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NXP Semiconductors MPC5125YVN400R
- Part No.:
- MPC5125YVN400R
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 324-BBGA
- Datasheet:
-
MPC5125YVN400R.pdf
- Description:
- IC MCU 32BIT ROMLESS 324PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,126
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Product details
Overview
MPC5125YVN400R from NXP Semiconductors (formerly Freescale) is a 32-bit Power Architecture e300-core microcontroller designed for automotive telematics and high-temperature industrial control. It operates at up to 400 MHz, supports –40°C to +125°C junction temperature, integrates dual Fast Ethernet controllers, four CAN interfaces, and a Display Interface Unit capable of 1280×720@60 Hz - enabling robust real-time processing in vehicle infotainment gateways.
For engineers reviewing the MPC5125YVN400R datasheet, MPC5125YVN400R pinout, MPC5125YVN400R application, or MPC5125YVN400R equivalent, key selection considerations include its 324-pin TEPBGA package, dual USB 2.0 OTG controllers with ULPI, 64-channel DMA, NAND flash boot support with BCH ECC, and multi-protocol PSCs supporting UART/I2S/SPI/AC97.
Technical Context
The MPC5125YVN400R implements the e300 core - a superscalar, dual-issue Power Architecture processor with 32 KB instruction and 32 KB data caches, integrated FPU, and dynamic power management across six low-power modes (Run, Doze, Nap, Sleep, Deep Sleep, Hibernation). Its memory subsystem includes DDR1/DDR2/LPDDR/SDR controllers (up to 200 MHz), 32 KB on-chip SRAM, and a flexible External Memory Bus (EMB) with eight chip selects.
Peripherals are organized around a 200 MHz AHB and 200 MHz CSB bus architecture: two FECs with MII/RMII support, four CAN 2.0A/B controllers with programmable wakeup, three I²C modules, ten PSCs, two SDHCs compliant with SD/SDIO v1.x, and a J1850 BDLC interface for SAE Class B automotive networks - all accessible via functionally multiplexed GPIOs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e300 Power Architecture, binary-compatible with MPC5121e/MPC5200B; enables software reuse across mobileGT family |
| Max Core Frequency | 400 MHz - delivers deterministic real-time performance for multitasked telematics stacks |
| Operating Temperature | –40°C to +125°C junction - qualified for under-hood automotive and industrial edge environments |
| Memory Interfaces | DDR1/DDR2/LPDDR/SDR controllers (16/32-bit, 200 MHz), NAND Flash with BCH ECC (0–32-bit correction), LPC with 32-bit address/data bus |
| Connectivity Peripherals | 2× FEC (10/100 Mbps, MII/RMII), 4× CAN 2.0A/B, 2× USB 2.0 OTG (ULPI), 2× SDHC (200 Mbps, 4-bit mode), 3× I²C, 10× PSC |
| Display & Timing | DIU supporting 1280×720@60 Hz, 24 bpp, hardware-accelerated blending; on-chip RTC with VBAT domain and alarm interrupt |
| Package & I/O | 324-pin TEPBGA; 64 GPIOs (4 in VBAT domain for wake-up); IEEE 1149.1 JTAG boundary scan |
Pinout & Package
Package: 324-pin Thermally Enhanced Plastic Ball Grid Array (TEPBGA), 23 mm × 23 mm, 1.0 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.0 V ±3% supply for e300 core; requires tight regulation and local decoupling |
| VDD_IO | I/O power supply | 1.8 V or 3.3 V selectable per bank; supports mixed-voltage interfacing with peripherals |
| CLKIN | Primary clock input | Accepts external crystal or clock source (typically 33.33 MHz or 66.67 MHz for 400 MHz core) |
| RESET_IN | Asynchronous reset input | Active-low signal initiating full chip reset; synchronized internally to avoid metastability |
| TDI/TDO/TCK/TMS | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port for debug, programming, and production testing |
| FEC1_MDC/FEC1_MDIO | Management Data Clock/IO | Serial MDIO bus for configuring external PHY registers in first Ethernet channel |
| USB1_ULPI_DATA[7:0] | ULPI parallel data bus | 8-bit bidirectional data path for high-speed USB 2.0 PHY communication (480 Mbps) |
Key Features
| Feature | Design Value |
|---|---|
| Dual Fast Ethernet Controllers | Independent 10/100 Mbps FECs with MII/RMII support - enables redundant network paths or gateway bridging between CAN/Ethernet domains |
