NXP Semiconductors MPC17531ATEP

Overview

MPC17531ATEP from NXP Semiconductors is a monolithic dual H-bridge motor driver IC designed for portable bipolar stepper and brushed DC motor control, featuring 700 mA continuous output current per channel, 1.2 Ω max R_DS(on) at 25 °C, 3.0 V logic-compatible inputs, and internal charge pump operation from 2.0–8.6 V motor supply - deployed in camera lens positioners and optical disk drive head actuators.

For engineers reviewing the MPC17531ATEP datasheet, MPC17531ATEP pinout, MPC17531ATEP application, or MPC17531ATEP equivalent, this page delivers verified electrical specs, QFN-24 package mapping, PWM control up to 200 kHz, undervoltage shutdown behavior, and shoot-through protection implementation details critical for motor driver selection and layout validation.

Technical Context

The MPC17531ATEP integrates two independent SMARTMOS H-bridges with dedicated predriver stages powered by an internal triple charge pump (VCRES ≈ 3×VDD), enabling high-side MOSFET enhancement even when VM = 5.0 V and VDD = 3.0 V. Each bridge supports Forward, Reverse, Brake, and Tri-state modes via parallel logic inputs (IN1A/IN1B/IN2A/IN2B).

It implements hardware-level shoot-through prevention through synchronized gate timing and includes a dedicated PSAVE input that forces all four outputs into high-impedance while disabling the charge pump and low-voltage detector - reducing quiescent current to ≤2.0 μA. Undervoltage lockout triggers at VDD < 1.0–2.5 V, placing outputs in tri-state.

Key Specifications

Pinout & Package

Package: 24-pin QFN (98ASA00474D), 4×4 mm body, 0.5 mm pitch, exposed thermal pad - optimized for compact portable PCBs requiring efficient heat dissipation without discrete heatsinks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual H-bridge motor driver applications.

Compared with TB6612FNG and DRV8833, the MPC17531ATEP uniquely combines 3.0 V logic compatibility, internal charge pump for 2–8.6 V motor operation, and ≤2.0 μA power save - making it optimal for battery-constrained portable imaging and optical positioning where voltage headroom and standby efficiency are critical.

Availability

MPC17531ATEP is available at Aetrix Electronics and suitable for camera lens positioning, optical disk drive actuation, and portable medical pump control requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for MPC17531ATEP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications - delivering high-reliability analog, power, and mixed-signal ICs.

The MPC17531ATEP belongs to NXP's SMARTMOS motor driver family, engineered specifically for ultra-compact, low-power portable motion control - emphasizing logic-voltage flexibility, integrated gate drive, and robust fault protection in space-constrained designs.

FAQ

What is the maximum motor supply voltage supported by the MPC17531ATEP when using its internal charge pump?

The MPC17531ATEP supports a motor supply voltage range of 2.0 V to 8.6 V when operating with its internal charge pump. This specification is explicitly defined in Table 4 (Static Electrical Characteristics) under "VM-CP" and confirmed in the Functional Description section. Exceeding 8.6 V risks permanent damage, as noted in the Absolute Maximum Ratings table (VM ≤ 11.0 V only applies when VCRES is supplied externally). The 8.6 V limit ensures safe gate drive voltage generation (VCRES ≤ 13.5 V) and reliable MOSFET switching in the MPC17531ATEP.

Does the MPC17531ATEP support independent PWM control of each H-bridge channel?

Yes, the MPC17531ATEP supports independent PWM control of each H-bridge channel. Its datasheet states that "the H-Bridge outputs can be independently pulse width modulated (PWM'ed) at up to 200 kHz for speed/torque and current control." This capability is enabled by separate logic inputs (IN1A/IN1B for Bridge 1, IN2A/IN2B for Bridge 2), allowing asynchronous duty-cycle modulation without cross-channel interference - a key feature validated in the Truth Table and Dynamic Electrical Characteristics sections for the MPC17531ATEP.

What is the function of the PSAVE pin on the MPC17531ATEP, and what happens to the outputs when it is asserted?

The PSAVE pin on the MPC17531ATEP is an active-high power save enable. When PSAVE = HIGH, all four H-bridge outputs (OUT1A, OUT1B, OUT2A, OUT2B) are forced into high-impedance (tri-state) regardless of the states of IN1A/IN1B/IN2A/IN2B. Simultaneously, the internal charge pump and low-voltage detection circuitry are disabled, reducing total supply current to ≤2.0 μA. This behavior is documented in the Functional Pin Description and Truth Table sections of the MPC17531ATEP datasheet and is essential for ultra-low-power standby in portable devices.

How does the MPC17531ATEP implement shoot-through current protection?

The MPC17531ATEP implements hardware-level shoot-through current protection through synchronized gate drive timing within its internal predriver logic - preventing simultaneous conduction of high-side and low-side MOSFETs in either H-bridge. This is not software-configurable or external-circuit dependent; it is a fixed, built-in safety feature described in the Introduction and Functional Description sections. The datasheet explicitly lists "Shoot-through current protection circuit" as a core feature and confirms its operation in the internal block diagram and truth table behavior - ensuring robustness without requiring external timing constraints for the MPC17531ATEP.

What package type and pin count does the MPC17531ATEP use, and how is thermal management addressed?

The MPC17531ATEP uses a 24-pin QFN package (drawing number 98ASA00474D), measuring 4×4 mm with 0.5 mm pitch and an exposed thermal pad. Thermal management is addressed via the exposed pad, which provides a low-thermal-resistance path from the die to the PCB - enabling a maximum power dissipation of 2.5 W at TA = 25 °C when properly soldered and connected to sufficient copper area. This package information is confirmed in the Orderable Parts table and Packaging section of the MPC17531ATEP datasheet.