Monolithic Power Systems Inc. MP6211DN-LF-Z

Overview

MP6211DN-LF-Z from Monolithic Power Systems is a single-channel, active-high, current-limited power distribution switch with 1A continuous load capability, 90mΩ R_DS(on), and integrated thermal shutdown, UVLO, and reverse-current blocking. It operates from 2.7V to 5.5V input and delivers precise 1.5A short-circuit trip current in USB VBUS power-switching applications.

For engineers reviewing the MP6211DN-LF-Z datasheet, MP6211DN-LF-Z pinout, MP6211DN-LF-Z application, or MP6211DN-LF-Z equivalent, key selection criteria include guaranteed 1A continuous current rating, 8ms FLAG deglitch timing, SOIC8E exposed-pad thermal performance, and active-high enable logic compatibility with host microcontroller GPIOs.

Technical Context

The MP6211DN-LF-Z integrates a low-R_DS(on) N-channel MOSFET with precision current-sense amplifier and analog trip comparator to enforce 1.5A typical short-circuit current limit. Its charge-pump gate driver ensures full enhancement across the 2.7–5.5V input range.

Thermal protection activates at 140°C junction temperature with 20°C hysteresis, while under-voltage lockout engages below 1.95V (rising edge) to prevent erratic switching. The open-drain FLAG pin reports overcurrent after an 8ms deglitch window-immune to power-up transients.

Key Specifications

Pinout & Package

MP6211DN-LF-Z uses an 8-pin SOIC package with exposed thermal pad (SOIC8E), requiring solder connection of the pad to a dedicated GND plane for θ_JA = 50°C/W thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar current-limited power distribution switch applications.

Compared with TPS22965DRLR and NIS5132MN, MP6211DN-LF-Z uniquely combines 1A current rating, integrated thermal shutdown, reverse-current blocking, and 8ms deglitch-enabling robust, self-protecting USB and portable power designs without supplemental components.

Availability

MP6211DN-LF-Z is available at Aetrix Electronics and suitable for USB power distribution, smartphone peripheral control, and notebook PC ExpressCard slot protection requiring stable component supply across industrial temperature ranges (–40°C to +85°C).

Supply support for MP6211DN-LF-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance analog and power ICs, with design centers across Asia and North America.

The MP6211 series belongs to MPS's load switch product line, engineered specifically for reliable, low-footprint power sequencing and fault protection in space-constrained portable and USB-compliant electronics.

FAQ

What is the function of the NC pin (Pin 8) on MP6211DN-LF-Z?

Pin 8 is a no-connect terminal with no internal bond wire or silicon connection. It must remain unconnected-neither routed nor soldered-to avoid mechanical stress or unintended parasitic coupling. This pin exists solely for package symmetry and thermal balance in the SOIC8E mold.

Does MP6211DN-LF-Z support reverse-current blocking when disabled?

Yes. When EN is low, the internal N-channel MOSFET body diode is reverse-biased, and the control circuit actively disables conduction path from OUT to IN. Measured reverse leakage is ≤0.2μA at V_OUT = 5.5V and V_IN = 0V, ensuring true bidirectional isolation.

How does the FLAG pin behave during thermal shutdown versus overcurrent events?

The FLAG pin asserts low for both overcurrent and thermal shutdown, but with different timing behavior: overcurrent triggers FLAG after 8ms deglitch, while thermal shutdown asserts FLAG immediately-without deglitch filtering-ensuring rapid fault reporting during die overheating.

Can MP6211DN-LF-Z operate reliably at 2.7V input with 1A load?

Yes. At V_IN = 2.7V, R_DS(on) remains ≤130mΩ (–40°C to +85°C), resulting in ≤130mV dropout at 1A. The device maintains full current-limit functionality and UVLO immunity down to 2.7V, validated across temperature and process corners.

Is the exposed pad electrically connected to GND internally?

Yes. Pin 1 (exposed pad) is internally bonded to the substrate GND plane. It must be soldered to a PCB GND copper area ≥1 cm² and thermally vias (≥4×0.3mm) to achieve rated θ_JA = 50°C/W and sustain 2.5W power dissipation at +25°C ambient.

What is the minimum recommended input capacitance for stable operation?

A minimum 10μF X5R/X7R ceramic capacitor placed between IN and GND, within 5mm of pins 2/3, is required to suppress input ringing and ensure robust short-circuit transient immunity. Larger values (e.g., 22μF) further improve stability under heavy dynamic loads.

Does MP6211DN-LF-Z require external components for basic operation?

No external components are required for core switching functionality. Only two passive elements are recommended: a 10μF input ceramic capacitor and a pull-up resistor (10kΩ) on FLAG for open-drain interfacing-both specified in the datasheet for guaranteed performance.