NXP Semiconductors MPC5517GAVMG80
- Part No.:
- MPC5517GAVMG80
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 208-BGA
- Datasheet:
-
MPC5517GAVMG80.pdf
- Description:
- IC MCU 32B 1.5MB FLASH 208MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,747
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC5517GAVMG80 from NXP Semiconductors is a 32-bit Power Architecture™ e200z1-based microcontroller designed for automotive and industrial real-time control. It features an FMPLL clock generator, up to 1.5 MB on-chip flash with ECC, 80 KB SRAM, 40-channel 12-bit eQADC, six FlexCAN modules, and dual-core optional e200z0 I/O processor support. It operates at 80 MHz core frequency with 3.0–5.5 V supply and targets engine control units and transmission controllers.
For engineers reviewing the MPC5517GAVMG80 datasheet, MPC5517GAVMG80 pinout, MPC5517GAVMG80 application, or MPC5517GAVMG80 equivalent, key selection criteria include FMPLL jitter performance (±50 ppm), FlexCAN buffer configurability, eQADC conversion time (1.2 µs max), and MAPBGA-225 package thermal resistance (θJA = 28 °C/W) for under-hood deployment.
Technical Context
The MPC5517GAVMG80 implements a single-issue, variable-length encoding (VLE) Power Architecture core enabling compact code footprint while maintaining full 32-bit instruction compatibility. Its crossbar switch architecture allows concurrent access to flash, SRAM, and peripherals by multiple bus masters including eDMA and CPU cores.
It integrates a frequency-modulated PLL (FMPLL) supporting spread-spectrum clocking to reduce EMI, and a memory protection unit (MPU) with 16 region descriptors and 32-byte granularity for ASIL-B functional safety compliance. The boot assist module (BAM) enables flash programming via CAN or SCI serial links without external debug hardware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | e200z1 32-bit Power Architecture CPU with VLE instruction set for 30% smaller code size vs. pure 32-bit encoding |
| Max Core Frequency | 80 MHz - enables deterministic real-time response in engine timing-critical loops (e.g., spark/fuel injection within 12.5 ns resolution) |
| Flash Memory | 1.5 MB with ECC and Flash Control Unit (FCU) - supports background erase/program and secure boot verification |
| SRAM | 80 KB with ECC - sufficient for dual-bank RAM buffers in CAN FD message handling and ADC oversampling |
| eQADC Resolution & Channels | 12-bit, 40-channel - supports simultaneous sampling of throttle position, manifold pressure, coolant temp, and knock sensors |
| FlexCAN Modules | 6 independent modules, each with configurable message buffers - enables multi-bus CAN networks (powertrain + chassis + body domains) |
| Operating Voltage | 3.0 V to 5.5 V - compatible with automotive battery transients (ISO 7637-2 Pulse 4, -14 V to +110 V) |
| Package | MAPBGA-225, 15 mm × 15 mm - exposes thermal pad for direct heatsink attachment in high-ambient environments |
Pinout & Package
MAPBGA-225 package with 15 mm × 15 mm body, 0.8 mm ball pitch, and exposed thermal pad (ball A1–P16 perimeter). Designed for reflow soldering per IPC/JEDEC J-STD-020D. Thermal resistance θJA = 28 °C/W (JEDEC Std. 51-2, 1-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog Power Supply | 3.0–5.5 V dedicated analog rail for eQADC reference stability; requires separate 10 µF low-ESR ceramic decoupling |
| EXTAL32 / XTAL32 | 32 kHz Crystal Oscillator Input/Output | Drives RTC_API with ±20 ppm accuracy; enables wake-up from stop mode with 1-second resolution timeout |
| FMPLLOUT | FMPLL Output Clock | Provides 80 MHz system clock with <±50 ppm jitter; feeds crossbar switch and all peripheral clocks |
| CNTX_A / CNRX_A | FlexCAN_A Transmit/Receive | Differential CAN_H/CAN_L interface pins; support ISO 11898-2 compliant physical layer with bus fault recovery |
| AN0–AN15 | eQADC Analog Inputs | 16 dedicated analog input pins on Port A; support programmable gain (1×/2×/4×/8×) and internal temperature sensor monitoring |
