Monolithic Power Systems Inc. MP5026GLRT-P
- Part No.:
- MP5026GLRT-P
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Unclassified
- Package:
- Datasheet:
-
MP5026GLRT-P.pdf
- Description:
- 16V, 20A, 2.8M RDS(ON), HOT-SWAP
- Quantity:
- Payment:

- Shipping:

Inventory:3,998
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MP5026GLRT-P from Monolithic Power Systems is a hot-swap Intelli-Fuse IC that integrates a 2.8mΩ RDS(ON) power MOSFET, current mirror, die temperature sensor, and 3.3V LDO to protect backplane-powered circuit cards. It delivers up to 20A continuous output current at room temperature, limits inrush current via configurable soft-start, and provides ±1% IMON current monitoring accuracy for real-time load diagnostics in server and networking infrastructure.
For engineers reviewing the MP5026GLRT-P datasheet, MP5026GLRT-P pinout, MP5026GLRT-P application, or MP5026GLRT-P equivalent, this device supports precise over-current limit configuration via ISET resistor, programmable insertion delay and fault timeout via TIMER/ENTM capacitors, latch-off protection mode, and integrated MOSFET health detection - all critical for high-reliability hot-swap system design.
Technical Context
The MP5026 implements a sense-MOSFET-based current-limit architecture with gate-voltage regulation during over-current events, enabling constant-current limiting independent of input voltage. Its dual-stage protection includes fast short-circuit response (200ns) and thermal shutdown at 148°C, with fault latching triggered only after configurable OCP timeout (e.g., 0.3ms with 10nF TIMER capacitor).
Control logic integrates EN/UV and LOADEN with blanking timing: EN/UV enables startup after insertion delay, while LOADEN must remain asserted post-blanking to sustain conduction. The internal 24μA charge pump drives the MOSFET gate, and VOUT slew rate is directly controlled by SS capacitor charging, decoupled from VIN variations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 16V DC - supports wide-range backplane supplies including 3.3V, 5V, and 12V systems without external level-shifting. |
| Continuous Output Current | 20A at TA = 25°C - enables single-device protection for high-power PC cards and disk drive modules. |
| RDS(ON) | 2.8mΩ at TJ = 25°C - minimizes conduction loss (≤1.12W at 20A), reducing thermal stress and PCB area vs. discrete solutions. |
| IMON Accuracy | ±1% reporting error - allows direct current measurement with <1% gain error, eliminating need for external shunt calibration. |
| OCP Response Time | 20µs typical regulation - maintains stable current clamp during transient overloads without oscillation or overshoot. |
| Short-Circuit Response | 200ns detection - prevents catastrophic failure during hard shorts before energy dissipation exceeds SOA limits. |
| Thermal Shutdown Threshold | 148°C junction temperature - provides robust over-temperature protection with hysteresis sufficient for safe recovery. |
Pinout & Package
LGA-26 (4mm × 4mm) package with exposed thermal pad for enhanced heat dissipation in high-current applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pins 1,2,3,16,25) | Input power supply connection | Drain node of integrated MOSFET; multiple pins reduce trace inductance and improve current sharing in high-dI/dt hot-swap events. |
| VOUT (Pins 17–24) | Output power delivery node | Source node of integrated MOSFET; eight parallel pins minimize voltage drop and enable >20A routing on standard PCBs. |
| ISET (Pin 8) | Current limit programming input | Accepts resistor-to-ground to set OC threshold per ILIMIT = 0.3V / RISET; enables precise, low-power current setting without sensing resistor losses. |
| IMON (Pin 9) | Analog current monitor output | Provides 20μA/A proportional voltage signal; supports real-time load monitoring and telemetry without external amplifiers or ADC reference scaling. |
| FLTB (Pin 11) | Open-drain fault indicator | Pulled low on OCP, SCP, OTP, OVP, or MOSFET short faults; enables system-level fault prioritization and coordinated shutdown sequencing. |
| PG (Pin 13) | Power-good status output | Asserts high when VOUT reaches ≥90% of VIN - confirms stable output before downstream logic initialization in server power sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 3.3V LDO (VCC) | Supplies internal logic and gate driver independently of VIN, ensuring reliable operation even during brown-out conditions down to 2.7V. |
| Configurable soft-start (SS) | Capacitor-programmable ramp time (e.g., 9.9ms with 100nF); eliminates input voltage droop and avoids false triggering of upstream supply UVLO. |
| Built-in insertion delay (TIMER) | Programmable delay (e.g., 3ms with 10nF) before MOSFET turn-on - suppresses voltage spikes caused by parasitic input inductance during hot-plug. |
| Fuse health detection | Detects drain-to-source or gate-to-source MOSFET shorts via dedicated comparator thresholds - enables predictive maintenance and avoids silent failures. |
| Latch-off protection mode | Halts automatic recovery after fault timeout, preventing uncontrolled re-engagement into faulted loads - required for safety-critical server backplanes. |
Applications
| Server Backplane Protection | Network Line Card Hot-Swap |
|---|---|
Use Scenario: Insertion of PCIe expansion cards into live 12V server backplanes with strict dV/dt and inrush current limits. IC Role / Device Role / Timing Role: Acts as intelligent fuse between backplane and card load; controls VOUT rise time via SS and enforces 20A current limit during plug-in transients. Use Value: Prevents >5% backplane voltage sag and eliminates need for external TVS diodes or bulk capacitance tuning. | Use Scenario: Hot-swapping 10G Ethernet line cards in carrier-grade switches with redundant power feeds. IC Role / Device Role / Timing Role: Provides dual-fault protection (OCP + SCP) and PG signaling to switch fabric controller for graceful traffic rerouting. Use Value: Enables sub-100ms service restoration after card replacement without disrupting adjacent ports. |
| Disk Drive Power Management | Laptop ExpressCard Interface |
Use Scenario: Power sequencing for 2.5" SATA SSDs in enterprise storage enclosures with shared 5V rails. IC Role / Device Role / Timing Role: Limits inrush to ≤20A during spin-up; monitors real-time current via IMON to detect failing drives pre-failure. Use Value: Reduces risk of rail collapse across multi-drive bays and enables firmware-based drive health analytics. | Use Scenario: ExpressCard/54 slot power control in ultrabooks where space and thermal budget are constrained. IC Role / Device Role / Timing Role: Integrates fuse, current sense, and 3.3V LDO in 4mm×4mm LGA - replaces ≥5 discrete components in legacy designs. Use Value: Saves >30mm² PCB area and eliminates calibration overhead for current monitoring in portable systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar hot-swap protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS25982LMLR | Higher RDS(ON) (3.5mΩ), lower max IOUT (15A), no integrated LDO, requires external VBIAS. | Lacks integrated 3.3V LDO and fuse health detection; suited for simpler, lower-current applications where board space permits external biasing. | Select when cost sensitivity outweighs integration benefits and system already provides clean 3.3V bias rail. |
| LT4236IMS#PBF | Wider VIN range (10.8–80V), higher RDS(ON) (6.5mΩ), no IMON output, analog current limit only. | Designed for PoE++ and industrial 48V systems; lacks digital telemetry interface and precision current reporting. | Choose for high-voltage DC distribution where 16V max VIN is insufficient and ±1% IMON is not required. |
Compared with TPS25982LMLR and LT4236IMS#PBF, MP5026GLRT-P uniquely combines 20A capability, ±1% IMON accuracy, integrated 3.3V LDO, and MOSFET health detection in a 4mm×4mm LGA - making it optimal for space-constrained, telemetry-enabled 12V server and networking hot-swap designs requiring zero-calibration current monitoring.
Availability
MP5026GLRT-P is available at Aetrix Electronics and suitable for server backplane protection, network line card hot-swap, and enterprise disk drive power management requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MP5026GLRT-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-efficiency power management ICs, with core expertise in DC-DC conversion, hot-swap controllers, and integrated power stages.
The MP5026 belongs to MPS's Intelli-Fuse product line, engineered specifically for high-reliability hot-swap applications in data centers and telecom infrastructure where precise current limiting, fault telemetry, and compact integration are mandatory.
FAQ
What is the minimum recommended ISET resistor value for 20A current limiting?
The MP5026GLRT-P achieves 20A current limit with a 12kΩ resistor from ISET to ground, per ILIMIT = 0.3V / RISET. Using 12kΩ yields 25A nominal limit, but the device clamps to 20A during start-up and normal operation if configured above that threshold. Lower values increase current limit but reduce resolution and may exceed SOA under fault conditions.
