NXP Semiconductors MPC5200VR400B
- Part No.:
- MPC5200VR400B
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 272-BBGA
- Datasheet:
-
MPC5200VR400B.pdf
- Description:
- IC MPU MPC52XX 400MHZ 272BGA
- Quantity:
- Payment:

- Shipping:

Inventory:328
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Product details
Overview
MPC5200VR400B from Freescale Semiconductor is a PowerPC-based system-on-chip (SoC) microcontroller featuring the e300 core running at 400 MHz, integrated SDRAM/DDR memory controller (133 MHz), PCI 2.2 controller, dual CAN 2.0A/B interface, and Fast Ethernet MAC - designed for industrial control, automotive body electronics, and network-attached storage systems.
For engineers reviewing the MPC5200VR400B datasheet, MPC5200VR400B pinout, MPC5200VR400B application, or MPC5200VR400B equivalent, key selection considerations include its TEPBGA–272 package, 400 MHz e300 core performance, dual CAN + J1850 support for automotive diagnostics, PCI 2.2 host/target capability, and integrated BestComm DMA subsystem for offloading peripheral I/O.
Technical Context
The MPC5200VR400B implements a superscalar e300 core derived from the MPC603e series, with 16 KB instruction and 16 KB data caches, double-precision FPU, and MMU - enabling real-time deterministic execution in embedded Linux or VxWorks environments. Its clock architecture uses two independent PLLs: a system PLL generating up to 533 MHz VCO output and a core PLL scaling the CPU frequency to 400 MHz from the XLB bus clock.
Peripheral integration follows a hierarchical bus structure: the XL Bus connects high-speed blocks (PCI, SDRAM, ATA), while the IP Bus links lower-bandwidth peripherals (PSCs, I²C, SPI, USB OHCI). The BestComm DMA engine operates independently of the CPU, managing data movement for FEC, USB, PSC, and ATA with dedicated 16 KB SRAM - reducing CPU load and interrupt latency in throughput-intensive applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| e300 Core Frequency | 400 MHz - delivers 760 MIPS at industrial temperature range (–40°C to +85°C), enabling real-time OS execution with low-latency interrupt response. |
| Memory Interface | SDRAM/DDR up to 133 MHz - supports 256 MB per chip select across two CS, with built-in initialization and refresh logic, eliminating external controller complexity. |
| PCI Controller | PCI 2.2 compliant - operates at 33/66 MHz in initiator and target modes, enabling direct connection to legacy add-in cards or bridge chips without external arbitration logic. |
| CAN Interface | Dual MSCAN controllers - fully compliant with ISO 11898-1 (CAN 2.0A/B), supporting both standard and extended frames for distributed vehicle networks. |
| J1850 BDLC | J1850 Class B interface - supports 41.6 kbps 4X mode and all four In-Frame Response (IFR) types, meeting SAE J1850 PWM/VPW requirements for automotive diagnostics. |
| Power Management | Nap, Doze, Sleep, Deep Sleep modes - enables sub-53 mW deep-sleep power with wake-up via GPIO, RTC, or CAN, suitable for battery-backed automotive modules. |
| Package | TEPBGA–272 - 27 mm × 27 mm thermally enhanced plastic ball grid array with 272 solder balls, optimized for industrial PCB thermal dissipation (RθJA = 22°C/W on 4-layer board). |
Pinout & Package
TEPBGA–272 package: 27 mm × 27 mm body, 1.27 mm ball pitch, Pb-free matte tin finish, JEDEC-standard footprint compatible with automated reflow assembly. Thermal pad on underside enhances heat transfer to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SYS_XTAL_IN / SYS_XTAL_OUT | System oscillator input/output | Accepts 15.6–35 MHz crystal or external clock; drives internal system PLL for all domain clocks including CPU, XLB, and IP buses. |
| RTC_XTAL_IN / RTC_XTAL_OUT | Real-time clock oscillator | Connects to 32.768 kHz crystal for autonomous RTC operation during deep sleep, maintaining timekeeping without CPU intervention. |
| PCI_AD[31:0] | PCI address/data multiplexed bus | 32-bit bidirectional multiplexed address/data lines for PCI 2.2 transactions; supports burst transfers and full arbiter functionality. |
| FEC_MDC / FEC_MDIO | Fast Ethernet management interface | Provides IEEE 802.3-compliant MDIO serial interface to configure external PHY devices (e.g., DP83848) without GPIO bit-banging. |
| CAN0_TX / CAN0_RX | Channel 0 CAN differential pair | Direct connection to external CAN transceiver (e.g., TJA1042); supports dominant/recessive bit timing per ISO 11898-1 with automatic error frame generation. |
