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NXP Semiconductors MPC555LFAZP40

Part No.:
MPC555LFAZP40
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
272-BBGA
Datasheet:
AetrixMPC555LFAZP40.pdf
Description:
IC MCU 32BIT 448KB FLASH 272PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,192

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Product details

Overview

MPC555LFAZP40 from Freescale Semiconductor is a 32-bit PowerPC RISC microcontroller with integrated floating-point unit, designed for high-reliability automotive powertrain and industrial control systems. It features 448 KB Flash EEPROM, 26 KB SRAM, dual CAN 2.0B controllers (TouCAN), dual queued ADCs (QADC64) supporting 32 analog inputs, and operates at 40 MHz across –40 °C to 125 °C with dual 3.3 V/5 V supply.

For engineers reviewing the MPC555LFAZP40 datasheet, MPC555LFAZP40 pinout, MPC555LFAZP40 application, or MPC555LFAZP40 equivalent, key selection criteria include its 272-pin PBGA package, 5-V tolerant I/O, TPU3-based real-time timer subsystem, QSMCM serial interface, and support for IEEE 1149.1 JTAG debugging in safety-critical embedded environments.

Technical Context

The MPC555LFAZP40 implements a static, fully compliant PowerPC ISA core with double-precision FPU and precise exception handling. Its memory architecture includes two independent Flash modules (256 KB + 192 KB), dual SRAM banks (16 KB + 10 KB), and 6 KB DPTRAM shared between two TPU3 units.

Peripheral integration centers on deterministic real-time subsystems: dual TouCAN controllers with 16-message buffers each, two QADC64 modules delivering 10-bit conversions at 100 kSPS, and MIOS1 providing 18-channel PWM and modular I/O - all synchronized via the USIU clock synthesizer and hardware bus monitor.

Key Specifications

ParameterValue and Actual Design Meaning
Core Architecture32-bit PowerPC ISA-compliant RISC core with integrated double-precision FPU
Operating Frequency40 MHz maximum - enables deterministic real-time execution at 52.7-Kbyte Dhrystone v2.1 performance
Flash Memory448 KB total (256 KB + 192 KB modules), block-erasable (32 KB), 5-V program/erase supply required
Analog Inputs32 total channels via dual QADC64 modules; 10-bit resolution, 10 µs typical conversion time
CAN InterfacesDual TouCAN 2.0B controllers - each supports 16 message buffers, time-stamping, and low-power wake-on-bus-activity
Package272-pin plastic ball grid array (PBGA), 27 × 27 mm body, 1.27 mm pitch
Temperature Range–40 °C to +125 °C (industrial/automotive grade); dual-supply operation (3.3 V core, 5 V I/O)

Pinout & Package

272-pin PBGA (plastic ball grid array), 27 × 27 mm, 1.27 mm pitch, RoHS-compliant. Pin mapping defined per Freescale MPC555 Ball Map (Rev. 10.2, 1997).

Pin/TerminalCircuit RoleDesign Meaning
VDDH5 V I/O power supplySupplies 5 V to all I/O buffers and peripheral interfaces; tolerant of 5 V logic levels
VDDL / VDDI3.3 V core & SRAM powerSeparate 3.3 V domains for CPU core, cache, and internal RAM - enables mixed-voltage system design
A_CNRX0 / A_CNTX0CAN A transceiver interfaceDifferential CAN bus pins for Controller Area Network Channel A; require external transceiver
B_CNRX0 / B_CNTX0CAN B transceiver interfaceDedicated differential pair for second CAN 2.0B channel - supports redundant or multi-bus architectures
ETRIG1 / ETRIG2External trigger inputsSynchronize TPU3 event capture or QADC conversion start with external system signals
TCK / TMS / TDI / TDO / TRST_BJTAG boundary-scan interfaceIEEE 1149.1-compliant test access port for in-circuit debugging, emulation, and production testing

Key Features

FeatureDesign Value
Dual TouCAN 2.0B controllersEnables concurrent communication on two isolated CAN buses - critical for engine control + chassis network separation
TPU3 real-time timer subsystemTwo independent micro-engines with 16 programmable channels each - offloads timing-critical tasks from CPU
QADC64 dual analog converter32-channel 10-bit sampling at 100 kSPS with dual command queues - supports sensor fusion in closed-loop control
USIU clock & power managementIntegrated clock synthesizer, watchdog timer, and reset controller - reduces external timing components and improves system reliability
Memory protection unit (MPU)Eight configurable regions (4 instruction + 4 data), 4 KB–16 MB size range - enforces software partitioning for ASIL-B compliance

Applications

Engine Control Unit (ECU)Transmission Control Module (TCM)

Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection using crank/cam position and cylinder pressure sensors.

IC Role / Device Role / Timing Role: Primary MCU executing deterministic control loops with sub-microsecond interrupt latency via TPU3 and QADC64.

Use Value: 40 MHz PowerPC core + dual CAN ensures synchronized actuator commands and diagnostic reporting across powertrain networks.

Use Scenario: Gear shift scheduling, clutch pressure modulation, and torque converter lock-up control using transmission speed, temperature, and hydraulic pressure inputs.

IC Role / Device Role / Timing Role: Central controller managing MIOS1 PWM outputs for solenoid drivers and QSMCM SPI for sensor hub communication.

Use Value: 18-channel MIOS1 provides dedicated PWM generation without CPU overhead; dual CAN enables TCM-to-ECU coordination.

