Monolithic Power Systems Inc. MP5981GLU-Z
- Part No.:
- MP5981GLU-Z
- Manufacturer:
- Monolithic Power Systems Inc.
- Category:
- Current Regulation/Management
- Package:
- 32-VFQFN Exposed Pad
- Datasheet:
-
MP5981GLU-Z.pdf
- Description:
- IC ELECTRONIC FUSE 32LGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,684
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MP5981GLU-Z from Monolithic Power Systems is a monolithic hot-swap Intelli-Fuse IC integrating a 1.1mΩ RDS(ON) high-side MOSFET, current mirror, on-die temperature sensor, and fault reporting logic. It delivers up to 50A continuous current at room temperature (60A with airflow), operates from 4V–16V input, and functions in standalone or controller-coordinated hot-swap systems for live backplane insertion. Used in server power distribution units to limit inrush and prevent backplane voltage droop during PC card insertion.
For engineers reviewing the MP5981GLU-Z datasheet, MP5981GLU-Z pinout, MP5981GLU-Z application, or MP5981GLU-Z equivalent, key selection criteria include its integrated current/temperature sensing, programmable over-current threshold via CLREF, latch/hiccup mode selection, GOK fault signaling, and parallel operation capability for >50A load management.
Technical Context
The MP5981 implements a closed-loop gate control architecture that regulates the integrated MOSFET's VGS to enforce current limiting during start-up and steady-state operation. Its current-limit reference (CLREF) is dynamically clamped-low (≈635mV) when VOUT < 80% of VIN, rising to 1.6V once VOUT ≥ 80% of VIN-enabling controlled soft-start and full-power transition.
It features dual protection paths: a 14µs response for normal over-current events using CS/CLREF comparison, and a 200ns fast-turn-off circuit triggered at 100A short-circuit current. Fault reporting occurs via open-drain GOK (latched or hiccup-mode) and D_OC outputs, while IMON and VTEMP provide real-time analog monitoring signals for system-level supervision.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4V to 16V DC - supports standard 12V server rails and accommodates brown-in/out margins without external regulation. |
| Continuous Output Current | 50A at TA = 25°C, 60A with airflow - enables single-device deployment in mid-power server slots without derating. |
| RDS(ON) | 1.1mΩ (typ.) at TJ = 25°C - minimizes conduction loss (≤3W at 50A), reducing thermal stress and heatsink requirements. |
| Short-Circuit Response Time | 200ns - prevents catastrophic failure during bus faults by disabling the FET before energy dissipation exceeds SOA limits. |
| Current Sense Accuracy | ±3% gain error (IMON/CS), ±3μA offset - eliminates need for external sense resistor while maintaining ±1.5A absolute current measurement accuracy at 50A. |
| Thermal Shutdown Threshold | 143°C (TJ) - protects die integrity under sustained overload or poor PCB thermal design; triggers GOK latching. |
| Soft-Start Timing Control | Programmable via SS pin capacitor - allows precise ramp rate tuning (e.g., 100ms–270ms) to match load capacitance and avoid inrush-induced tripping. |
Pinout & Package
LGA-32 (5mm × 5mm) package with exposed thermal pad; optimized for high-current PCB routing and thermal dissipation in dense server power modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 9–16 VIN | High-side input power rail | Accepts 4V–16V supply; all pins paralleled internally to reduce impedance and support 50A+ current flow. |
| 1,2,25–32 VOUT | Switched output node | Connected directly to MOSFET source; forms low-impedance path to load; multiple pins reduce trace resistance and inductance. |
| 4 ON/PD | FET enable / pull-down control | Logic-controlled gate drive: 1.4–1.54V turn-on threshold; internal 500Ω PD resistor enables controlled VOUT discharge after 2.1ms delay. |
| 5 GOK | Fault reporting output | Open-drain latch signal asserting low on over-current, short-circuit, over-temperature, or FET health fault; requires external pull-up. |
| 19 SS | Soft-start timing input | Capacitor-connected node controlling slew rate of VOUT rise; sets maximum 270ms start-up window before auto-shutdown. |
| 22 IMON | Analog current monitor | 10μA/A proportional output (±3% gain); feeds MCU ADC for real-time load monitoring without shunt resistor. |
| 18 VTEMP | Junction temperature sense | 8.7mV/°C linear output (0°C–140°C range); enables thermal margining and predictive shutdown without external sensor. |