| PSC0_TX / PSC0_RX | Programmable Serial Controller 0 | Configurable as UART, SPI master/slave, or I²S codec interface - enables single-pin reuse for modem, audio, or sensor communication paths. |
Key Features
| Feature | Design Value |
|---|---|
| e300 Core with FPU & MMU | Enables full-featured embedded Linux (e.g., MontaVista) with memory protection, virtual addressing, and floating-point math for motion control algorithms. |
| BestComm DMA Subsystem | Offloads FEC, USB, PSC, and ATA data movement using dedicated 16 KB SRAM - reduces CPU utilization by >40% in sustained 100 Mbps Ethernet + USB 1.1 traffic. |
| Dual MSCAN + J1850 BDLC | Supports simultaneous CAN FD-ready network management (via MSCAN) and legacy OBD-II diagnostics (via J1850), critical for Tier-1 automotive ECU consolidation. |
| Integrated ATA Host Controller | Direct IDE interface for 2.5" HDDs or CompactFlash - eliminates external bridge ICs in network-attached storage (NAS) gateways and DVR systems. |
| Flexible External Bus Interface | Eight programmable chip selects with 8/16/32-bit non-multiplexed or multiplexed access - simplifies connection to NOR flash, FPGA configuration PROMs, or legacy parallel peripherals. |
Applications
| Automotive Body Control Module | Industrial PLC Communication Gateway |
|---|---|
Use Scenario: Centralized vehicle module managing door locks, lighting, HVAC, and diagnostic reporting across CAN and LIN networks. IC Role / Device Role / Timing Role: Primary SoC executing AUTOSAR-compliant software stack, coordinating dual CAN channels for powertrain and chassis domains while servicing J1850 diagnostics via BDLC. Use Value: Single-chip integration of CPU, CAN, J1850, and GPIO reduces BOM cost by 35% versus discrete MCU + transceiver solutions and meets ASIL-B functional safety requirements via lockstep-capable peripherals. | Use Scenario: Protocol translation gateway connecting Modbus RTU field devices to EtherNet/IP or PROFINET industrial networks. IC Role / Device Role / Timing Role: Real-time protocol converter with PCI-connected FPGA for custom hardware acceleration and FEC-based Ethernet interface for upstream SCADA connectivity. Use Value: Hardware-accelerated BestComm DMA enables deterministic <100 μs packet forwarding latency between serial and Ethernet interfaces, satisfying IEC 61158 cycle time constraints. |
| Network-Attached Storage Controller | Telecom Access Node Baseband Processor |
Use Scenario: Embedded NAS appliance with dual SATA/IDE drives, Gigabit Ethernet uplink, and USB 1.1 host for printer sharing. IC Role / Device Role / Timing Role: ATA host controller managing IDE hard drives, FEC handling 100 Mbps MII interface, USB OHCI host controlling peripherals, and PCI bus bridging to optional encryption co-processor. Use Value: Integrated ATA + FEC + USB eliminates need for three separate interface ICs, reducing PCB area by 28% and power consumption by 1.2 W versus multi-chip alternatives. | Use Scenario: DSLAM or fiber access node performing voice codec processing, ADSL framing, and management plane communication. IC Role / Device Role / Timing Role: Dual-PSC-based I²S/AC97 audio interface driving analog front-end, PCI-connected DSP for G.711/G.729 compression, and JTAG/COP debug port for field firmware updates. Use Value: On-chip PSCs configured in CODEC master mode eliminate external audio interface ICs, while COP debug port enables secure remote bootloader updates without physical access. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5200BVR400B | Same die, identical electrical specs and pinout; differs only in RoHS compliance marking and traceability documentation per Freescale ordering matrix. | No functional difference; qualified for same automotive and industrial temperature grades (–40°C to +85°C). | Select MPC5200BVR400B when RoHS-6 compliance and full material declaration are contractually required. |
| MPC8349EVM | Higher-performance e300 core (up to 667 MHz), DDR2 support, PCIe instead of PCI, no J1850 or MSCAN - requires PCB redesign and software porting. | Targeted at next-generation telecom gateways requiring >200 Mbps throughput; lacks automotive-specific peripherals. | Choose MPC8349EVM only when migrating to DDR2 memory, PCIe expansion, and higher CPU throughput justifies full hardware/software requalification. |
Compared with MPC5200VR400B, MPC5200BVR400B offers identical functionality with updated environmental compliance, while MPC8349EVM provides higher bandwidth and modern interfaces at the cost of automotive feature support and design continuity.
