Monolithic Power Systems Inc. MP6604BGF-P

Overview

MP6604BGF-P from Monolithic Power Systems is a dual full H-bridge motor driver IC designed for bipolar stepper and brushed DC motor control in industrial motion systems. It operates from 4.5V to 45V input voltage, delivers up to 2.5A per phase output current, features 150mΩ typical R_DS(ON) per MOSFET, and integrates over-current, over-voltage, under-voltage lockout, and thermal shutdown protections. Used in 3D printer axis drivers and stage lighting pan/tilt actuators.

For engineers reviewing the MP6604BGF-P datasheet, MP6604BGF-P pinout, MP6604BGF-P application, or MP6604BGF-P equivalent, key selection criteria include PHASE/ENBL interface compatibility, dual independent bridge timing control, fault reporting via open-drain nFAULT, and thermal performance in TSSOP-28EP package with exposed pad.

Technical Context

The MP6604BGF-P implements two independent N-channel H-bridges with integrated gate drivers, charge pump (VCP), and 5V internal regulator (VREG). Each bridge accepts PHASE/ENBL logic inputs and supports braking (ABRAKE/BBRAKE) and modulation mode (ABMOD/BBMOD) for decay control.

It uses automatic synchronous rectification to reduce body-diode conduction loss during current recirculation, and features 1µs over-current deglitch time, 80ns dead-time insertion, and 600µs wake-up delay after nSLEEP deassertion - all confirmed in electrical and timing characterization data.

Key Specifications

Pinout & Package

MP6604BGF-P is packaged in TSSOP-28EP (4.3mm × 9.7mm × 1.05mm height) with exposed thermal pad. Pin numbering follows JEDEC MO-153 standard; Pin 1 marked by index area on top side.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual H-bridge motor driver applications.

Compared with TB6612FNG and DRV8876N, MP6604BGF-P uniquely balances wide 4.5–45V operation, 2.5A capability, TSSOP-28EP package with thermal pad, and comprehensive protection - making it optimal for industrial motion where supply variation, reliability, and board-space-constrained designs coexist.

Availability

MP6604BGF-P is available at Aetrix Electronics and suitable for 3D printing motion control, stage lighting actuation, and textile machine indexing requiring stable component supply across multi-year production cycles.

Supply support for MP6604BGF-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with over 20 years of expertise in DC/DC converters, motor drivers, and LED controllers.

The MP6604B series targets industrial and commercial motion control applications, delivering robust dual H-bridge functionality with integrated protection and simplified PHASE/ENBL interface to reduce system complexity and bill-of-materials count.

FAQ

What is the maximum ambient temperature for continuous 2.5A operation in MP6604BGF-P?

At 2.5A per phase, continuous operation requires ≤65°C ambient temperature with 2oz copper, 6 thermal vias under the exposed pad, and ≥4cm² copper area per bridge. Derating curves in the datasheet show 2.5A is achievable at 25°C ambient with standard 4-layer PCB; above 65°C, output current must be reduced per thermal resistance θJA = 32°C/W.

Does MP6604BGF-P support microstepping?

No - MP6604BGF-P implements only full-step and half-step excitation via PHASE/ENBL logic. It lacks internal current DACs or chopper control needed for microstepping. For microstepping, use MPS's MP6550 or external indexer + current-mode driver.

Can nFAULT be used without an external pull-up resistor?

No - nFAULT is an open-drain output requiring an external pull-up resistor (typically 4.7kΩ to 5V or 3.3V) to generate a valid logic-high level. Without pull-up, nFAULT remains floating during normal operation and cannot signal fault clearance to the host MCU.

What is the minimum recommended PCB copper weight for thermal management?

2oz (70µm) copper is mandatory on both top and bottom layers beneath the TSSOP-28EP thermal pad. The datasheet specifies ≥6 thermal vias (0.3mm diameter, filled or capped) connecting the pad to inner and bottom ground planes to achieve θJA ≤32°C/W.

Is there a difference between MP6604BGF and MP6604BGF-P?

MP6604BGF-P is the tape-and-reel packaging variant of MP6604BGF (TSSOP-28EP). The "-P" suffix denotes packaging format only - electrical, thermal, and functional specifications are identical to MP6604BGF per the ordering information table in Rev. 1.1 datasheet.

How does automatic synchronous rectification improve efficiency?

By turning on the appropriate low-side or high-side MOSFET during current recirculation instead of relying on body diodes, synchronous rectification reduces voltage drop from ~1.1V (body diode VF) to ~0.375V (I×R_DS(ON) at 2.5A), cutting conduction loss by ~66% and lowering junction temperature by up to 25°C under continuous PWM operation.

What happens if both nSLEEP and nRESET are asserted simultaneously?

nSLEEP takes precedence: asserting nSLEEP low disables all internal circuitry including the reset latch, so nRESET has no effect until nSLEEP is released. After nSLEEP returns high, a subsequent nRESET pulse is required to clear latched faults and re-enable outputs.