Industrial Motor DriveHeavy-Duty Vehicle Telematics Gateway

Use Scenario: Field-oriented control (FOC) of 3-phase AC induction motors using current/voltage feedback and encoder position data.

IC Role / Device Role / Timing Role: Real-time motion controller interfacing with gate drivers via MIOS1 PWM and acquiring analog feedback via QADC64.

Use Value: TPU3's event-triggered capture and compare registers enable precise dead-time insertion and commutation timing.

Use Scenario: Aggregating CAN bus data from engine, brakes, and cab systems for wireless transmission to fleet management servers.

IC Role / Device Role / Timing Role: Protocol gateway bridging multiple CAN networks and formatting data for cellular modem via QSMCM or SCI interfaces.

Use Value: Dual TouCAN + QSMCM + SCI allows simultaneous multi-network monitoring and buffered serial uplink - minimizing host processor load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC5554LFAZP40Enhanced version with larger Flash (1.5 MB), added Ethernet MAC, and updated BDM interface; same PBGA-272 packageTargets next-gen powertrain ECUs requiring OTA updates and network diagnosticsSelect when needing >448 KB code space or Ethernet connectivity - not drop-in compatible due to peripheral register map changes
MPC5604BSuccessor family with e200z0 core, 512 KB Flash, single CAN, no TPU3; 144-pin LQFP packageCost-sensitive mid-tier automotive modules where dual CAN and advanced timing are not requiredChoose for simplified layout and lower BOM cost - requires PCB redesign and firmware adaptation

Compared with MPC555LFAZP40, MPC5554LFAZP40 offers scalable Flash and Ethernet but demands firmware revalidation, while MPC5604B reduces footprint and cost at the expense of real-time peripheral depth and dual-CAN capability - making MPC555LFAZP40 optimal for legacy-compliant, high-determinism powertrain designs.

Availability

MPC555LFAZP40 is available at Aetrix Electronics and suitable for automotive powertrain control, industrial motor drives, and heavy-vehicle telematics gateways requiring stable component supply and long-term lifecycle support.

Supply support for MPC555LFAZP40 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors and analog devices for automotive, industrial, and networking markets.

The MPC500 family - including MPC555LFAZP40 - was engineered specifically for deterministic, high-integrity real-time control in engine management, transmission, and braking systems.

FAQ

What is the operating voltage range for MPC555LFAZP40?

The MPC555LFAZP40 requires dual supply rails: 3.3 V ±0.3 V for VDDL/VDDI (core and SRAM) and 4.75 V–5.25 V for VDDH (I/O and Flash programming). This split-rail design enables 5-V tolerant digital interfaces while maintaining low-power core operation - essential for compatibility with legacy automotive sensors and actuators.

Does MPC555LFAZP40 support JTAG debugging?

Yes, MPC555LFAZP40 integrates a full IEEE 1149.1 JTAG test access port (TAP) with TCK, TMS, TDI, TDO, and TRST_B pins. It supports on-chip emulation, breakpoint/watchpoint triggering, and program flow tracing via the BDM interface - enabling robust development and validation of safety-critical firmware for MPC555LFAZP40-based systems.

What is the maximum analog input sampling rate of MPC555LFAZP40?

The MPC555LFAZP40's dual QADC64 modules achieve a typical conversion time of 10 µs per sample, supporting up to 100,000 samples per second per module. With 32 total analog inputs and dual command queues, MPC555LFAZP40 delivers sustained high-throughput acquisition for multi-sensor closed-loop control applications such as engine air-fuel ratio management.

Is MPC555LFAZP40 pin-compatible with other MPC555 variants?

Yes, MPC555LFAZP40 shares the identical 272-pin PBGA package and pinout with all MPC555 family members including MPC555LFAZP50 and MPC555MFABZP40. Differences lie in speed grade (40 MHz vs. 50 MHz), temperature range (–40°C to 125°C), and Flash configuration - allowing direct substitution where timing and thermal requirements align.

How does the TPU3 subsystem enhance real-time performance in MPC555LFAZP40?

The MPC555LFAZP40 integrates two independent TPU3 modules, each with a dedicated micro-engine and 16 programmable channels. These operate autonomously from the main CPU, handling precise edge capture, pulse-width modulation, and waveform generation - reducing interrupt latency and freeing the PowerPC core for higher-level control algorithms in MPC555LFAZP40-based systems.

MPC555LFAZP40 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
272-BBGA
Series:
MPC5xx
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
PowerPC
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
101
Program Memory Size:
448KB (448K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
26K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x10b
Oscillator Type:
External
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

MPC555LFAZP40 FAQ

1.How can I place an order for MPC555LFAZP40 through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC555LFAZP40 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC555LFAZP40 reliable?

The price and inventory of MPC555LFAZP40 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC555LFAZP40 is usually 5 days.

3.What payment methods are accepted for MPC555LFAZP40?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC555LFAZP40 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC555LFAZP40?

MPC555LFAZP40 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC555LFAZP40 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC555LFAZP40?

For technical support, including MPC555LFAZP40 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC555LFAZP40 requirements.

6.How does Aetrix verify that MPC555LFAZP40 is sourced from the original manufacturer or authorized distributors?

All MPC555LFAZP40 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC555LFAZP40 meets industry standards.

7.What is the process for return or replacement of MPC555LFAZP40?

All MPC555LFAZP40 units undergo pre-shipment inspection (PSI). If there is an issue with MPC555LFAZP40, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC555LFAZP40 part is unused and in its original packaging.

Return procedure for MPC555LFAZP40:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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