Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Monolithic Power Systems Inc. MP6545GF-Z

Part No.:
MP6545GF-Z
Manufacturer:
Monolithic Power Systems Inc.
Category:
Motor Drivers, Controllers
Package:
28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Datasheet:
AetrixMP6545GF-Z.pdf
Description:
45V, 2.5A, SIMPLE THREE-PHASE PO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,500

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MP6545GF-Z from Monolithic Power Systems is a three-phase half-bridge power stage IC designed for brushless DC motor drive applications. It integrates six N-channel MOSFETs (three high-side, three low-side), operates from 4.5V to 45V input, delivers up to 2.5A per phase, features 150mΩ typical RDS(ON) per FET, and includes OCP, OVP, UVLO, and thermal shutdown with open-drain nFAULT reporting. Used in laser printer paper feed systems requiring compact, thermally robust motor control.

For engineers reviewing the MP6545GF-Z datasheet, MP6545GF-Z pinout, MP6545GF-Z application, or MP6545GF-Z equivalent, this page provides verified technical context, package-specific pin mapping, real-world timing behavior, protection threshold values, and validated alternative options for BLDC power stage selection.

Technical Context

The MP6545GF-Z implements independent three-channel half-bridge gate driving with separate HSx/LSx logic inputs per phase, enabling direct microcontroller PWM control without external level-shifting. Its internal charge pump (VCP) generates >VIN+5V for high-side gate drive, while VREG supplies 5V for low-side logic and drivers.

Protection is fully autonomous: over-current detection triggers within 1µs deglitch window on both sourcing and sinking paths; UVLO activates at 4.5V rising threshold with 300mV hysteresis; OVP trips at 45V–48V; thermal shutdown engages at 165°C with 15°C hysteresis. Fault state is latched until nRESET assertion or power cycle.

Key Specifications

Parameter Value and Actual Design Meaning
VIN Range 4.5V to 45V - Supports 12V, 24V, and 36V industrial bus rails without external regulators.
IOUT per Phase 2.5A continuous - Validated at TA = 25°C with standard PCB layout; derates with temperature and copper area.
RDS(ON) HS/LS 135–170mΩ / 150–185mΩ - Enables <1.2W conduction loss per FET at 2.5A, critical for thermal management in TSSOP-28EP.
OCP Threshold 3A–4.5A (sinking/sourcing) - Configurable via external sense resistor; protects against winding short or stall conditions.
UVLO/OVP 4.5V rising / 45V–48V - Prevents operation outside safe supply range; hysteresis avoids chatter near thresholds.
Dead Time 80ns - Hardware-enforced minimum off-time prevents shoot-through during HS/LS switching transitions.
nFAULT Output Open-drain, logic-low active - Requires external pull-up; signals OCP, OVP, or thermal fault to host MCU within 1µs.

Pinout & Package

TSSOP-28EP package (9.7mm × 4.4mm × 1.2mm max height) with exposed thermal pad; 0.65mm pitch; JEDEC MO-153 compliant; MSL Level 2a.

Pin/Terminal Circuit Role Design Meaning
VIN (Pins 1,8) Main power input Accepts 4.5–45V; requires dual 100nF X7R ceramic bypass capacitors placed adjacent to each pin.
OUT1–OUT3 (Pins 2,4,5) Half-bridge output terminals Drive motor windings in star/delta configuration; support synchronous rectification via body diode control.
PGND (Pins 3,6) Power ground return High-current return path for all three half-bridges; must connect directly to thermal pad and large copper pour.
GND (Pins 11,24) Signal ground reference Reference for logic inputs, VREG, and internal comparators; isolated from PGND to minimize noise coupling.
HS1–HS3 / LS1–LS3 (Pins 16–21) Independent gate control inputs CMOS-compatible logic inputs with internal 100kΩ pull-down; define H/L/Hi-Z states per Table 2 in datasheet.
nSLEEP / nRESET (Pins 14,13) System control inputs Active-low sleep entry (disables charge pump) and reset (clears latched faults); both have internal pull-downs.
nFAULT (Pin 15) Fault status indicator Open-drain output pulled low during OCP/OVP/OTP; requires external pull-up to host supply (e.g., 3.3V or 5V).
VREG (Pin 12) Internal 5V regulator output Powers LS gate drivers and logic; requires 1µF X7R ceramic capacitor to GND, placed within 2mm of pin.
VCP / CPA / CPB (Pins 27,25,26) Charge pump network VCP supplies >VIN+5V for HS gate drive; CPA/CPB require 100nF X7R capacitor rated ≥VIN; VCP needs 1µF to VIN.

Key Features

Feature Design Value
Three independent half-bridge channels Enables full 6-step commutation control of BLDC motors using discrete PWM signals-no integrated controller required.
Automatic synchronous rectification Reduces body-diode conduction losses by turning on LS-FET when VOUTx < GND or HS-FET when VOUTx > VIN during flyback.
Integrated charge pump and LDO VCP >VIN+5V ensures robust high-side gate drive across full VIN range; VREG provides stable 5V for LS logic without external regulator.
Comprehensive fault protection OCP, OVP, UVLO, and thermal shutdown are autonomous and latched; nFAULT provides single-wire system-level fault reporting.
TSSOP-28EP thermal design Exposed thermal pad + recommended vias enables 3.9W power dissipation at TA=25°C-critical for sustained 2.5A operation.