| 23 CS | Current-sense feedback | Connects to external RCS resistor; voltage compared against CLREF to regulate FET gate and enforce programmable current limit. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated current mirror + temperature sensor | Eliminates external 5W+ current-sense resistor and NTC thermistor, reducing BOM count and board area by ≥3 components. |
| Programmable over-current threshold | Set via CLREF voltage (0.3V–1.6V) and RCS resistor; enables precise trip point tuning (e.g., 45A nominal, 55A surge) without hardware change. |
| Latch vs. hiccup mode selection | MODE pin pulled to GND selects hiccup (560ms retry interval); floating defaults to latch - supports fail-safe or self-recovering system policies. |
| Parallel operation with active current sharing | All devices share gate drive during soft-start; no external balancer required - scales to 150A+ using three MP5981s with matched RCS/RIMON. |
| Intelli-Fuse health reporting | GOK asserts on drain-source short detection (VOUT < 85% VIN at startup) - identifies degraded FETs before catastrophic failure in redundant systems. |
Applications
| Server Blade Power Distribution | Disk Drive Hot-Swap Module |
|---|---|
|
Use Scenario: Inserting a 2.5" NVMe SSD into a powered-backplane storage shelf. IC Role / Device Role / Timing Role: High-side eFuse enforcing inrush current limit during connector mating; monitors steady-state current and junction temperature. Use Value: Prevents >100mV backplane sag during insertion, avoids upstream PSU overload trips, and reports thermal margin to BMC via IMON/VTEMP. |
Use Scenario: Hot-plugging a SATA HDD into a RAID controller chassis with live 12V rail. IC Role / Device Role / Timing Role: Standalone Intelli-Fuse providing soft-start, SCP, and OTP protection without external controller coordination. Use Value: Enables <100ms safe insertion window with automatic recovery (hiccup mode) after transient overloads, eliminating manual reset. |
| PC Card Power Management | Networking Line Card Protection |
|
Use Scenario: Adding a PCIe accelerator card to a carrier board with shared 12V supply. IC Role / Device Role / Timing Role: Controlled by upstream hot-swap controller (e.g., MP5920); receives ON/PD command and reports GOK status. Use Value: Provides per-slot current limiting and fault isolation, enabling centralized power sequencing and telemetry across 16-slot chassis. |
Use Scenario: Protecting 48V-to-12V intermediate bus converters feeding multiple SFP+ ports. IC Role / Device Role / Timing Role: Parallel-configured MP5981s delivering 120A total with matched current sharing and unified GOK fault aggregation. Use Value: Achieves 99.999% uptime via redundant eFuse paths; single-point fault reporting simplifies network management interface integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar hot-swap eFuse applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TI TPS2491RGER | 40V max input, 40A continuous, external sense resistor required, no integrated temp sensing | Lacks on-die thermal monitoring and current mirror; requires additional components for same functionality | Select when higher input voltage (up to 40V) is needed and board space permits external sensing. |
| ADI LTC4215IMS#PBF | 3.3V–16.5V input, 30A max, I²C interface, no integrated MOSFET - requires external FET | Relies on external discrete MOSFET and sense resistor; adds layout complexity and thermal coupling uncertainty | Prefer for designs requiring digital configuration and telemetry via I²C, not analog simplicity. |
Compared with TPS2491RGER and LTC4215IMS#PBF, MP5981GLU-Z delivers higher current density (50A), eliminates external sensing components, and integrates temperature-aware protection - reducing bill-of-materials cost and improving reliability in space-constrained server and telecom power modules.
Availability
MP5981GLU-Z is available at Aetrix Electronics and suitable for server blade power distribution, disk drive hot-swap modules, PC card power management, and networking line card protection requiring stable component supply and long-term lifecycle support.
Supply support for MP5981GLU-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-efficiency power management ICs for computing, cloud infrastructure, and industrial applications.
The MP5981 belongs to MPS's Intelli-Fuse product line, designed specifically for intelligent, self-contained hot-swap protection in high-density, high-reliability power systems where minimal external components and robust fault handling are critical.
FAQ
What is the maximum continuous current rating for MP5981GLU-Z under natural convection?
