Monolithic Power Systems Inc. MP6604BGF-Z

Overview

MP6604BGF-Z from Monolithic Power Systems is a dual full H-bridge motor driver IC designed for bipolar stepper and brushed DC motors, operating from 4.5V to 45V input supply with up to 2.5A per phase output current, 150mΩ typical R_DS(ON) per MOSFET, integrated over-current/over-voltage/thermal protection, and PHASE/ENBL control interface - deployed in 3D printers and stage lighting systems.

For engineers reviewing the MP6604BGF-Z datasheet, MP6604BGF-Z pinout, MP6604BGF-Z application, or MP6604BGF-Z equivalent, this page delivers verified package mapping (TSSOP-28EP), validated terminal functions, confirmed thermal shutdown at 165°C, OCP trip at 3–4.5A, and real-world timing parameters including 40–360ns BMOD-to-output delays.

Technical Context

The MP6604BGF-Z integrates eight N-channel power MOSFETs as two independent full H-bridges with automatic synchronous rectification to reduce body-diode conduction loss during inductive current recirculation. It uses an internal charge pump (VCP) generating ~VIN+5V for high-side gate drive and a dedicated 5V LDO (VREG) for low-side logic and gate drivers.

Control is implemented via separate PHASE/ENBL/BRAKE/BMOD inputs per bridge, supporting four-quadrant operation including forward/reverse drive and fast/slow decay braking. Fault reporting is handled by an open-drain nFAULT pin asserting low on OCP, OVP, UVLO, or thermal shutdown events.

Key Specifications

Pinout & Package

TSSOP-28EP package with exposed thermal pad (EP); 0.65mm pitch, 9.7mm × 4.4mm footprint; MSL Level 2a per JEDEC MO-153; requires soldering of EP to inner-layer copper planes with ≥6 thermal vias for thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual H-bridge motor driver applications.

Compared with TB6612FNG and DRV8876PWPR, the MP6604BGF-Z uniquely balances 45V operation, 2.5A capability, and minimal GPIO control overhead - making it optimal for cost-constrained industrial motion where reliability and ease of integration are prioritized over telemetry.

Availability

MP6604BGF-Z is available at Aetrix Electronics and suitable for 3D printer motion control, stage lighting actuation, and laser printer paper feed systems requiring stable component supply across multi-year production cycles.

Supply support for MP6604BGF-Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Monolithic Power Systems (MPS) is a fabless semiconductor company specializing in high-performance power management ICs, with design centers in the US, China, and Taiwan, and global distribution through authorized partners.

The MP6604B product line targets industrial and commercial motion control applications, delivering integrated dual H-bridge solutions that replace discrete MOSFET gate driver + FET combinations while maintaining robust fault protection and wide input voltage tolerance.

FAQ

What is the maximum continuous output current per bridge at 85°C ambient?

The MP6604BGF-Z delivers up to 2.5A per phase continuously at TA = 85°C when mounted on a 4-layer PCB with ≥2 oz copper, 6 thermal vias under the EP pad, and 2 cm² of 2 oz copper pour per PGNDA/PGNDB. Derating applies above 85°C per θJA = 32°C/W.

Does the MP6604BGF-Z support microstepping?

No - the MP6604BGF-Z implements PHASE/ENBL control and does not include internal current DACs or chopper circuitry required for microstepping. It supports full- and half-step modes only when driven by an external controller generating appropriate PHASE/ENBL sequences.

Can the nFAULT pin be left unconnected?

Yes, nFAULT is optional. If unused, it must be left floating (no pull-up or tie-off), as its open-drain structure draws no current in high-impedance state. However, omitting fault monitoring forfeits OCP/OVP/thermal event visibility critical for industrial safety compliance.

What external capacitors are mandatory for stable operation?

Four capacitors are mandatory: (1) ≥100nF X7R ceramic between each VIN pin and GND; (2) 1µF X7R ceramic between VREG and GND; (3) 1µF X7R ceramic between VCP and VIN; (4) 100nF X7R ceramic between CPA and CPB. All must be rated ≥16V and placed within 2mm of respective pins.

Is there a difference in thermal performance between QFN-28 and TSSOP-28EP packages?

Yes - the TSSOP-28EP (MP6604BGF-Z) has lower θJA (32°C/W vs. 40°C/W for QFN-28) due to larger exposed pad area and better solder joint thermal conduction, enabling ~20% higher power dissipation at same board layout. Both require EP soldering and thermal vias.

How does automatic synchronous rectification improve efficiency?

By actively turning on the appropriate low-side or high-side MOSFET during inductive flyback instead of relying on lossy body diodes, synchronous rectification reduces voltage drop from ~1.1V (diode) to ~0.375V (150mΩ × 2.5A), cutting conduction loss by >65% and minimizing junction temperature rise.

What happens during nSLEEP assertion and how long does wake-up take?

Asserting nSLEEP low disables all gate drivers, stops the charge pump, and places outputs in high-impedance state. After nSLEEP returns high, a fixed 600µs internal delay allows VCP to recharge before outputs become active - preventing shoot-through during power-up transients.