Applications

Laser Printer Paper Feed System Industrial Textile Spindle Drive

Use Scenario: Precise bidirectional control of paper transport rollers under variable load and speed profiles.

IC Role / Device Role / Timing Role: Three-phase power stage converting MCU-generated 6-step PWM into motor winding currents; dead time prevents shoot-through during commutation.

Use Value: 2.5A per phase supports rapid acceleration of high-inertia rollers; thermal shutdown prevents damage during paper jams.

Use Scenario: Closed-loop speed control of textile machine spindles operating continuously at 3,000–12,000 RPM.

IC Role / Device Role / Timing Role: High-efficiency power delivery stage accepting field-oriented control (FOC) outputs; low RDS(ON) minimizes heat generation at 24V/2A steady-state.

Use Value: Synchronous rectification reduces conduction loss by ~35% vs. passive diode freewheeling, extending spindle motor life.

Small-Diameter BLDC Fan Module Automated Office Copier Drum Motor

Use Scenario: Compact, low-noise cooling fan for embedded computing modules with space-constrained PCB layout.

IC Role / Device Role / Timing Role: Integrated half-bridge driver replacing discrete MOSFETs and gate drivers; 80ns hardware dead time ensures reliability at 20kHz PWM.

Use Value: QFN-28 and TSSOP-28EP packages allow footprint reuse; nSLEEP reduces quiescent current to 0.9µA for standby mode.

Use Scenario: High-torque, low-speed drum rotation in copiers requiring precise angular positioning and torque consistency.

IC Role / Device Role / Timing Role: Power stage executing trapezoidal commutation; nFAULT reports winding shorts or overtemperature before mechanical failure occurs.

Use Value: 45V absolute max rating accommodates 36V bus transients; OCP trip at 3A protects against drum jam-induced current surge.

Equivalent & Alternatives

The following parts are listed as comparable options for similar three-phase half-bridge power stage applications.

Alternative Part Technical Difference Application Difference Selection Advice
MP6550GF-Z Higher 5A per phase rating; 80mΩ RDS(ON); same pinout but larger thermal pad requirement. Better suited for 48V systems with peak loads >3A; requires enhanced PCB copper and thermal vias. Select when 2.5A margin is insufficient and board layout allows larger thermal relief.
STSPIN32F0A Integrated 32-bit ARM Cortex-M0 MCU + gate drivers; no external microcontroller needed; lower voltage (max 45V) and current (1.4A). Reduces BOM count for simple BLDC control but lacks MP6545's standalone flexibility and higher current capability. Choose for cost-sensitive, low-complexity designs where firmware integration outweighs raw power density.

Compared with MP6545GF-Z, MP6550GF-Z offers higher current headroom at the cost of increased thermal demand, while STSPIN32F0A trades external control flexibility for integrated intelligence and smaller footprint-making MP6545GF-Z optimal for high-reliability, externally controlled 2.5A BLDC stages.

Availability

MP6545GF-Z is available at Aetrix Electronics and suitable for laser printer paper feed systems, industrial textile spindle drives, compact BLDC fan modules, and automated office copier drum motors requiring stable component supply, consistent tape-and-reel packaging (2500/reel), and long-term lifecycle assurance.

Supply support for MP6545GF-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, founded in 1997 and headquartered in Kirkland, Washington.

The MP6545 belongs to MPS's Simple Three-Phase Power Stage product line, engineered for compact, thermally efficient BLDC motor drive in space- and reliability-constrained industrial and office equipment.

FAQ

What is the maximum allowable continuous output current per phase for MP6545GF-Z at 60°C ambient?

At TA = 60°C, the maximum continuous output current per phase is approximately 2.1A. This derating is based on the TSSOP-28EP package's θJA = 32°C/W and thermal shutdown threshold of 165°C: PD(MAX) = (165 – 60)/32 ≈ 3.3W; with RDS(ON)_LS ≈ 165mΩ and RDS(ON)_HS ≈ 152mΩ, IOUT is limited by conduction loss (I²×R) plus switching loss. Full 2.5A requires TA ≤ 40°C with optimized PCB copper.

Can MP6545GF-Z be used with 3.3V logic-level microcontrollers without level shifters?

Yes. The HSx/LSx inputs accept VIH ≥ 2.0V and VIL ≤ 0.8V, making them compatible with standard 3.3V CMOS outputs. Each input has an internal 100kΩ pull-down resistor, ensuring defined low state when not driven-no external level shifting is required for GPIO-controlled commutation.

How does automatic synchronous rectification improve efficiency in BLDC applications?

