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Monolithic Power Systems Inc. MP5461GC-Z
- Part No.:
- MP5461GC-Z
- Manufacturer:
- Monolithic Power Systems Inc.
- Package:
- 12-UFBGA, CSPBGA
- Datasheet:
-
MP5461GC-Z.pdf
- Description:
- IC REG BUCK BST 3.3V 500MA 12CSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,470
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Product details
Overview
MP5461GC-Z from Monolithic Power Systems is a dual-input, 4-switch integrated buck-boost converter with auto-ORing and power-path selection. It regulates a fixed 3.3V output at up to 500mA from either VIN1 (4.2–5.5V, 22V stress-rated) or VIN2 (2.5–5.5V), using current-mode control at 1.8MHz PWM frequency and entering PFM mode under light load. It serves as the core power management IC in USB-C VCONN-powered devices requiring seamless input source handover and stable 3.3V rail generation.
For engineers reviewing the MP5461GC-Z datasheet, MP5461GC-Z pinout, MP5461GC-Z application, or MP5461GC-Z equivalent, key selection considerations include its dual-input ORing response time (≤2μs reverse block), 300μs EN-to-OR_OUT startup delay, hiccup-mode over-current protection, 5.75V VIN1 OVP threshold, and CSP-12 package thermal resistance (θJA = 110°C/W).
Technical Context
The MP5461GC-Z integrates two independent ORing MOSFET pairs (VIN1→OR_OUT and VIN2→OR_OUT) with soft-start, fast reverse-current blocking, and power-path selection via SEL pin logic. Its buck-boost stage uses a 4-switch topology with synchronous rectification, where SWA/SWB form the buck leg and SWC/SWD the boost leg, controlled by dual error amplifiers (VC-Buck/VC-Boost) and shared current-sense ramp.
Operation spans buck (VIN > VOUT), buck-boost (VIN ≈ VOUT), and boost (VIN < VOUT) regions, with automatic mode transition based on input voltage relative to the 3.3V output. Internal protections include VIN1 OVP shutdown (5.75V), output OVP discharge (1kΩ internal resistor), thermal shutdown (150°C), and hiccup-mode current limiting (2.5A typical peak limit).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.3V ±1.5%; enables direct powering of 3.3V logic without external feedback resistors. |
| Max Output Current | 500mA continuous; supports USB-C VCONN loads and low-power peripherals without derating at TA ≤ 85°C. |
| Switching Frequency | 1.8MHz (typical); allows use of small 1µH inductors and reduces EMI filter size in space-constrained USB-C designs. |
| VIN1 Operating Range | 4.2V to 5.5V; supports standard USB PD 5V rails while tolerating up to 22V transient stress without damage. |
| VIN2 Operating Range | 2.5V to 5.5V; enables backup power from Li-ion batteries or secondary USB sources down to 2.5V. |
| Reverse Block Time | ≤2μs; prevents backfeed during input source switchover, critical for fault-tolerant USB-C cable power routing. |
| Quiescent Current | 200μA (typical); minimizes standby power loss in always-on VCONN applications. |
| Shutdown Current | 1μA (typical); ensures ultra-low leakage when disabled via active-low EN pin. |
Pinout & Package
The MP5461GC-Z is housed in a wafer-level chip-scale package (CSP-12) measuring 1.4mm × 1.8mm, optimized for high-density USB-C connector-side PCB layouts with minimal thermal resistance (θJA = 110°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 IN1 | VIN1 supply input | Primary high-voltage input (4.2–5.5V); supports 22V transient stress but shuts down above 5.75V OVP threshold. |
| A2 OR_OUT | ORing output / buck-boost input | Common node fed by VIN1 or VIN2; requires ≥10μF decoupling capacitor and serves as buck-boost stage input. |
| A3 SW1 | Buck-boost switch node 1 | Connection point for inductor L1; ties to internal SWA (buck high-side) and SWD (boost low-side) FETs. |
| B1 IN2 | VIN2 supply input | Secondary low-voltage input (2.5–5.5V); selected automatically if VIN1 is absent or invalid. |
| B2 AGND | Analog ground reference | Separate ground for VCC decoupling; must connect to VCC capacitor's GND via Kelvin trace to minimize noise coupling. |
| B3 GND | Power ground | Main return path for output current and switching loops; requires wide copper pours and multiple vias for thermal and EMI control. |
| C1 VCC | Internal 5V LDO output | Supplies internal circuitry; decoupled with 1µF ceramic capacitor; powered from VIN1 LDO or VIN2/OR_OUT. |
| C2 EN | Active-low enable input | Drives low or floats to enable; internal 600kΩ pull-down; 300μs delay to OR_OUT startup ensures controlled power sequencing. |
| C3 SW2 | Buck-boost switch node 2 | Second inductor connection; ties to internal SWB (buck low-side) and SWC (boost high-side) FETs. |