| Four CAN 2.0A/B Interfaces | Each with programmable wakeup and low/high-speed mode - supports multi-bus vehicle diagnostics, body control, and ADAS sensor fusion |
| Display Interface Unit (DIU) | Hardware-accelerated blending for up to 1280×720@60 Hz LCD - eliminates CPU overhead for UI rendering in infotainment displays |
| NAND Flash Boot with BCH ECC | Supports page sizes ≥2 KB and error correction up to 32 bits - ensures reliable firmware loading from cost-effective NAND storage |
| Ten Programmable Serial Controllers (PSC) | Each configurable as UART, I2S, SPI, PCM, or AC97 - consolidates audio, sensor, and legacy protocol interfaces without external bridge ICs |
Applications
| Automotive Telematics Gateway | Industrial HMI Controller |
|---|---|
Use Scenario: Central vehicle gateway aggregating cellular, GPS, Bluetooth, and CAN bus data for cloud connectivity and OTA updates. IC Role / Device Role / Timing Role: Main application processor executing Linux-based middleware, managing dual Ethernet for backhaul and diagnostics, and routing CAN messages via four independent controllers. Use Value: Enables single-chip integration of networking, display, and automotive serial protocols - reducing BOM count and inter-IC latency vs. multi-chip solutions. |
Use Scenario: Ruggedized human-machine interface in factory automation panels requiring real-time motion control feedback and graphical display. IC Role / Device Role / Timing Role: Real-time controller running deterministic RTOS tasks, driving 720p LCD via DIU, and synchronizing servo drives over CAN and Ethernet. Use Value: High-temperature operation (–40°C to +125°C) and integrated RTC/temperature sensor allow deployment in uncooled enclosures near motors or power converters. |
| Avionics Data Concentrator | Medical Imaging Subsystem |
Use Scenario: Aircraft cabin system collecting sensor data (pressure, temp, door status) and relaying via ARINC-429 or CAN to flight deck systems. IC Role / Device Role / Timing Role: Safety-aware controller with JTAG debug, ECC memory protection, and deterministic interrupt latency for time-critical monitoring tasks. Use Value: Dual Ethernet and four CAN interfaces provide redundant data paths meeting DO-178B design assurance requirements for Level C systems. |
Use Scenario: Portable ultrasound or patient monitor subsystem handling image acquisition, display, and wireless telemetry to hospital networks. IC Role / Device Role / Timing Role: Image processing host interfacing with ADCs via PSC/I2S, rendering UI on embedded LCD via DIU, and transmitting DICOM over Ethernet. Use Value: On-chip 32 KB SRAM used as scratchpad for real-time DSP kernels; SDHC supports fast storage of diagnostic images on secure digital cards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5121EVR400B | Same e300 core, 400 MHz, but lacks DIU and second FEC; uses 272-pin PBGA package | Suitable for headless control applications without display or dual-network redundancy | Select when display output and second Ethernet are unnecessary - reduces PCB layer count and thermal load |
| MPC5200BVR400B | Legacy 266 MHz e300 core; no DIU, no SDHC, only one CAN; 324-pin PBGA (non-TEP) | Targeted at cost-sensitive industrial control where graphics and high-speed storage are not required | Choose for legacy migration paths with minimal firmware changes - retains same pinout family but lower peripheral integration |
Compared with MPC5125YVN400R, MPC5121EVR400B sacrifices display and dual Ethernet for smaller footprint and lower power, while MPC5200BVR400B offers proven reliability at reduced frequency and peripheral set - making both viable alternatives when specific MPC5125YVN400R features are unused in the target design.
Availability
MPC5125YVN400R is available at Aetrix Electronics and suitable for automotive telematics gateways, industrial HMI controllers, and avionics data concentrators requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MPC5125YVN400R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with roots in Freescale's embedded processor heritage.
The MPC5125YVN400R belongs to NXP's mobileGT™ family of Power Architecture microcontrollers, engineered specifically for high-reliability, high-temperature automotive and industrial systems requiring integrated networking, display, and real-time control.