Availability
MPC5200VR400B is available at Aetrix Electronics and suitable for automotive body control modules, industrial PLC gateways, network-attached storage controllers, and telecom access nodes requiring stable component supply across extended product lifecycles.
Supply support for MPC5200VR400B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MPC5200VR400B belongs to the PowerQUICC II family of integrated communications processors, designed specifically for cost-sensitive, high-reliability embedded systems requiring mixed-signal integration, automotive qualification, and long-term availability.
FAQ
What is the maximum operating temperature range for the MPC5200VR400B?
The MPC5200VR400B is rated for industrial temperature operation from –40°C to +85°C ambient, with a maximum junction temperature of +115°C. This range is validated per Freescale's recommended operating conditions (Table 2, MPC5200BDS Rev. 4), and thermal design must ensure junction temperature remains within limits under worst-case power dissipation - especially in Nap or Doze modes where core PLL remains active.
Does the MPC5200VR400B support DDR2 memory?
No, the MPC5200VR400B supports only SDR SDRAM and DDR SDRAM (not DDR2). Its memory controller is specified for up to 133 MHz operation with DDR SDRAM, and the datasheet explicitly lists "SDRAM and DDR SDRAM support" without DDR2 references. DDR2 compatibility requires newer architectures such as the MPC83xx series.
How many CAN controllers does the MPC5200VR400B integrate?
The MPC5200VR400B integrates two fully independent MSCAN controllers compliant with CAN 2.0A/B protocol, each with dedicated TX/RX pins, message buffers, and acceptance filtering. Both controllers operate simultaneously and support standard (11-bit) and extended (29-bit) identifier frames per ISO 11898-1.
Is the MPC5200VR400B pin-compatible with the MPC5200BVR400B?
Yes, the MPC5200VR400B and MPC5200BVR400B share identical pinout, electrical characteristics, and mechanical package (TEPBGA–272). The suffix difference reflects RoHS compliance status and traceability documentation - not functional or physical divergence - making them drop-in replacements in existing designs.
What debug interfaces are available on the MPC5200VR400B?
The MPC5200VR400B provides IEEE 1149.1 JTAG test access port for boundary scan and emulation, plus a Common On-chip Processor (COP) debug port supporting BDM (Background Debug Mode) for real-time code download, breakpoint insertion, and register inspection - both documented in Section 3.4 of the MPC5200BDS Rev. 4 datasheet.
MPC5200VR400B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 272-BBGA
- Series:
- MPC52xx
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- PowerPC e300
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- DDR, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- USB 1.1 (2)
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 272-PBGA (27x27)
- Additional Interfaces:
- AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
MPC5200VR400B FAQ
1.How can I place an order for MPC5200VR400B through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC5200VR400B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC5200VR400B reliable?
The price and inventory of MPC5200VR400B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC5200VR400B is usually 5 days.
3.What payment methods are accepted for MPC5200VR400B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC5200VR400B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC5200VR400B?
MPC5200VR400B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC5200VR400B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC5200VR400B?
For technical support, including MPC5200VR400B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC5200VR400B requirements.
6.How does Aetrix verify that MPC5200VR400B is sourced from the original manufacturer or authorized distributors?
All MPC5200VR400B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC5200VR400B meets industry standards.
7.What is the process for return or replacement of MPC5200VR400B?
All MPC5200VR400B units undergo pre-shipment inspection (PSI). If there is an issue with MPC5200VR400B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC5200VR400B part is unused and in its original packaging.
Return procedure for MPC5200VR400B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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