| D1 SEL | Power-path selection input | Low/floating selects VIN1; high selects VIN2; internal 600kΩ pull-down enables default VIN1 priority. |
| D2 STATUS | Open-drain path indicator | Open drain when VIN1 selected; pulled low when VIN2 selected; used for host-side power-source monitoring. |
| D3 OUT | Regulated 3.3V output | Delivers up to 500mA; includes OVP discharge (1kΩ) and hiccup-mode current limiting (2.5A peak). |
Key Features
| Feature | Design Value |
|---|---|
| Dual-input auto-ORing with 2μs reverse block | Eliminates need for external ideal diodes or controllers; prevents backfeed during source transitions in USB-C cables. |
| Integrated 4-switch buck-boost with 1.8MHz PWM | Enables single-chip solution for wide-input-range DC-DC conversion without external MOSFETs or complex compensation. |
| Fixed 3.3V output with 1ms soft-start | Ensures monotonic VOUT ramp-up; avoids inrush current issues in downstream USB-C interface ICs and level shifters. |
| VIN1 OVP shutdown at 5.75V | Protects against overvoltage from faulty USB PD sources while maintaining 22V transient robustness per JEDEC standards. |
| Hiccup-mode over-current protection | Shuts down output for ~12ms upon short-circuit, then recovers automatically-reducing thermal stress vs. latch-off schemes. |
| CSP-12 (1.4mm × 1.8mm) package | Minimizes footprint in tight USB-C plug areas; supports high-density routing with 0.4mm pitch and low θJA for passive cooling. |
Applications
| USB-C Cable Power Management | VCONN-Powered USB Device |
|---|---|
Use Scenario: Managing dual power inputs (VBUS and VCONN) in active USB-C cables to sustain 3.3V logic for e-marker and configuration channel ICs. IC Role / Device Role / Timing Role: Dual-input ORing + buck-boost regulator providing uninterrupted 3.3V rail regardless of VBUS/VCONN availability or sequence. Use Value: Enables compliance with USB-C specification for e-marked cables without external diodes or discrete regulators, reducing BOM count by 4+ components. |
Use Scenario: Powering embedded USB-C controller ICs (e.g., TUSB1210, CCGx) in dock adapters or dongles where VCONN supplies primary 3.3V logic power. IC Role / Device Role / Timing Role: Primary 3.3V regulator with automatic fallback to alternate input (e.g., VBUS or battery) if VCONN drops below UVLO. Use Value: Guarantees continuous operation during hot-plug events or VCONN interruptions, eliminating reset conditions in USB enumeration sequences. |
| USB-C Docking Station Auxiliary Rail | Industrial USB-C Peripheral Hub |
Use Scenario: Generating isolated 3.3V auxiliary power for USB-C CC logic, sideband use (SBU) switches, and LED indicators in multi-port docking stations. IC Role / Device Role / Timing Role: Secondary regulated rail generator with SEL-pin controllable input priority, supporting dynamic power routing between upstream and downstream ports. Use Value: Allows firmware-controlled power source selection (e.g., prefer VBUS over battery) without hardware redesign, improving system flexibility. |
Use Scenario: Providing robust 3.3V power to USB-C hub controllers and PHYs in industrial environments with fluctuating input voltages (e.g., 2.5–5.5V battery or PoE-derived rails). IC Role / Device Role / Timing Role: Wide-input buck-boost regulator with UVLO hysteresis (400mV for VIN1, 150mV for VIN2) ensuring clean start-up across temperature and aging. Use Value: Maintains regulation down to 2.5V input-critical for brownout resilience in battery-backed industrial gateways and edge nodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-input buck-boost regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS63802DSKR | Single-input (2.5–5.5V), no integrated ORing; requires external ideal diodes for dual-source support. | Lacks auto-ORing and VIN1 22V stress rating; suitable only when both inputs share same voltage domain. | Select only if dual-input ORing is implemented externally and VIN1 stress immunity is unnecessary. |
| LT8337EMSE#TRPBF | Single-input (2.8–42V), no ORing function; uses external MOSFETs; higher quiescent current (35μA vs. 200μA). | Designed for high-VIN industrial converters-not optimized for USB-C space or VCONN timing constraints. | Prefer when input exceeds 5.5V continuously and board area permits discrete FET layout. |
Compared with TPS63802DSKR and LT8337EMSE#TRPBF, the MP5461GC-Z uniquely integrates dual-input ORing, 22V VIN1 stress tolerance, and USB-C-optimized 300μs EN-to-OR_OUT delay-making it the only single-chip solution for compliant, space-constrained VCONN power management.
