Monolithic Power Systems Inc. MP5010BDQ-LF-P

Overview

MP5010BDQ-LF-P from Monolithic Power Systems is a programmable current-limit load switch with integrated 40mΩ DMOS FET, 3V–18V input range, adjustable 1A–5A current limit via external resistor, 5.7V output over-voltage clamp, and thermal latch shutdown at 175°C. It protects hot-swap interfaces in PC Cards and wireless modem data cards by controlling inrush dv/dt and limiting fault current.

For engineers reviewing the MP5010BDQ-LF-P datasheet, MP5010BDQ-LF-P pinout, MP5010BDQ-LF-P application, or MP5010BDQ-LF-P equivalent, key selection criteria include adjustable slew rate (1.1–19.2ms via C_dv/dt), Kelvin vs. direct current-sense configuration options, EN/FAULT tri-state signaling, and QFN10 (3mm×3mm) thermal pad layout requirements.

Technical Context

The MP5010BDQ-LF-P integrates a charge-pump–driven power FET with 40mΩ R_DS(on) at 25°C (52mΩ at 85°C), enabling low-loss power path control. Its internal UVLO (2.8V rising edge) and OVP (5.7V clamp) operate independently of external components, while the dv/dt pin controls output voltage ramp-up using an external capacitor.

Current limiting uses either Kelvin or direct sensing: with 22Ω on I-Limit pin, trip current is 2.18A (Kelvin) or 4.3A (direct), and hold current is 1.10A or 2.8A respectively. The EN/FAULT pin provides bidirectional fault reporting (LOW = UVLO reset, MID = thermal latch, HIGH = enabled) without external pull-up.

Key Specifications

Pinout & Package

MP5010BDQ-LF-P is housed in a thermally enhanced QFN10 package (3mm × 3mm, 0.5mm pitch) with exposed thermal pad (Pin 11). The package supports ≥2.5W continuous power dissipation at T_A = 25°C (θ_JA = 50°C/W) and requires PCB vias under the exposed pad for reliable thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar programmable current-limit switch applications.

Compared with TPS25940ARVCR and RTQ2132BGQW, MP5010BDQ-LF-P uniquely combines programmable dv/dt, 5.7V hardware OVP, and 40mΩ R_DS(on) in QFN10 - making it optimal for compact hot-swap interfaces where backplane stability and self-contained protection are critical.

Availability

MP5010BDQ-LF-P is available at Aetrix Electronics and suitable for hot-swappable PC Cards, wireless modem data cards, laptop ExpressCard interfaces, and industrial backplane modules requiring stable component supply across extended temperature and lifecycle demands.

Supply support for MP5010BDQ-LF-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with design centers in the US, China, and Taiwan, and global manufacturing partnerships.

The MP5010B product line delivers integrated electronic fuse functionality - combining current limiting, over-voltage clamping, thermal protection, and dv/dt control in single-chip solutions for hot-swap and load-management applications.

FAQ

What is the maximum continuous current rating for MP5010BDQ-LF-P at 85°C ambient?

At T_A = 85°C with standard 2-layer PCB layout and no heatsink, the maximum continuous current is 2.3A (per datasheet Section "Electrical Characteristics"). This is derived from thermal derating: 50°C/W θ_JA × (125°C max T_J − 85°C) = 2.0W max power, supporting ~2.3A through 40mΩ R_DS(on). For sustained 5A operation, thermal vias and copper pour are mandatory.

How does the EN/FAULT pin behave during thermal shutdown?

During thermal shutdown, the EN/FAULT pin is actively driven to an intermediate voltage (0.82–1.95V) - not open-drain or high-Z. This MID level signals thermal fault to external logic and latches the output OFF until EN/FAULT is externally pulled LOW or V_IN drops below UVLO (2.65V). The internal fault flag remains set until reset.

Can MP5010BDQ-LF-P be used with 24V input?

No. Absolute maximum V_CC is 22V, but recommended operating range is strictly 3V–18V. At 24V, internal charge pump and clamp circuitry exceed safe operating limits, risking permanent damage. For 24V systems, use MP5013 (2.5V–36V) or external Zener clamping - neither is drop-in compatible.

What is the difference between Kelvin and direct current sensing on MP5010BDQ-LF-P?

Kelvin sensing uses separate sense paths to eliminate IR drop error from bond wires and PCB traces, yielding tighter current limit accuracy (±15% hold current). Direct sensing shares source and sense paths, simplifying layout but introducing up to 20% error due to trace resistance. Table 2 and Table 3 in the datasheet quantify exact trip/hold values per R_LIMIT.

Is the exposed thermal pad (Pin 11) electrically connected to VCC or GND?

Yes - the exposed pad is internally connected to VCC. It must be soldered to a dedicated VCC copper pour with ≥4 thermal vias (0.3mm diameter) to inner ground/power planes. Floating or grounding the pad violates absolute maximum ratings and causes thermal runaway or premature failure.

Does MP5010BDQ-LF-P support reverse current blocking?

No. The internal DMOS FET is configured as a high-side switch with source-connected outputs - it conducts only from VCC to SOURCE. Reverse current (SOURCE → VCC) is not blocked and will flow freely if V_SOURCE > V_VCC, potentially damaging upstream supplies. External reverse-blocking diode or MOSFET is required for bidirectional isolation.

What is the minimum dv/dt capacitor value for stable operation?

The minimum recommended C_dv/dt is 330pF, yielding ~1.1ms rise time. Using smaller values risks uncontrolled inrush, violating the device's slew-rate specification and potentially triggering false OCP events. Values below 200pF are not characterized and may cause oscillation or latch-up during turn-on.