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NXP Semiconductors MPC745BVT300LE

Part No.:
MPC745BVT300LE
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
255-BBGA, FCBGA
Datasheet:
AetrixMPC745BVT300LE.pdf
Description:
IC MPU MPC7XX 300MHZ 255FCPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,010

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Product details

Overview

MPC745BVT300LE from Freescale Semiconductor is a 300 MHz PowerPC™ RISC microprocessor implementing the 60x bus architecture, featuring a 32 KB instruction cache, 32 KB data cache, and no L2 cache interface - distinguishing it from the MPC755. It operates at 2.0 V core voltage with 2.5 V or 3.3 V I/O support and targets low-power embedded control in networking edge devices, industrial controllers, and telecom line cards.

For engineers reviewing the MPC745BVT300LE datasheet, MPC745BVT300LE pinout, MPC745BVT300LE application, or MPC745BVT300LE equivalent, key selection criteria include its lack of L2 cache interface, PBGA-255 package, 300 MHz core frequency with 25–100 MHz SYSCLK range, thermal management assist unit (TAU), and support for doze/nap/sleep power states - all critical for thermally constrained, cost-sensitive PowerPC-based designs.

Technical Context

The MPC745BVT300LE implements the PowerPC instruction set architecture with a dual-integer-unit (FXU1/FXU2) and IEEE 754-compliant floating-point unit, supporting single- and double-precision arithmetic. Its memory management includes 128-entry two-way set-associative TLBs and eight BATs per domain, enabling up to 4 GB physical addressing.

It integrates a JTAG/COP debug interface, time base counter/decrementer, clock multiplier, and hardware performance monitor. Unlike the MPC755, it omits the L2 cache controller, L2 tags, and L2 bus interface - confirmed by Freescale documentation stating "MPC745 is identical to the MPC755 except it does not support the L2 cache interface."

Key Specifications

ParameterValue and Actual Design Meaning
Core Frequency300 MHz - fixed maximum operating speed; determines instruction throughput and real-time response latency in deterministic control loops.
Core Supply Voltage2.0 V ± 100 mV - strict regulation required; deviation beyond tolerance risks timing violations or functional failure.
I/O Voltage Options2.5 V or 3.3 V - selected via BVSEL pin at power-on; defines signal swing and compatibility with legacy or modern peripheral buses.
L1 Cache32 KB instruction + 32 KB data, 8-way set-associative - enables high hit rates for compact firmware and real-time data buffers without external SRAM dependency.
Power StatesDoze, Nap, Sleep - reduces dynamic and leakage power during idle periods; Sleep mode draws ≤550 mW, critical for fanless enclosures.
Thermal SensorOn-die TAU with ±12°C accuracy - provides junction temperature feedback for software thermal throttling or shutdown before 105°C max Tj is exceeded.
Bus Interface60x-compatible 32-bit address / 64-bit data bus - ensures interoperability with standard PowerPC system logic, memory controllers, and bridge chips.

Pinout & Package

The MPC745BVT300LE is housed in a surface-mount 255-ball plastic ball grid array (PBGA) package with 1.27 mm pitch, optimized for thermal dissipation and board-level reliability in industrial environments.

Pin/TerminalCircuit RoleDesign Meaning
VDDCore power supplyMust be regulated to 2.0 V ± 100 mV; decoupling required within 10 mm of each VDD ball to suppress switching noise.
OVDDI/O power supplySupplies 2.5 V or 3.3 V to processor bus drivers; voltage level selected by BVSEL pin state at reset.
SYSCLKSystem clock inputAccepts 25–100 MHz differential or single-ended clock; jitter ≤ ±150 ps ensures PLL lock stability and timing margin.
HRESETHardware reset inputActive-low asynchronous reset; must be held for ≥255 bus clocks after PLL relock to guarantee full initialization.
TAU_THERMThermal sensor outputAnalog voltage proportional to die temperature; read via ADC or dedicated TAU registers (THRM0–THRM3) for closed-loop thermal control.
TDI/TDO/TCK/TMSJTAG boundary scanIEEE 1149.1 interface for in-circuit test, debug, and flash programming; requires 10 kΩ pull-up on TCK.

