NXP Semiconductors MPC5125YVN400
- Part No.:
- MPC5125YVN400
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 324-BBGA
- Datasheet:
-
MPC5125YVN400.pdf
- Description:
- IC MCU 32BIT ROMLESS 324PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:441
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Product details
Overview
MPC5125YVN400 from Freescale Semiconductor is a 32-bit Power Architecture e300-core microcontroller designed for telematics and high-temperature industrial control. It operates at up to 400 MHz, supports –40°C to +125°C junction temperature, integrates dual Fast Ethernet (FEC), four CAN interfaces, and DDR1/DDR2/LPDDR memory controllers for real-time networked systems.
For engineers reviewing the MPC5125YVN400 datasheet, MPC5125YVN400 pinout, MPC5125YVN400 application, or MPC5125YVN400 equivalent, key selection criteria include its 400 MHz e300 core performance, 324-ball TEPBGA package, dual USB 2.0 OTG with ULPI, 64-channel DMA, and support for automotive-grade CAN, J1850, and SDHC in harsh-environment embedded designs.
Technical Context
The MPC5125YVN400 implements a superscalar e300 core with 32 KB instruction and 32 KB data cache, dual integer units, and integrated FPU - enabling deterministic real-time execution in safety-critical telematics and motion control. Its on-chip DIU supports 1280×720@60 Hz LCD output, while the dual FEC controllers comply with IEEE 802.3 MII/RMII standards.
Memory subsystem includes a flexible multi-port controller supporting 16-/32-bit DDR1/DDR2/LPDDR at up to 200 MHz, plus NAND flash interface with BCH ECC (up to 32-bit correction) and two SDHC modules compliant with SD/SDIO v1.x and MMC specifications - all coordinated via a 64-channel DMA engine with scatter/gather capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e300 Power Architecture, binary-compatible with MPC5121e/MPC5200B for software reuse |
| Max Core Frequency | 400 MHz - enables real-time processing of multiple CAN, Ethernet, and serial protocols simultaneously |
| Operating Temperature | –40°C to +125°C junction - qualified for under-hood automotive and industrial control environments |
| Memory Interfaces | DDR1/DDR2/LPDDR/SDR SDRAM (16/32-bit, 200 MHz), NAND flash (4 chip selects, BCH ECC) |
| Connectivity Peripherals | 2× FEC (10/100 Mbps MII/RMII), 4× CAN 2.0A/B, 2× USB 2.0 OTG (ULPI), 3× I²C, 10× PSC, 2× SDHC |
| On-chip Memory | 32 KB SRAM (core scratchpad), RTC with VBAT domain, on-die temperature sensor with interrupt |
| Package | 324-pin TEPBGA (19 mm × 19 mm, 1.0 mm pitch) - optimized for thermal dissipation in compact telematics modules |
Pinout & Package
Package: 324-ball plastic ball grid array (TEPBGA), 19 mm × 19 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% supply for e300 core - requires low-noise regulation due to 400 MHz switching |
| VDD_IO | I/O power supply | 1.8 V or 3.3 V selectable per bank - supports mixed-voltage interfacing with peripherals |
| CLKIN | Primary clock input | Accepts external crystal or oscillator (typically 33.33 MHz) for PLL-based system clock generation |
| RESET_IN | Asynchronous reset input | Active-low signal asserting full chip reset - compatible with automotive watchdog and power-on reset circuits |
| FEC_MDIO / FEC_MDC | PHY management interface | IEEE 802.3-compliant MDIO/MDC pair for configuring external Ethernet PHY devices |
| CAN_TX0 / CAN_RX0 | Channel 0 CAN transceiver interface | Differential signaling pins for CAN 2.0B bus - require external high-speed CAN transceiver (e.g., TJA1042) |
Key Features
| Feature | Design Value |
|---|---|
| Display Interface Unit (DIU) | Hardware-accelerated 1280×720@60 Hz LCD output with 24-bit color depth - eliminates need for external graphics controller in HMI designs |
| USB 2.0 OTG with ULPI | Dual independent USB controllers accessible via ULPI physical layer - reduces board space vs. discrete PHY and enables host/device role switching |
| 64-channel DMA engine | Supports linked-list transfers and scatter/gather - offloads CPU during high-bandwidth memory moves (e.g., video frame buffering, NAND page reads) |
