NXP Semiconductors MPC5200CBV266

Overview

MPC5200CBV266 from Freescale Semiconductor is a PowerPC-based system-on-chip (SoC) microcontroller integrating an MPC603e-series G2_LE core, BestComm DMA subsystem, SDRAM/DDR memory controller, PCI 2.2 controller, dual CAN 2.0A/B, Fast Ethernet (FEC), six PSCs, USB 1.1 host, ATA, I²C, SPI, J1850, and real-time clock - designed for industrial control, automotive networking, and communications infrastructure applications.

For engineers reviewing the MPC5200CBV266 datasheet, MPC5200CBV266 pinout, MPC5200CBV266 application, or MPC5200CBV266 equivalent, this page delivers verified core frequency (266 MHz), thermal operating range (–40°C to +85°C), package (PBGA-457), power supply requirements (1.42–1.58 V core, 3.0–3.6 V I/O), and peripheral integration details critical for board-level design and long-lifecycle embedded deployment.

Technical Context

The MPC5200CBV266 implements a superscalar G2_LE core with 16 kB instruction and 16 kB data caches, double-precision FPU, and MMU, operating at 266 MHz under –40°C to +85°C ambient conditions. Its BestComm DMA engine offloads serial, Ethernet, and USB data movement from the CPU using dedicated local 16 kB SRAM.

It features dual independent PLLs: a system PLL generating up to 133 MHz XLB/IP bus clocks from a 15.6–35 MHz SYS_XTAL input, and a core PLL deriving the 266 MHz G2_LE clock. Peripheral timing is synchronized to these domains, with AC specs confirming 133 MHz SDRAM clock, 66 MHz PCI, and 100 Mbps FEC MII operation.

Key Specifications

Pinout & Package

PBGA-457 package with 27 × 27 mm footprint, 1.27 mm ball pitch, and thermal pad on underside for PCB heat sinking. Pinout defined across five functional banks: Core & PLL (power, clocks, reset), Memory (SDRAM/DDR address/data/control), Local Plus/PCI (bus interface), Communications (PSC, CAN, FEC, USB, ATA), and SIU (GPIO, I²C, SPI, J1850, timers).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded communications SoC applications.

Compared with MPC5200BVR400, MPC5200CBV266 trades peak performance for lower power and thermal margin, making it optimal for fanless enclosures and extended-temperature deployments; versus MPC8313E, it retains legacy automotive and storage interfaces critical for brownfield industrial upgrades but lacks modern security and interconnect features.

Availability

MPC5200CBV266 is available at Aetrix Electronics and suitable for industrial PLC gateways, automotive diagnostic tools, telecom remote radio units, and energy meter data concentrators requiring stable component supply across 10+ year production lifecycles.

Supply support for MPC5200CBV266 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC5200 product line was engineered as a cost-optimized, thermally robust PowerPC SoC family targeting automotive body electronics, industrial control, and communications infrastructure - emphasizing peripheral integration, long-term availability, and extended temperature qualification.

FAQ

What is the maximum guaranteed operating frequency of the MPC5200CBV266?

The MPC5200CBV266 is rated for a maximum G2_LE core frequency of 266 MHz across the full –40°C to +85°C ambient operating temperature range. This rating is validated per Freescale's Rev. 4 datasheet, Table 2 (D2.10–D2.11), and reflects guaranteed operation without derating. Higher frequencies (e.g., 400 MHz) apply only to the MPC5200BVR400 variant and require stricter voltage and thermal conditions.

Does the MPC5200CBV266 support DDR SDRAM memory?

Yes, the MPC5200CBV266 integrates a unified SDRAM/DDR memory controller supporting both SDR and DDR SDRAM devices. It operates the DDR interface at up to 132 MHz (66 MHz effective clock), with VDD_MEM_IODDR specified at 2.42–2.63 V. The controller provides automatic initialization, refresh, and configurable timing parameters - confirmed in Section 2 "Features" and Table 2 of the Freescale MPC5200 Rev. 4 datasheet.

What power management modes does the MPC5200CBV266 support, and what is its lowest power state?

The MPC5200CBV266 supports Nap, Doze, Sleep, and Deep-Sleep modes. Its lowest power state is Deep-Sleep, consuming 52.5 mW typical (measured at VDD_CORE = 1.5 V, Tj = 25°C), with the G2_LE core, system oscillator, PLLs, and all peripherals disabled except RTC wake-up circuitry. This mode is documented in Table 6 (D5.5) of the Rev. 4 datasheet and enables battery-backed operation in remote monitoring applications.

Can the MPC5200CBV266 directly drive a 3.3 V PCI bus?

Yes, the MPC5200CBV266 PCI interface complies with PCI 2.2 specifications and supports 33/66 MHz operation with 3.3 V signaling. Its PCI output drivers meet the PCI specification's VOH/VOL requirements (VOH ≥ 2.4 V, VOL ≤ 0.4 V at VDD_IO = 3.3 V), and input thresholds match TTL levels. This is verified in Table 3 (D3.19/D3.21) and Section 2 "Features" of the Rev. 4 datasheet.

Is the MPC5200CBV266 pin-compatible with other MPC5200 variants like MPC5200B?

No, the MPC5200CBV266 is not pin-compatible with MPC5200B-series parts (e.g., MPC5200BV266, MPC5200BVR400). While all MPC5200 variants use the PBGA-457 package, Freescale explicitly states in the Rev. 4 datasheet that MPC5200B introduced revised pin assignments for certain signals (e.g., USB, ATA, and GPIO muxing) to improve signal integrity and ESD robustness - requiring PCB layout changes for migration.