During inductive flyback, the MP6545GF-Z turns on the appropriate FET (LS-FET if VOUTx < GND, HS-FET if VOUTx > VIN) instead of relying on lossy body diodes. With typical body diode VF ≈ 1.1V, synchronous rectification reduces conduction loss by >60% at 2A, lowering junction temperature and improving overall system efficiency by 3–5% in continuous operation.

What external capacitors are mandatory for stable operation of MP6545GF-Z?

Four capacitors are mandatory: two 100nF X7R ceramics on VIN pins (one per pin), one 100nF X7R between CPA and CPB, one 1µF X7R from VCP to VIN, and one 1µF X7R from VREG to GND. All must be placed within 2mm of respective pins; bulk electrolytic (e.g., 100µF) is recommended upstream for transient suppression.

Is nFAULT asserted during startup or only during fault conditions?

nFAULT is asserted only during active fault conditions (OCP, OVP, OTP) and remains latched until nRESET is pulsed low or VIN is cycled. It is not asserted during normal startup, sleep entry/exit, or reset recovery-allowing clean system initialization without false fault interrupts.

Does MP6545GF-Z support 100% duty cycle operation on any output channel?

No. Due to charge pump dependency for high-side drive, MP6545GF-Z cannot sustain 100% duty cycle on HS-FETs. Maximum practical HS duty cycle is ~95% at 24V; beyond that, VCP voltage droops, causing HS-FET turn-off. For 100% duty, use LS-FET only (e.g., low-side switch mode) or external bootstrap circuitry.

What is the recommended PCB layout practice for thermal management of MP6545GF-Z?

Maximize copper area on the exposed thermal pad (Pin 28), connect it directly to inner-layer ground planes using ≥9 thermal vias (0.3mm diameter, 0.65mm pitch), extend copper pours under OUT1–OUT3 and PGND pins, and avoid routing signal traces under the IC. Per Figure 3 in the datasheet, ≥200mm² total copper area is required for 2.5A continuous operation at TA = 60°C.

MP6545GF-Z Specifications

Product attributes
Attribute value
Manufacturer:
Monolithic Power Systems Inc.
Series:
-
Package/Case:
28-TSSOP (0.173", 4.40mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Motor Type - Stepper:
Multiphase
Motor Type - AC, DC:
Brushed DC
Function:
Driver - Fully Integrated, Control and Power Stage
Output Configuration:
Half Bridge (3)
Interface:
Logic
Technology:
Power MOSFET
Step Resolution:
-
Applications:
General Purpose
Current - Output:
2.5A
Voltage - Supply:
4.5V ~ 45V
Voltage - Load:
4.5V ~ 45V
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP-EP

MP6545GF-Z FAQ

1.How can I place an order for MP6545GF-Z through Aetrix?

Please submit a Request for Quotation (RFQ) for MP6545GF-Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MP6545GF-Z reliable?

The price and inventory of MP6545GF-Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MP6545GF-Z is usually 5 days.

3.What payment methods are accepted for MP6545GF-Z?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MP6545GF-Z transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MP6545GF-Z?

MP6545GF-Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MP6545GF-Z order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MP6545GF-Z?

For technical support, including MP6545GF-Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MP6545GF-Z requirements.

6.How does Aetrix verify that MP6545GF-Z is sourced from the original manufacturer or authorized distributors?

All MP6545GF-Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MP6545GF-Z meets industry standards.

7.What is the process for return or replacement of MP6545GF-Z?

All MP6545GF-Z units undergo pre-shipment inspection (PSI). If there is an issue with MP6545GF-Z, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MP6545GF-Z part is unused and in its original packaging.

Return procedure for MP6545GF-Z:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MP6545GF-Z Tags

  • MP6545GF-Z
  • MP6545GF-Z PDF
  • MP6545GF-Z Datasheet
  • MP6545GF-Z Specifications
  • MP6545GF-Z Images
  • Monolithic Power Systems Inc.
  • Monolithic Power Systems Inc. MP6545GF-Z
  • Buy MP6545GF-Z
  • MP6545GF-Z Price
  • MP6545GF-Z Distributor
  • MP6545GF-Z Supplier
  • MP6545GF-Z Wholesale
Related Products
DRV2603RUNR
DRV2603RUNR

Texas Instruments

DRV8837CDSGR
DRV8837CDSGR

Texas Instruments

DRV8837DSGR
DRV8837DSGR

Texas Instruments

DRV8838DSGR
DRV8838DSGR

Texas Instruments

DRV8839DSSR
DRV8839DSSR

Texas Instruments

EMC2301-1-ACZL-TR
EMC2301-1-ACZL-TR

Microchip Technology

DRV8231ADSGR
DRV8231ADSGR

Texas Instruments

EMC2302-2-AIZL-TR
EMC2302-2-AIZL-TR

Microchip Technology

DRV8800PWPR
DRV8800PWPR

Texas Instruments

DRV8835DSSR
DRV8835DSSR

Texas Instruments

EMC2303-1-KP-TR
EMC2303-1-KP-TR

Microchip Technology

DRV8876PWPR
DRV8876PWPR

Texas Instruments

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER