Monolithic Power Systems Inc. MP5048AGU-P

Overview

MP5048AGU-P from Monolithic Power Systems is a monolithic hot-swap Intelli-Fuse IC integrating a 60V-rated, 14mΩ R_DS(ON) power MOSFET, current sensing, thermal monitoring, and fault management logic in a single QFN-30 (5mm×5mm) package. It delivers up to 4A continuous output current, limits inrush during live insertion into backplanes, provides programmable over-current protection with 10μs response, and supports parallel operation for higher-current systems in industrial servers and networking equipment.

For engineers reviewing the MP5048AGU-P datasheet, MP5048AGU-P pinout, MP5048AGU-P application, or MP5048AGU-P equivalent, this page details its standalone and controller-coordinated hot-swap operation, integrated current/temperature diagnostics, soft-start timing control via external capacitor, and latch vs. auto-retry fault recovery modes - all critical for robust e-fuse implementation in high-availability power systems.

Technical Context

The MP5048AGU-P implements a gate-controlled power MOSFET with integrated current-sense amplifier (G_CS = 144 µA/A, ±2.5% accuracy), temperature-sense output (V_TEMP), and dual-mode fault handling (latch or auto-retry). Its TIMER pin multiplexes four timing functions - insertion delay, SCP start-up delay, OCP delay, and auto-retry delay - each driven by configurable current sources (2µA, 40µA, or ~500nA) charging an external capacitor.

It operates across 24V–60V input range with internal 4.6V V_CC and 3V LDOs, supports both standalone (ON pulled high) and controller-driven (e.g., MP5920) configurations, and enables precise current limiting via CLREF voltage setting (R_CLREF-based) and real-time IMON monitoring (G_IMON = 144 µA/A, ±1.5% accuracy).

Key Specifications

Pinout & Package

MP5048AGU-P is housed in a thermally enhanced QFN-30 (5mm × 5mm, 0.5mm pitch) package with exposed thermal pad. Pin 1 is located at top-left corner of top view; pins 1–17 and 18–30 are arranged along two long edges. The package supports high-power dissipation (θ_JA = 22.4°C/W on 4-layer PCB) and requires solder paste stencil optimization for thermal pad reliability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar hot-swap e-fuse applications.

Compared with MP5048AGU and MP5920, the MP5048AGU-P offers superior integration for cost-sensitive, space-constrained hot-swap designs where analog configurability and minimal external components are prioritized over digital programmability or moisture-insensitive packaging.

Availability

MP5048AGU-P is available at Aetrix Electronics and suitable for industrial power distribution, server blade hot-swap, and network switch line card applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for MP5048AGU-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, including DC/DC converters, LED drivers, motor drivers, and hot-swap solutions.

The MP5048AGU-P belongs to MPS's Intelli-Fuse product line, designed specifically for robust, integrated e-fuse functionality in high-reliability 24–60V systems - eliminating discrete FETs, sense resistors, and thermal sensors while maintaining precise protection timing.

FAQ

What is the maximum continuous output current rating for MP5048AGU-P?

The MP5048AGU-P is rated for 4A continuous output current at junction temperatures up to +125°C, verified under standard test conditions (VIN = 48V, 4-layer PCB, 2oz copper). At elevated ambient temperatures or reduced airflow, derating applies per the SOA curve - e.g., 3.2A at +85°C ambient with no forced air.

How does the TIMER pin configure multiple protection delays?

The TIMER pin uses three distinct current sources (2µA for insertion delay, 40µA for OCP delay, ~500nA for auto-retry) charging a single external capacitor. Each function triggers when its respective comparator threshold is crossed - e.g., OCP delay begins when V_CS exceeds V_CLREF, causing the 40µA source to charge C_TIMER until VTIMER reaches 0.6V.

Can MP5048AGU-P operate without an external microcontroller or hot-swap controller?

Yes - MP5048AGU-P supports fully standalone operation. Pull the ON pin to VCC (via external resistor), configure CLREF and TIMER capacitors, and it autonomously manages inrush, OCP, SCP, and thermal faults. No external logic or firmware is required for basic hot-swap functionality.

What is the purpose of the IMON and CS pins, and how do they differ?

CS provides a voltage output proportional to sensed current (V_CS = I_OUT × 144 µV/A) used internally for OCP comparison against CLREF. IMON delivers a current output (I_IMON = I_OUT × 144 µA/A) for external measurement - enabling accurate load current monitoring without adding sense-resistor losses or board space.

How is thermal protection implemented, and what happens during over-temperature events?

MP5048AGU-P integrates a die temperature sensor feeding the VTEMP pin and triggering internal thermal shutdown at 153°C. When exceeded, the MOSFET turns off, FAULT asserts low, and VOUT collapses. In auto-retry mode, it waits for die cooling (26°C hysteresis), then restarts soft-start; in latch mode, it remains off until ON is cycled.

Is parallel operation supported, and what layout considerations apply?

Yes - MP5048AGU-P supports parallel operation for >4A loads. Connect all SS and TIMER pins together to synchronize soft-start and fault timing. Ensure matched trace lengths and copper weights for VIN/VOUT paths, and use separate RCS/RIMON resistors per device to maintain independent current limiting and monitoring.

What are the key differences between MP5048AGU-P and MP5048AGU?

MP5048AGU-P and MP5048AGU share identical die and electrical performance. The -P suffix denotes enhanced moisture sensitivity level (MSL 3 vs. MSL 1), dry-pack vacuum packaging, and tape-and-reel format optimized for high-volume SMT assembly with strict humidity control - critical for lead-free reflow processes.