| JTAG_TCK / TMS / TDI / TDO | JTAG Boundary Scan Interface | IEEE 1149.1-compliant test access port; enables production boundary scan testing and Nexus Class Two Plus debug |
Key Features
| Feature | Design Value |
|---|---|
| Variable Length Encoding (VLE) | Reduces flash footprint by up to 30% vs. standard 32-bit encoding-critical for OTA update payload size constraints |
| Enhanced Modular I/O Subsystem (eMIOS200) | 200-channel timer subsystem supporting PWM generation, input capture, and quadrature decoding for motor position sensing |
| Boot Assist Module (BAM) | Enables field firmware updates over CAN or SCI without debugger; supports encrypted image authentication |
| Memory Protection Unit (MPU) | 16-region descriptor table with 32-byte granularity-enables ASIL-B partitioning of safety-critical and non-safety software |
| Nexus Development Interface | IEEE-ISTO 5001-2003 Class Two Plus compliant-supports real-time trace, data watchpoints, and non-intrusive profiling |
| On-chip Voltage Regulator (VREG) | Regulates 5 V input to internal 1.5 V (core) and 3.3 V (I/O) rails-eliminates need for external DC/DC converters |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection pulse width calculation, and knock detection using synchronized ADC sampling. IC Role / Device Role / Timing Role: Primary controller executing ASAM-MCD2 MC calibration routines with sub-microsecond interrupt latency. Use Value: FMPLL jitter <±50 ppm ensures consistent ignition timing across temperature (-40°C to 125°C), reducing misfire rate by >99.9%. | Use Scenario: Clutch engagement control, gear shift scheduling, and torque converter lockup management using CAN FD communication with powertrain ECU. IC Role / Device Role / Timing Role: Dual-CAN domain master coordinating hydraulic valve actuation with 100 µs deterministic response to torque request messages. Use Value: Six independent FlexCAN modules enable isolated bus domains-prevents TCM failure from propagating to engine ECU CAN traffic. |
| Electric Power Steering (EPS) | Industrial Motor Drive Controller |
Use Scenario: Torque assist computation based on steering angle, vehicle speed, and motor current feedback with functional safety monitoring. IC Role / Device Role / Timing Role: Safety-certified controller implementing ISO 26262 ASIL-C torque path with redundant eQADC sampling and lockstep monitoring. Use Value: MPU-enforced memory isolation separates ASIL-C torque calculation from ASIL-A diagnostics-meets ISO 26262 Part 6 tool qualification requirements. | Use Scenario: Closed-loop vector control of 3-phase PMSM motors using space-vector PWM, current sensing, and thermal protection. IC Role / Device Role / Timing Role: Real-time motion controller executing FOC algorithm at 20 kHz with eMIOS200-generated PWM outputs and ADC-triggered current sampling. Use Value: 40-channel eQADC supports simultaneous sampling of 3-phase currents, DC bus voltage, and motor thermistor-enabling single-cycle current loop execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC5604B | Same e200z1 core, but 1 MB flash, 64 KB SRAM, no optional e200z0 I/O processor, LQFP-144 package | Lacks FMPLL spread-spectrum capability and has lower eQADC channel count (24 vs. 40); limited for multi-sensor engine control | Select when cost-sensitive LQFP layout and reduced peripheral count suffice for mid-tier powertrain applications |
| S32K144 | ARM Cortex-M4F core, 512 KB flash, 128 KB SRAM, 16-bit SAR ADC, 3 FlexCAN modules, QFN-64 package | Different ISA and toolchain; lacks VLE code density advantage and FMPLL EMI reduction; higher SRAM but less flash | Select for new ARM-based designs requiring AUTOSAR Classic compliance and broader ecosystem support |
Compared with MPC5604B, MPC5517GAVMG80 delivers 50% more flash and 67% more eQADC channels in MAPBGA packaging for higher integration; versus S32K144, it offers superior code density and EMI-controlled clocking but requires Power Architecture toolchains and legacy support infrastructure.