The MP5981GLU-Z delivers 50A continuous current at ambient temperature (TA = 25°C) with no forced airflow. This rating assumes proper PCB copper area (≥4 oz, 2-layer thermal pad), and operation within the recommended junction temperature range (–40°C to +125°C). Derating applies above 60°C ambient.
How does the MP5981GLU-Z implement short-circuit protection without external components?
It uses an internal fast-turn-off circuit triggered when sensed current reaches 100A, independent of the CLREF-based current limit loop. This path responds in 200ns by directly disabling the gate driver, bypassing the slower analog control loop - ensuring protection even during sub-microsecond fault transients.
Can MP5981GLU-Z operate without an external hot-swap controller?
Yes. The MP5981GLU-Z supports standalone operation: connect ON/PD to VDD3 for automatic turn-on, set CLREF and RCS for desired current limit, and use SS capacitor for soft-start timing. No external controller is required for basic hot-swap functionality.
What is the function of the VTEMP pin, and how is it calibrated?
VTEMP provides a linear 8.7mV/°C analog output referenced to GND, covering 0°C to 140°C. At 25°C, it outputs ~370mV. Calibration is factory-trimmed; no user adjustment is needed. It connects directly to an ADC input for real-time die temperature monitoring and thermal throttling decisions.
How does parallel operation ensure balanced current sharing between multiple MP5981GLU-Z devices?
During soft-start, all paralleled MP5981s actively regulate their gate voltages to maintain identical VCS levels across matched RCS resistors. This forces equal current division from turn-on through steady state, verified to ±5% imbalance at 50A per device - no external current-balancing circuitry required.
What fault conditions cause the GOK pin to assert, and is it recoverable?
GOK asserts low on over-current (exceeding CLREF-defined limit for >180µs), short-circuit (100A detection), over-temperature (143°C junction), or FET drain-source short. Recovery depends on MODE pin: latch mode requires power cycle; hiccup mode automatically retries after ~560ms if fault clears.
Is the 3.0V LDO (VDD3) output capable of powering external circuitry?
Yes. VDD3 supplies up to 14mA at 3.05V (±145mV) and can power external logic, level shifters, or small sensors. A 1µF ceramic capacitor must be placed adjacent to VDD3 and GND. For lower dropout, an external 3.3V supply may be applied to VDD3 to bypass the internal regulator.
MP5981GLU-Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Monolithic Power Systems Inc.
- Series:
- -
- Package/Case:
- 32-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Electronic Fuse
- Sensing Method:
- High-Side
- Accuracy:
- -
- Voltage - Input:
- 4V ~ 16V
- Current - Output:
- 50A
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-LGA (5x5)
MP5981GLU-Z FAQ
1.How can I place an order for MP5981GLU-Z through Aetrix?
Please submit a Request for Quotation (RFQ) for MP5981GLU-Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MP5981GLU-Z reliable?
The price and inventory of MP5981GLU-Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP5981GLU-Z is usually 5 days.
3.What payment methods are accepted for MP5981GLU-Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP5981GLU-Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MP5981GLU-Z?
MP5981GLU-Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MP5981GLU-Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MP5981GLU-Z?
For technical support, including MP5981GLU-Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP5981GLU-Z requirements.
6.How does Aetrix verify that MP5981GLU-Z is sourced from the original manufacturer or authorized distributors?
All MP5981GLU-Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP5981GLU-Z meets industry standards.
7.What is the process for return or replacement of MP5981GLU-Z?
All MP5981GLU-Z units undergo pre-shipment inspection (PSI). If there is an issue with MP5981GLU-Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MP5981GLU-Z part is unused and in its original packaging.
Return procedure for MP5981GLU-Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MP5981GLU-Z Tags
.jpg)
-
PSSI2021SAY,115
Nexperia USA Inc.

-
BCR401RE6327HTSA1
Infineon Technologies

-
INA199B2DCKR
Texas Instruments

-
INA199A1DCKR
Texas Instruments

-
INA199B1DCKR
Texas Instruments

-
NSI45015WT1G
onsemi

-
NSI45020T1G
onsemi

-
NSI45030AT1G
onsemi

-
NSI45025AT1G
onsemi

-
NSI45020AT1G
onsemi

-
NSI50010YT1G
onsemi

-
LM334Z/NOPB
Texas Instruments
Tech Hub
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

