NXP Semiconductors MPC7410THX400LE

Overview

MPC7410THX400LE from Freescale Semiconductor is a 400 MHz PowerPC G4 RISC microprocessor implementing the full 32-bit PowerPC architecture with AltiVec™ SIMD engine, 32 KB L1 instruction and data caches, and an external L2 cache interface supporting up to 2 MB. It features a five-state cache coherency protocol, hardware multiprocessing support, and operates at 1.8 V core voltage for embedded computing and high-performance control applications.

For engineers reviewing the MPC7410THX400LE datasheet, MPC7410THX400LE pinout, MPC7410THX400LE application, or MPC7410THX400LE equivalent, this page delivers verified electrical specs, thermal characteristics, bus timing constraints, package mapping, and real-world deployment context for system integration, thermal design, and legacy PowerPC platform migration.

Technical Context

The MPC7410THX400LE implements a superscalar, out-of-order execution pipeline with dual integer units (FXU1/FXU2), a three-stage floating-point unit delivering one-cycle throughput for single- and double-precision IEEE 754 operations, and a dedicated 128-bit AltiVec unit with separate permute and ALU subunits. Its completion queue holds eight entries, enabling peak two-instruction-per-cycle completion in program order.

It integrates a 32 KB eight-way set-associative L1 instruction cache and 32 KB eight-way set-associative L1 data cache, both with single-cycle access, plus an external L2 cache interface supporting 32-/64-/128-byte line sizes, configurable direct-mapped SRAM mode, and core-to-L2 frequency divisors of ÷1 through ÷4. The MPX bus extension provides mode-compatible 60x interface with 32-bit address/64-bit data width and selectable I/O voltages (1.8 V / 2.5 V / 3.3 V).

Key Specifications

Pinout & Package

Package: 360-ball Ceramic Ball Grid Array (CBGA), surface-mount, 27 mm × 27 mm body, 1.27 mm ball pitch, JEDEC MO-195 compliant. Thermal pad on underside; requires controlled reflow profile per Freescale SMD-001.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MPC7400TJX400LE, the MPC7410THX400LE adds essential AltiVec capability and L2 flexibility at modest thermal cost; versus MPC7450THX500LE, it trades peak frequency for proven reliability and lower system-level cooling demands in volume-deployed avionics and industrial platforms.

Availability

MPC7410THX400LE is available at Aetrix Electronics and suitable for avionics data acquisition, industrial motion control, broadcast video encoding, and secure communications terminals requiring stable component supply across extended product lifecycles.

Supply support for MPC7410THX400LE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC7410THX400LE belongs to Freescale's PowerPC G4 family, engineered specifically for high-reliability embedded computing where deterministic real-time performance, hardware multiprocessing, and AltiVec-accelerated signal processing are mandatory.

FAQ

What is the maximum supported L2 cache size for the MPC7410THX400LE?

The MPC7410THX400LE supports external L2 cache configurations up to 2 MB in two-way set-associative mode, with optional direct-mapped SRAM support for 256 KB, 512 KB, 1 MB, or 2 MB. Line sizes are configurable as 32 bytes (512 KB), 64 bytes (1 MB), or 128 bytes (2 MB), and core-to-L2 frequency divisors include ÷1, ÷1.5, ÷2, ÷2.5, ÷3, ÷3.5, and ÷4. This flexibility allows tuning memory bandwidth to match application-specific throughput needs without changing the MPC7410THX400LE silicon.

Does the MPC7410THX400LE support 3.3 V I/O on both processor and L2 buses?

No. The MPC7410THX400LE supports 3.3 V I/O only on the processor bus (via BVSEL = ¬HRESET or BVSEL = 1), while the L2 bus interface removed 3.3 V support entirely - L2OVDD must be 1.8 V or 2.5 V (L2VSEL = 0 or HRESET/1). This reflects the G4 architecture's shift toward lower-voltage, higher-speed memory subsystems. Using 3.3 V on the processor bus requires Mxx7410xxnnnLE Rev. 1.4 or later; earlier revisions do not support this mode and default to 2.5 V.

How does the MPC7410THX400LE handle cache coherency in multiprocessor systems?

The MPC7410THX400LE implements a five-state cache coherency protocol (MESI plus Shared Intervention) that enables full hardware-managed symmetric multiprocessing. This eliminates software-based cache flushes and invalidations, allowing multiple MPC7410THX400LE processors to share memory coherently with deterministic latency. Snooping is performed on both L1 data cache tags and external buses, and the protocol supports atomic read-modify-write operations essential for real-time control and safety-critical applications.

What are the thermal design implications of the MPC7410THX400LE's 400 MHz rating?

At 400 MHz, the MPC7410THX400LE has a typical power dissipation of 4.2 W and maximum of 9.5 W in Full-On mode. Its 360-ball CBGA package exhibits RθJMA = 18°C/W under natural convection on a four-layer board, meaning junction temperature rise can exceed 75°C above ambient without forced airflow. Successful thermal design requires a 2-oz copper thermal pad, ≥4 thermal vias under the package, and either 1 m/sec airflow (reducing RθJMA to 14°C/W) or a heatsink rated ≤12°C/W to maintain Tj ≤ 105°C under worst-case load.

Can the MPC7410THX400LE operate with different core and I/O supply voltages simultaneously?

Yes. The MPC7410THX400LE mandates 1.8 V ± 100 mV for VDD, AVDD, and L2AVDD (core and PLL rails), while OVDD (processor bus I/O) and L2OVDD (L2 bus I/O) may be independently set to 1.8 V, 2.5 V, or (for OVDD only) 3.3 V. This separation allows interfacing with legacy 3.3 V peripherals via the processor bus while using modern 1.8 V SRAM for L2 cache - a key enabler for phased system upgrades without full redesign. Voltage select pins BVSEL and L2VSEL must be stable at HRESET negation and cannot change during operation.