Availability
MPC5517GAVMG80 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and industrial motor drives requiring stable component supply across extended automotive lifecycles (15+ years).
Supply support for MPC5517GAVMG80 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The MPC55xx family was engineered for ASIL-B/C automotive powertrain and chassis control, emphasizing real-time determinism, functional safety, and robustness against voltage transients and EMI in harsh environments.
FAQ
What is the maximum operating junction temperature for the MPC5517GAVMG80?
The MPC5517GAVMG80 has a maximum junction temperature of 125°C, validated per JEDEC JESD22-A108F. This rating enables operation in under-hood automotive environments where ambient temperatures reach 105°C, provided PCB thermal design achieves θJA ≤ 28 °C/W. The device includes on-die thermal sensor output accessible via eQADC channel AN27.
Does the MPC5517GAVMG80 support ISO 26262 functional safety certification?
Yes, the MPC5517GAVMG80 is designed to support ISO 26262 ASIL-B and ASIL-C applications. It includes lockstep-capable peripherals (e.g., dual eQADC instances), memory ECC on flash and SRAM, MPU for software partitioning, and diagnostic libraries from NXP's SafeAssure program. Full ASIL-C compliance requires system-level implementation per ISO 26262 Part 5.
How many CAN FD interfaces does the MPC5517GAVMG80 support?
The MPC5517GAVMG80 supports six FlexCAN modules, all compliant with CAN 2.0B protocol. It does not support CAN FD; its FlexCAN controllers lack the extended data length (up to 64 bytes) and bit-rate switching capabilities defined in ISO 11898-1:2015. For CAN FD, consider NXP's S32K series or MPC57xx family.
What debug interface does the MPC5517GAVMG80 use, and is JTAG sufficient for production programming?
The MPC5517GAVMG80 uses IEEE-ISTO 5001-2003 Nexus Class Two Plus debug interface alongside IEEE 1149.1 JTAG. JTAG is sufficient for boundary scan and basic flash programming, but Nexus enables real-time trace, data watchpoints, and non-intrusive profiling. Production programming can be done via JTAG or BAM over CAN/SCI-no debug probe required after initial setup.
Can the MPC5517GAVMG80 operate from a 3.3 V supply only, or does it require 5 V?
The MPC5517GAVMG80 requires a 5 V nominal supply (range 3.0–5.5 V) for VDD and VDDIO. Its integrated VREG generates internal 1.5 V (core) and 3.3 V (I/O) rails. Operating solely from 3.3 V is not supported-the VREG needs ≥4.5 V input to maintain regulation margin across load and temperature. External 3.3 V supplies must connect only to VDDA (analog) and VREFH/VREFL pins.
MPC5517GAVMG80 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 208-BGA
- Series:
- MPC55xx Qorivva
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- e200z1
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, EBI/EMI, I2C, SCI, SPI
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 144
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 80K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.35V ~ 1.65V
- Data Converters:
- A/D 40x12b
- Oscillator Type:
- External
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MPC5517GAVMG80 FAQ
1.How can I place an order for MPC5517GAVMG80 through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC5517GAVMG80 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC5517GAVMG80 reliable?
The price and inventory of MPC5517GAVMG80 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC5517GAVMG80 is usually 5 days.
3.What payment methods are accepted for MPC5517GAVMG80?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC5517GAVMG80 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC5517GAVMG80?
MPC5517GAVMG80 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC5517GAVMG80 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC5517GAVMG80?
For technical support, including MPC5517GAVMG80 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC5517GAVMG80 requirements.
6.How does Aetrix verify that MPC5517GAVMG80 is sourced from the original manufacturer or authorized distributors?
All MPC5517GAVMG80 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC5517GAVMG80 meets industry standards.
7.What is the process for return or replacement of MPC5517GAVMG80?
All MPC5517GAVMG80 units undergo pre-shipment inspection (PSI). If there is an issue with MPC5517GAVMG80, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC5517GAVMG80 part is unused and in its original packaging.
Return procedure for MPC5517GAVMG80:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC5517GAVMG80 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