How does the LOADEN blanking time affect system startup behavior?
During LOADEN blanking (set by ENTM capacitor), the device ignores LOADEN de-assertion and remains on if EN/UV is high. This prevents premature shutdown during inrush or transient events. After blanking expires, both EN/UV and LOADEN must be high to maintain conduction - enforcing intentional, sequenced power enable in multi-rail systems.
Can the MP5026GLRT-P operate with a 3.3V input supply?
Yes - the MP5026GLRT-P supports VIN down to 2.7V. At 3.3V input, it delivers up to 20A with RDS(ON) of 2.8mΩ (typical), and all protections including OCP, SCP, and OTP remain fully functional. The internal 3.3V LDO operates independently, maintaining stable gate drive and logic supply regardless of VIN variation.
What is the purpose of the OV pin, and how is its threshold configured?
The OV pin disables the internal MOSFET when pulled high, or sets over-voltage protection threshold via resistor divider from VIN to GND. Threshold is 1.21V at the pin; for example, a 100kΩ–20kΩ divider from 12V sets OVP at 12V × (20k/(100k+20k)) = 2V at VIN. This enables precise, adjustable rail overvoltage cutoff without external comparators.
Does the MP5026GLRT-P require external components for basic hot-swap functionality?
Yes - minimal external components include: ISET resistor (sets current limit), TIMER capacitor (sets insertion delay and OCP timeout), SS capacitor (sets soft-start time), ENTM capacitor (sets LOADEN blanking), and decoupling capacitors on VCC and VIN/VOUT. No external MOSFET, current-sense resistor, or temperature sensor is needed due to full integration.
How is the IMON output calibrated, and what load is required on the IMON pin?
IMON provides 20μA/A output current; a resistor to ground (e.g., 2kΩ) converts this to 40mV/A. A ≥10nF capacitor must be placed in parallel with the resistor to filter noise and stabilize the output. No active calibration is needed - gain error is guaranteed ±1% across temperature and process variation.
What thermal derating applies above 25°C ambient temperature?
With θJA = 30.5°C/W on a 4-layer PCB, the MP5026GLRT-P dissipates up to 4.09W at 25°C. At 70°C ambient, maximum allowable power drops to (150°C − 70°C) / 30.5°C/W = 2.62W. For 20A operation, this corresponds to RDS(ON) ≤ 6.55mΩ - well within the 3.8mΩ max at 125°C junction, confirming safe operation up to TJ = 125°C.
MP5026GLRT-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- *
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
MP5026GLRT-P FAQ
1.How can I place an order for MP5026GLRT-P through Aetrix?
Please submit a Request for Quotation (RFQ) for MP5026GLRT-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP5026GLRT-P reliable?
The price and inventory of MP5026GLRT-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP5026GLRT-P is usually 5 days.
3.What payment methods are accepted for MP5026GLRT-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP5026GLRT-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP5026GLRT-P?
MP5026GLRT-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP5026GLRT-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP5026GLRT-P?
For technical support, including MP5026GLRT-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP5026GLRT-P requirements.
6.How does Aetrix verify that MP5026GLRT-P is sourced from the original manufacturer or authorized distributors?
All MP5026GLRT-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP5026GLRT-P meets industry standards.
7.What is the process for return or replacement of MP5026GLRT-P?
All MP5026GLRT-P units undergo pre-shipment inspection (PSI). If there is an issue with MP5026GLRT-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP5026GLRT-P part is unused and in its original packaging.
Return procedure for MP5026GLRT-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MP5026GLRT-P Tags

-
936106-1
TE Connectivity AMP Connectors

-
2050030-1
TE Connectivity AMP Connectors

-
1897255-2
TE Connectivity AMP Connectors

-
368811-1
TE Connectivity AMP Connectors

-
2296205-6
TE Connectivity AMP Connectors

-
2232228-1
TE Connectivity AMP Connectors

-
2296207-6
TE Connectivity AMP Connectors

-
2296206-8
TE Connectivity AMP Connectors

-
2316671-2
TE Connectivity AMP Connectors

-
2316671-4
TE Connectivity AMP Connectors

-
2316671-1
TE Connectivity AMP Connectors

-
174463-3
TE Connectivity AMP Connectors
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