Key Features

FeatureDesign Value
Floating-point unitIEEE 754 single/double-precision support with hardware divide and denormal handling - enables real-time signal processing without software emulation overhead.
Branch prediction512-entry BHT + 64-entry BTIC - reduces pipeline stalls in interrupt-driven code and nested loop execution typical in protocol stacks.
Memory management128-entry dual TLBs + 8 BATs per domain - supports MMU-enabled OSes (e.g., VxWorks, Linux) with fast context switching and memory protection.
Cache lockingSelectable per-cache-way locking - guarantees deterministic access latency for critical ISR code or real-time buffers, eliminating cache eviction uncertainty.
Power managementHardware-managed doze/nap/sleep modes with wake-on-interrupt - extends uptime in battery-backed or energy-harvested edge nodes without sacrificing responsiveness.

Applications

Industrial PLC ControllerTelecom Line Card

Use Scenario: Real-time motion control and I/O scanning in factory automation systems with deterministic cycle times under 1 ms.

IC Role / Device Role / Timing Role: Main CPU executing ladder logic and fieldbus protocol stacks (e.g., EtherCAT, Profibus) with tight interrupt latency.

Use Value: 300 MHz core + cache locking ensures sub-microsecond ISR response; thermal sensor prevents derating in sealed cabinets.

Use Scenario: Packet classification and header manipulation in DSLAM or ONU line cards with multi-service QoS requirements.

IC Role / Device Role / Timing Role: Control-plane processor managing ATM/PTM framing, statistics collection, and SNMP agent tasks.

Use Value: 64-bit data bus and 60x interface enable high-throughput register access to external TCAMs and packet buffers; sleep mode reduces standby power.

Network Edge RouterAvionics Data Concentrator

Use Scenario: Low-footprint branch office router running routing protocols (OSPF, BGP) and firewall policy enforcement.

IC Role / Device Role / Timing Role: Embedded host processor interfacing with network PHYs and crypto accelerators via 60x bus.

Use Value: Dual FXUs and FPU accelerate route table lookups and encryption key generation; JTAG enables field firmware updates.

Use Scenario: ARINC 429/664 data aggregation in regional aircraft, consolidating sensor inputs for flight control computers.

IC Role / Device Role / Timing Role: Safety-critical deterministic node executing DO-254-compliant firmware with certified worst-case execution time.

Use Value: Fully-static design and thermal monitoring meet RTCA/DO-160 environmental stress requirements; PBGA package withstands vibration and thermal cycling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MPC745BVT350LE350 MHz core frequency; identical PBGA-255 package, cache, and feature set - only difference is higher binning grade.Higher throughput for compute-intensive packet inspection or encryption; same PCB layout and thermal profile.Select when >300 MHz sustained IPC is required without changing board design or cooling solution.
MPC7447A450 MHz core, integrated L2 cache (256 KB), enhanced FPU, and lower 1.0 V core voltage - newer generation with superscalar improvements.Enables richer OS support and faster boot times; requires different power delivery and revised 60x bus timing margins.Choose for new designs needing higher performance density and longer product lifecycle; not drop-in compatible due to voltage, pinout, and cache interface differences.

Compared with MPC745BVT300LE, the MPC745BVT350LE offers higher deterministic throughput within identical thermal and layout constraints, while the MPC7447A delivers architectural upgrades at the cost of redesign effort - making the MPC745BVT300LE optimal for stable, cost-sensitive, long-lifecycle deployments where 300 MHz suffices.

Availability

MPC745BVT300LE is available at Aetrix Electronics and suitable for industrial PLC controllers, telecom line cards, and network edge routers requiring stable component supply, long-term obsolescence management, and traceable sourcing for safety-critical firmware validation.

Supply support for MPC745BVT300LE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC745 belongs to Freescale's PowerPC 7xx family, designed specifically for cost-optimized, low-power embedded control applications where deterministic real-time performance and thermal resilience outweigh raw compute density.