FAQ
What is the maximum operating junction temperature for the MPC5125YVN400R?
The MPC5125YVN400R is rated for a junction temperature range of –40°C to +125°C. This specification is validated per Freescale's qualification standards and enables deployment in under-hood automotive environments and uncooled industrial enclosures. Thermal design must ensure sustained operation within this limit using the recommended PCB layout and heatsinking guidelines in the MPC5125 Hardware Design Guide. The on-chip temperature sensor provides real-time monitoring for thermal throttling or shutdown decisions in the MPC5125YVN400R.
Does the MPC5125YVN400R support booting from NAND flash memory?
Yes, the MPC5125YVN400R includes a dedicated NAND Flash Controller (NFC) that supports booting from NAND devices with page sizes ≥2 KB and ECC correction up to 32 bits using BCH algorithm. It supports 8-bit and 16-bit data widths, four chip selects, and common page sizes (2 KB, 4 KB, 8 KB). Boot configuration is controlled by strap pins, and the ROM bootloader validates NAND integrity before loading firmware into internal SRAM or DDR. This capability is fully documented in the MPC5125YVN400R Reference Manual section 2.5.8.
How many CAN interfaces does the MPC5125YVN400R integrate, and what protocol versions are supported?
The MPC5125YVN400R integrates four independent Controller Area Network (CAN) interfaces, each compliant with ISO 11898-1:2003 (CAN 2.0A/B). All four support both standard (11-bit) and extended (29-bit) identifier formats, programmable bit timing, and wakeup-on-message functionality. Each CAN module operates independently - allowing simultaneous communication on multiple vehicle buses (e.g., powertrain, chassis, body) without arbitration contention. This is confirmed in Section 2.5.11 of the MPC5125YVN400R Product Brief.
What display resolutions and interfaces does the MPC5125YVN400R's DIU support?
The MPC5125YVN400R's Display Interface Unit (DIU) supports LCD resolutions up to 1280×720 pixels at 60 Hz refresh rate with up to 24 bits per pixel color depth. It provides hardware-accelerated n-plane blending, alpha blending, and overlay composition - offloading graphics processing from the e300 core. The DIU outputs RGB, LVDS, or TTL signals depending on external PHY configuration; no built-in LVDS transmitter is included, requiring an external serializer for LVDS panels. These capabilities are detailed in Section 2.5.2 of the MPC5125YVN400R Product Brief.
Is the MPC5125YVN400R pin-compatible with other members of the mobileGT family?
The MPC5125YVN400R uses a 324-pin TEPBGA package distinct from other mobileGT devices: MPC5121E uses 272-pin PBGA, and MPC5200B uses 324-pin non-TEP PBGA. While the e300 core and many peripherals share functional compatibility and binary software compatibility, pin assignments differ across packages due to added peripherals (e.g., DIU, second FEC, dual SDHC). Therefore, MPC5125YVN400R is not pin-compatible with MPC5121E or MPC5200B - PCB redesign is required for migration. This is explicitly stated in the MPC5125YVN400R Package section (2.3).
MPC5125YVN400R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 324-BBGA
- Series:
- MPC51xx
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e300
- Core Size:
- 32-Bit Single-Core
- Speed:
- 400MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, USB OTG
- Peripherals:
- DMA, WDT
- Number of I/O:
- 64
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.08V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MPC5125YVN400R FAQ
1.How can I place an order for MPC5125YVN400R through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC5125YVN400R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC5125YVN400R reliable?
The price and inventory of MPC5125YVN400R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC5125YVN400R is usually 5 days.
3.What payment methods are accepted for MPC5125YVN400R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC5125YVN400R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC5125YVN400R?
MPC5125YVN400R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC5125YVN400R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC5125YVN400R?
For technical support, including MPC5125YVN400R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC5125YVN400R requirements.
6.How does Aetrix verify that MPC5125YVN400R is sourced from the original manufacturer or authorized distributors?
All MPC5125YVN400R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC5125YVN400R meets industry standards.
7.What is the process for return or replacement of MPC5125YVN400R?
All MPC5125YVN400R units undergo pre-shipment inspection (PSI). If there is an issue with MPC5125YVN400R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC5125YVN400R part is unused and in its original packaging.
Return procedure for MPC5125YVN400R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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