Availability
MP5461GC-Z is available at Aetrix Electronics and suitable for USB-C cable manufacturing, VCONN-powered device design, and industrial USB-C peripheral development requiring stable component supply, full lifecycle traceability, and RoHS-compliant packaging.
Supply support for MP5461GC-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with over 20 years of expertise in DC-DC conversion, motor drivers, and LED lighting solutions.
The MP5461 belongs to MPS's USB-C and portable power management product line, designed specifically to simplify power architecture in next-generation USB-C cables, docks, and accessories by integrating ORing, buck-boost regulation, and protection in one CSP package.
FAQ
What is the maximum allowable input voltage stress on VIN1?
The MP5461GC-Z supports up to 22V transient voltage stress on VIN1 without damage, but functional operation ceases above 5.75V due to internal OVP shutdown. This allows safe handling of USB PD voltage spikes while maintaining regulation within 4.2–5.5V nominal range.
How does the STATUS pin indicate power-source selection?
STATUS is an open-drain output: it remains floating (high-impedance) when VIN1 is selected or both inputs are invalid; it pulls low (≤50mV at 1mA sink) when VIN2 is actively supplying OR_OUT. This matches the truth table in the datasheet and enables simple GPIO monitoring.
Can the MP5461GC-Z operate with only VIN2 connected?
Yes. When VIN1 is absent or below UVLO (3.9V typ.), the device automatically selects VIN2 as the ORing source and powers the buck-boost stage from OR_OUT. No external control is needed-the SEL pin defaults to VIN1 selection but yields to available input.
What is the purpose of the 300μs EN-to-OR_OUT startup delay?
This fixed delay ensures that the ORing stage fully stabilizes before enabling the buck-boost converter, preventing output voltage overshoot or instability during power-up. It is inherent to the internal sequencing logic and cannot be adjusted externally.
Does the MP5461GC-Z require external compensation components?
No. The MP5461GC-Z uses internal compensation for both ORing and buck-boost control loops. Only external passive components-input/output capacitors, inductor, and optional SEL/STATUS pull-ups-are required per the typical application schematic.
How does hiccup-mode over-current protection behave during sustained overload?
Upon detecting output current exceeding 2.5A (typical), the device stops switching, discharges VOUT via a 1kΩ internal resistor, waits ~12ms, then attempts soft restart. If overload persists, it repeats hiccup cycles indefinitely until fault clears-preventing thermal runaway.
Is the CSP-12 package compatible with standard reflow profiles?
Yes. The MP5461GC-Z CSP-12 package is qualified for IPC/JEDEC J-STD-020 moisture sensitivity level 1 and supports standard lead-free reflow profiles (peak 260°C). Its 0.4mm pitch requires fine-pitch stencil design and controlled solder paste volume.
MP5461GC-Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- -
- Package/Case:
- 12-UFBGA, CSPBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Fixed
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 4.2V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.3V
- Voltage - Output (Max):
- -
- Current - Output:
- 500mA
- Frequency - Switching:
- 1.8MHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-CSP (1.4x1.8)
MP5461GC-Z FAQ
1.How can I place an order for MP5461GC-Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MP5461GC-Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP5461GC-Z reliable?
The price and inventory of MP5461GC-Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP5461GC-Z is usually 5 days.
3.What payment methods are accepted for MP5461GC-Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP5461GC-Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP5461GC-Z?
MP5461GC-Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP5461GC-Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP5461GC-Z?
For technical support, including MP5461GC-Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP5461GC-Z requirements.
6.How does Aetrix verify that MP5461GC-Z is sourced from the original manufacturer or authorized distributors?
All MP5461GC-Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP5461GC-Z meets industry standards.
7.What is the process for return or replacement of MP5461GC-Z?
All MP5461GC-Z units undergo pre-shipment inspection (PSI). If there is an issue with MP5461GC-Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP5461GC-Z part is unused and in its original packaging.
Return procedure for MP5461GC-Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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