NXP Semiconductors MPC7410HX450LE

Overview

MPC7410HX450LE from Freescale Semiconductor is a 450 MHz PowerPC G4 RISC microprocessor with AltiVec SIMD engine, 32 KB L1 instruction and data caches, integrated L2 cache controller, and MPX bus interface. It operates at 1.8 V core voltage, supports 32-bit address/64-bit data bus, and targets high-performance embedded computing, digital signal processing, and network infrastructure applications.

For engineers reviewing the MPC7410HX450LE datasheet, MPC7410HX450LE pinout, MPC7410HX450LE application, or MPC7410HX450LE equivalent, this page delivers verified electrical specs, thermal limits, bus timing parameters, L2 interface configuration options, and validated alternative processors for migration or second-sourcing in legacy PowerPC-based systems.

Technical Context

The MPC7410HX450LE implements the full PowerPC 32-bit architecture with hardware multiprocessing support via five-state MESI+ cache coherency protocol and dual-issue out-of-order execution. Its AltiVec unit provides full 128-bit vector processing with dedicated permute and ALU pipelines, while the memory subsystem features nonblocking L1 caches and configurable external L2 SRAM interface supporting 512 KB–2 MB capacity.

It uses a 0.18 µm CMOS process with 10.5 million transistors on a 52 mm² die, packaged in a 360-ball HCTE_CBGA. Core-to-bus frequency multipliers range from 2× to 9×, enabling 450 MHz core operation from 50–225 MHz SYSCLK inputs, with PLL-relock time ≤100 µs after power-on reset.

Key Specifications

Pinout & Package

Package: 360-ball High Coefficient of Thermal Expansion Ceramic Ball Grid Array (HCTE_CBGA), 27 mm × 27 mm footprint, lead-free C5 spheres. Pinout conforms to MPC7410EC Rev. 6.1 specification with 360 I/O balls including 32 address, 64 data, 19 L2 address, 64/32 L2 data, PLL control, JTAG, and thermal/power management signals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MPC7410HX450LE, MPC7455EC offers higher clock rate and on-die L2 but requires updated thermal design; PPC440EP sacrifices AltiVec and frequency for integration and power savings, making it suitable for greenfield embedded control rather than G4 upgrade paths.

Availability

MPC7410HX450LE is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, digital signal processing, and legacy PowerPC system upgrades requiring stable component supply and long-term lifecycle support.

Supply support for MPC7410HX450LE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a leading designer of embedded processors, analog, and connectivity solutions before its acquisition by NXP Semiconductors in 2015. It pioneered the PowerPC architecture for high-performance computing and automotive applications.

The MPC7410HX450LE belongs to Freescale's G4 PowerPC microprocessor family, engineered for demanding embedded computing environments requiring high integer/FPU throughput, SIMD acceleration, and hardware multiprocessing - especially in telecom, aerospace, and industrial automation.

FAQ

What is the maximum guaranteed operating frequency of the MPC7410HX450LE?

The MPC7410HX450LE is binned and tested to guarantee stable operation at 450 MHz under recommended conditions: VDD = 1.8 V ± 100 mV, junction temperature ≤ 105°C, and SYSCLK input meeting AC timing specs (tSYSCLK ≤ 30 ns). This rating is confirmed in Table 7 of the MPC7410EC Rev. 6.1 datasheet and applies across all supported bus ratios and I/O voltage configurations.

Does the MPC7410HX450LE support pin-compatible replacement of earlier MPC7400 or MPC750 processors?

Yes, the MPC7410HX450LE uses the same 360-ball HCTE_CBGA package and MPX bus interface as MPC7400 and MPC750, enabling mechanical and electrical compatibility. However, MPC7410HX450LE adds AltiVec, modifies L2 interface signaling, and removes 3.3 V L2 I/O support - requiring firmware and board-level validation for full functional replacement.

What L2 cache configurations does the MPC7410HX450LE support?

The MPC7410HX450LE supports external L2 SRAM in capacities of 512 KB, 1 MB, or 2 MB, with two-way set-associative mapping and sectored line sizes of 32/64/128 bytes respectively. It also supports direct-mapped SRAM modes (256 KB–2 MB) and configurable core-to-L2 frequency divisors (÷1 to ÷4), all controlled via L2CR register settings in software.

How does the MPC7410HX450LE manage power in low-duty-cycle applications?

The MPC7410HX450LE implements three static power-saving modes: Doze (core clock stopped), Nap (core and bus clocks stopped), and Sleep (PLL/DLL disabled, <1.1 W max). In Sleep mode with PLL/DLL disabled, typical power drops to 600 mW - verified in Table 6 of the MPC7410EC Rev. 6.1 datasheet - making it suitable for intermittently active embedded systems.

Is JTAG debugging supported on the MPC7410HX450LE, and what standards does it comply with?

Yes, the MPC7410HX450LE includes full IEEE Std 1149.1™ JTAG boundary scan support via dedicated TMS, TCK, TDI, and TDO pins. It enables structural testing, in-circuit debugging, and flash programming. The JTAG interface operates at the 1.8 V I/O voltage mode regardless of BVSEL/L2VSEL settings when EXTEST or CLAMP instructions are loaded, as specified in Table 5 footnote 8.