FAQ

What is the maximum operating temperature for the MPC745BVT300LE?

The MPC745BVT300LE has a maximum junction temperature (Tj) of 105°C under recommended operating conditions. Its thermal management assist unit (TAU) provides real-time die temperature monitoring via dedicated SPRs (THRM0–THRM3), enabling software-initiated throttling or shutdown before exceeding this limit. The PBGA-255 package exhibits a junction-to-ambient thermal resistance (RθJA) of 34°C/W under natural convection, requiring appropriate heatsinking or airflow in enclosed systems to sustain full 300 MHz operation.

Does the MPC745BVT300LE support L2 cache?

No, the MPC745BVT300LE does not support an L2 cache interface. As explicitly stated in Freescale's MPC755 hardware specifications document: "The MPC745 is identical to the MPC755 except it does not support the L2 cache interface." This omission removes the L2 controller, L2 tags, and associated 17-bit L2 address / 64-bit L2 data bus signals - simplifying board design and reducing system cost, but limiting sustained bandwidth for large working sets compared to L2-equipped variants like the MPC755.

What are the valid SYSCLK frequency ranges for the MPC745BVT300LE?

The MPC745BVT300LE accepts SYSCLK frequencies from 25 MHz to 100 MHz, as specified in Table 8 of the Freescale MPC755 hardware specifications. This range supports bus-to-core frequency multipliers of 2x through 8x and 10x, yielding the rated 300 MHz core frequency (e.g., 75 MHz SYSCLK × 4). SYSCLK jitter must remain within ±150 ps (total), and duty cycle must be 40–60% at OVDD/2 to ensure reliable PLL lock and internal timing margin across voltage and temperature extremes.

How is I/O voltage selected on the MPC745BVT300LE?

I/O voltage selection on the MPC745BVT300LE is controlled by the BVSEL pin, sampled during power-on reset. When BVSEL = 0, the processor bus interface defaults to 2.5 V operation; when BVSEL = 1, it defaults to 3.3 V. The actual OVDD supply must match this selection - applying 3.3 V OVDD while BVSEL = 0 violates the absolute maximum ratings and may cause functional failure. Input thresholds (VIH/VIL) and output drive strength are configured accordingly, and BVSEL must remain stable during operation per Freescale's specification.

Is the MPC745BVT300LE pin-compatible with the MPC755?

No, the MPC745BVT300LE is not pin-compatible with the MPC755. The MPC745 uses a 255-ball PBGA package, whereas the MPC755 is offered in 360-ball CBGA or PBGA packages. More critically, the MPC745 omits all L2-related pins (e.g., L2AVDD, L2OVDD, L2AD[16:0], L2D[63:0]), resulting in fundamentally different ball maps and incompatible PCB footprints. Interchangeability is precluded by both mechanical and electrical incompatibility - only the MPC745BVT350LE shares the same PBGA-255 package and pinout.

MPC745BVT300LE Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
255-BBGA, FCBGA
Series:
MPC7xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
-
RAM Controllers:
-
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
-
SATA:
-
USB:
-
Voltage - I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
255-FCPBGA (21x21)
Additional Interfaces:
-

MPC745BVT300LE FAQ

1.How can I place an order for MPC745BVT300LE through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC745BVT300LE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC745BVT300LE reliable?

The price and inventory of MPC745BVT300LE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC745BVT300LE is usually 5 days.

3.What payment methods are accepted for MPC745BVT300LE?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC745BVT300LE transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC745BVT300LE?

MPC745BVT300LE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC745BVT300LE order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC745BVT300LE?

For technical support, including MPC745BVT300LE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC745BVT300LE requirements.

6.How does Aetrix verify that MPC745BVT300LE is sourced from the original manufacturer or authorized distributors?

All MPC745BVT300LE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC745BVT300LE meets industry standards.

7.What is the process for return or replacement of MPC745BVT300LE?

All MPC745BVT300LE units undergo pre-shipment inspection (PSI). If there is an issue with MPC745BVT300LE, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC745BVT300LE part is unused and in its original packaging.

Return procedure for MPC745BVT300LE:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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