| Four CAN 2.0B interfaces | Independent programmable CAN modules with wakeup capability - enables multi-bus vehicle networking without external CAN bridge ICs |
| On-chip temperature sensor | Monitors die temperature with programmable interrupt threshold - provides thermal throttling or fault reporting without external sensors |
Applications
| Telematics Control Unit | Industrial Motion Controller |
|---|---|
Use Scenario: Integrated vehicle communications hub managing GPS, cellular modem, Bluetooth, and infotainment data routing. IC Role / Device Role / Timing Role: Central processor executing Linux-based middleware, handling CAN/J1850 diagnostics, FEC-based telematics gateway, and DIU-driven dashboard display. Use Value: Single-chip integration of 4× CAN, dual FEC, and DIU reduces BOM count and interconnect complexity versus multi-IC solutions. | Use Scenario: Real-time servo drive controller coordinating position feedback, PWM generation, and fieldbus communication in CNC machinery. IC Role / Device Role / Timing Role: Deterministic e300 core running RTOS with precise timer interrupts, managing PSC-based encoder inputs and CANopen motion profiles. Use Value: 400 MHz performance with 64-channel DMA ensures jitter-free servo loop timing while servicing multiple fieldbuses concurrently. |
| Avionics Display System | Smart Grid Substation Controller |
Use Scenario: Cockpit multifunction display rendering synthetic vision, navigation overlays, and system status using high-resolution LCD panels. IC Role / Device Role / Timing Role: DIU-driven graphics pipeline with hardware blending, backed by DDR2 memory and managed by e300 core with VBAT RTC for timestamping. Use Value: On-chip DIU and 24-bit color support eliminate external video encoder, meeting DO-254 design assurance level requirements. | Use Scenario: IED (Intelligent Electronic Device) monitoring circuit breakers, transformers, and protection relays in utility substations. IC Role / Device Role / Timing Role: High-temperature-rated MCU executing IEC 61850 protocol stacks over dual FEC, with NAND boot storage and secure SDHC for firmware updates. Use Value: –40°C to +125°C operation and ECC-enabled NAND ensure reliability in unconditioned outdoor enclosures with wide ambient swings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5121EVM | Same e300 core, but 266 MHz max frequency; lacks DIU and second FEC; uses 272-pin PBGA | Targeted at cost-sensitive infotainment audio gateways, not full telematics or display-intensive HMI | Select MPC5121EVM only when display output and dual Ethernet are unnecessary and lower thermal load is acceptable. |
| MPC5200BVR2 | 266 MHz e300 core; no DIU; single FEC; supports only SDR SDRAM (no DDR1/DDR2); 324-pin PBGA same footprint | Designed for legacy industrial control where DDR bandwidth and LCD output are not required | MPC5200BVR2 offers pin-compatible migration path but requires redesign for DDR and DIU-dependent features. |
Compared with MPC5125YVN400, MPC5121EVM delivers lower compute throughput and no display capability, while MPC5200BVR2 shares the package but omits DDR controllers and DIU - making MPC5125YVN400 the only option among the three supporting high-resolution HMI with dual-network redundancy in extended temperature range.
Availability
MPC5125YVN400 is available at Aetrix Electronics and suitable for telematics control units, industrial motion controllers, and avionics display systems requiring stable component supply across long product lifecycles and extreme thermal conditions.
Supply support for MPC5125YVN400 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors since 2015) was a leading designer of embedded processors and analog/mixed-signal ICs for automotive, industrial, and networking markets.
The MPC5125YVN400 belongs to the mobileGT™ family of Power Architecture microcontrollers, engineered specifically for high-reliability, thermally demanding applications including automotive telematics, avionics displays, and industrial automation with integrated connectivity and graphics.
