors in a BGA-80 (7mm×7mm) package. It supports ±90V analog signal switching, 12.5Ω typical on-resistance, ±2A peak switch current, and operates from dual low-voltage supplies (3.3V logic + 10V translator). It is engineered for time-critical transmit/receive multiplexing in medical ultrasound probe front-ends.

For engineers reviewing the MP4833AGBN-T datasheet, MP4833AGBN-T pinout, MP4833AGBN-T application, or MP4833AGBN-T equivalent, key selection criteria include high-voltage isolation at 5MHz (−66dB off-isolation), 80MHz serial interface clock support, integrated bleed resistor grounding (RGND pins), and cascaded daisy-chain capability via DOUT for scalable channel count systems.

Technical Context

The MP4833AGBN-T implements a two-stage digital control architecture: a 32-bit serial shift register followed by a parallel 32-bit latch, enabling precise per-channel SPST switching via DIN/CLK/LE\ signals. Its patented level-shifting design eliminates need for ±HV supplies-only VDD (9–10V) and VLL (2.7–5.5V) are required to drive ±90V analog paths.

All 32 channels feature dedicated SWINx/SWOUTx pairs with non-interchangeable roles: SWINx accepts high-voltage transmit pulses; SWOUTx connects directly to piezoelectric transducers and includes internal bleed resistors tied to RGND. Switch timing is characterized at tON/tOFF = 2µs, with <18pC charge injection and ±14mV voltage spike suppression under pulsed load conditions.

Key Specifications

Pinout & Package

The MP4833AGBN-T is housed in a BGA-80 package (7mm × 7mm, 0.5mm pitch) with exposed substrate (SUB) and dual ground domains (GND and RGND) for noise separation. Pin assignment follows a defined grid layout with dedicated analog I/O banks, logic interface corner pins, and distributed power/ground connections for thermal and EMI robustness.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage analog switch applications.

Compared with TSM1033-32 and ADG5433BRUZ, the MP4833AGBN-T uniquely combines 32-channel density, ±90V capability, integrated bleed, and daisy-chain scalability-making it the only single-package solution for compact, high-performance ultrasound probe front-ends.

Availability

MP4833AGBN-T is available at Aetrix Electronics and suitable for medical ultrasound imaging systems, non-destructive testing equipment, and active probe assemblies requiring stable component supply, long-lifecycle assurance, and RoHS-compliant packaging.

Supply support for MP4833AGBN-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management and analog ICs, with core expertise in HV analog switching, DC/DC conversion, and motor control.

The MP4833A belongs to MPS's high-voltage analog switch product line, designed specifically to replace discrete HV MOSFET arrays in medical and industrial ultrasonic systems-emphasizing integration, safety, and signal fidelity over raw voltage rating.

FAQ

What is the maximum allowable analog signal voltage for continuous operation?

The MP4833AGBN-T supports continuous analog signals up to ±90V as specified in Recommended Operating Conditions. Absolute maximum pulsed voltage is ±105V, but sustained operation above ±90V risks exceeding junction temperature limits and degrading long-term reliability. Operation must remain within the −25°C to +125°C junction temperature range.

Can SWIN and SWOUT pins be swapped in layout?

No-SWINx and SWOUTx pins are functionally asymmetric and not interchangeable. SWINx is optimized for high-voltage pulse injection from transmitter drivers; SWOUTx includes integrated bleed resistors and is designed for direct PZT connection. Swapping violates internal topology and causes improper switching behavior and potential device damage.

How does the RGND pin differ from standard GND pins?

RGND is a dedicated, low-impedance ground return exclusively for the internal output bleed resistors. It must be routed separately from digital (GND) and analog (SUB/VDD return) grounds to prevent noise coupling into the sensitive echo receive path. Mixing RGND with other grounds degrades off-isolation and increases residual voltage after transmit.

Is the 80MHz clock frequency achievable at VLL = 3.3V?

No-the 80MHz maximum clock frequency is guaranteed only at VLL = 5V. At VLL = 3.3V, the maximum rated clock frequency is 40MHz per AC Electrical Characteristics table. Exceeding this limit may cause metastability in the shift register or latch, resulting in incorrect channel activation.

What happens to switch state during CLR assertion?

When CLR is pulled high, all 32 latch bits reset to logic 0, forcing all analog switches to OFF state immediately-regardless of current shift register content. The shift register retains its data, allowing immediate re-latching of prior configuration once CLR returns low and LE\ is pulsed.

Does the device support bidirectional signal flow?

No-the MP4833AGBN-T is unidirectional by design: SWINx serves only as high-voltage input (transmit path), SWOUTx only as transducer output (receive path). It does not support reverse signal routing or true bidirectional analog switching; attempting bidirectional use violates absolute maximum ratings and voids performance guarantees.

How is thermal performance affected by simultaneous switching of all 32 channels?

Simultaneous switching of all 32 channels increases average VDD dynamic current to 8mA and raises die temperature. With θJA = 35°C/W, continuous full-load operation at TA = 85°C approaches TJ = 113°C-within the 125°C max operating limit. For sustained full-load use, ensure ≥2-layer PCB copper pour under the BGA and avoid stacking heat-generating components nearby.