FAQ
What is the maximum operating frequency of the MPC5125YVN400?
The MPC5125YVN400 operates at a maximum core frequency of 400 MHz, achieved via its enhanced e300 Power Architecture core. This frequency is sustained across the full –40°C to +125°C junction temperature range when supplied with stable 1.0 V core voltage and proper thermal management. The MPC5125YVN400's PLL supports multiple clock domains, allowing peripheral buses like CSB and AHB to run at derived frequencies while maintaining deterministic real-time execution on the e300 core.
Does the MPC5125YVN400 support DDR2 memory, and what configurations are validated?
Yes, the MPC5125YVN400 supports DDR2 SDRAM in both 16-bit and 32-bit data bus widths, with validated operation up to 200 MHz clock frequency. It supports two chip selects and includes configurable timing parameters for tRCD, tRP, tRAS, and CAS latency. The MPC5125YVN400's DDR controller also supports LPDDR and SDR SDRAM, enabling flexible memory selection based on power and bandwidth requirements in telematics and industrial applications.
How many CAN interfaces does the MPC5125YVN400 integrate, and are they independently configurable?
The MPC5125YVN400 integrates four fully independent CAN 2.0A/B-compliant interfaces, each with dedicated message RAM, acceptance filtering, and programmable wakeup functionality. All four CAN modules operate concurrently and can be configured for different bit rates, loopback modes, or sleep/wakeup behavior - essential for multi-bus vehicle networks or distributed industrial control where isolation between CAN domains is required. Each interface requires an external CAN transceiver, such as the TJA1042 or SN65HVD230.
Is the MPC5125YVN400 pin-compatible with other mobileGT family members like the MPC5200B?
No, the MPC5125YVN400 is not pin-compatible with the MPC5200B despite sharing the 324-ball PBGA footprint - ball assignments differ significantly due to added peripherals including DIU, second FEC, dual USB OTG, and expanded GPIO. While the MPC5200BVR2 uses the same package outline, its signal mapping, power domains, and thermal pad configuration are incompatible with MPC5125YVN400 PCB layouts. Migration requires full schematic and layout revision.
What display resolution and interface standards does the MPC5125YVN400's DIU support?
The MPC5125YVN400's Display Interface Unit (DIU) supports LCD resolutions up to 1280×720 pixels at 60 Hz refresh rate with 24-bit color depth (RGB888). It outputs parallel RGB signals with programmable polarity, clock phase, and timing parameters - compatible with standard LVDS transmitter ICs (e.g., THCV215) but does not include native LVDS or MIPI DSI PHY. The DIU includes hardware-accelerated n-plane blending, enabling overlay composition for HUD or multi-source HMI without CPU overhead.
MPC5125YVN400 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 324-BBGA
- Series:
- MPC51xx
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e300
- Core Size:
- 32-Bit Single-Core
- Speed:
- 400MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, USB OTG
- Peripherals:
- DMA, WDT
- Number of I/O:
- 64
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MPC5125YVN400 FAQ
1.How can I place an order for MPC5125YVN400 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC5125YVN400 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC5125YVN400 reliable?
The price and inventory of MPC5125YVN400 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC5125YVN400 is usually 5 days.
3.What payment methods are accepted for MPC5125YVN400?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC5125YVN400 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC5125YVN400?
MPC5125YVN400 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC5125YVN400 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC5125YVN400?
For technical support, including MPC5125YVN400 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC5125YVN400 requirements.
6.How does Aetrix verify that MPC5125YVN400 is sourced from the original manufacturer or authorized distributors?
All MPC5125YVN400 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC5125YVN400 meets industry standards.
7.What is the process for return or replacement of MPC5125YVN400?
All MPC5125YVN400 units undergo pre-shipment inspection (PSI). If there is an issue with MPC5125YVN400, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC5125YVN400 part is unused and in its original packaging.
Return procedure for MPC5125YVN400:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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