NXP Semiconductors MPC745CPX350LE

Overview

MPC745CPX350LE from Freescale Semiconductor is a 350 MHz PowerPC™ RISC microprocessor implementing the 60x bus architecture, featuring a 32 KB instruction and 32 KB data L1 cache, 0.22 µm CMOS process, 2.0 V core supply, and doze/nap/sleep power management modes - deployed in embedded networking and industrial control systems requiring deterministic real-time execution.

For engineers reviewing the MPC745CPX350LE datasheet, MPC745CPX350LE pinout, MPC745CPX350LE application, or MPC745CPX350LE equivalent, key selection criteria include its lack of L2 cache interface (vs. MPC755), PBGA-255 package, 350 MHz core frequency at 2.0 V, 2.5/3.3 V I/O voltage selectability, and thermal sensor integration for junction temperature monitoring.

Technical Context

The MPC745CPX350LE implements the PowerPC instruction set with dual fixed-point units (FXU1/FXU2), a single-cycle latency floating-point unit supporting IEEE 754 single/double precision, and a 64-entry branch target instruction cache (BTIC) with 512-entry branch history table (BHT). It executes two instructions per cycle via hardware dependency detection and dispatches to six independent execution units.

Its memory subsystem includes 128-entry two-way set-associative instruction and data TLBs, eight instruction/data BATs, and hardware-managed MEI coherency for L1 caches. Unlike the MPC755, it omits the L2 cache controller, L2 tags, and L2 bus interface - confirmed by Freescale's explicit statement that "the MPC745 is identical to the MPC755 except it does not support the L2 cache interface."

Key Specifications

Pinout & Package

Package: 255-ball plastic ball grid array (PBGA), surface-mount, 27 mm × 27 mm footprint, 1.27 mm pitch. Thermal resistance RθJA = 34°C/W (natural convection, single-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MPC755CPX350LE, the MPC745CPX350LE removes L2 interface circuitry to reduce die size, power, and cost - making it optimal for L1-cache-sufficient applications. Versus MPC7400CZQ350B, it trades peak frequency and integrated L2 for proven reliability, lower junction temperature, and PBGA manufacturability in volume industrial designs.

Availability

MPC745CPX350LE is available at Aetrix Electronics and suitable for industrial PLC controllers, telecom line cards, avionics data concentrators, and medical imaging subsystems requiring stable component supply across extended product lifecycles.

Supply support for MPC745CPX350LE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC745 belongs to the PowerPC 7xx family - designed specifically for cost-optimized, low-power embedded systems where deterministic real-time performance, thermal efficiency, and long-term supply stability outweigh raw compute density.

FAQ

What is the maximum guaranteed operating frequency of the MPC745CPX350LE?

The MPC745CPX350LE is rated for a maximum guaranteed core frequency of 350 MHz under recommended operating conditions: VDD = 1.9–2.1 V, junction temperature ≤ 105°C, and SYSCLK between 25–100 MHz. This rating is validated per Freescale's sorting process and documented in Table 8 of the MPC755EC Rev. 8 specification, which applies identically to the MPC745CPX350LE.

Does the MPC745CPX350LE support an external L2 cache?

No, the MPC745CPX350LE does not support an external L2 cache. As explicitly stated in the Freescale documentation: "The MPC745 is identical to the MPC755 except it does not support the L2 cache interface." The MPC745CPX350LE omits the L2 controller, L2 tags, L2 address/data buses, and associated power pins (L2AVDD, L2OVDD), confirming its L1-only memory hierarchy.

What package type and ball count does the MPC745CPX350LE use?

The MPC745CPX350LE uses a 255-ball plastic ball grid array (PBGA) package, as confirmed in Section 7 ("Package Description") and Table 4 of the MPC755EC Rev. 8 datasheet. Freescale specifies that "the MPC745 is offered in a PBGA package only," with dimensions of 27 mm × 27 mm and 1.27 mm ball pitch - distinct from the MPC755's optional CBGA variant.

How does the thermal management assist unit (TAU) function in the MPC745CPX350LE?

The MPC745CPX350LE integrates a thermal management assist unit (TAU) comprising an on-die temperature sensor, comparator, DAC, and dedicated special-purpose registers (SPRs). It provides junction temperature readings with ±12°C accuracy and 4°C resolution, enabling software-driven thermal regulation - such as entering nap mode when thresholds are exceeded - without external sensors or circuitry.

Can the MPC745CPX350LE operate with both 2.5 V and 3.3 V I/O interfaces?

Yes, the MPC745CPX350LE supports both 2.5 V and 3.3 V I/O interface voltages. The BVSEL pin selects the processor bus input threshold: logic high enables either 2.5 V or 3.3 V operation (per Table 2), while OVDD must match the selected voltage. This dual-voltage capability allows seamless integration into mixed-voltage systems and migration paths without level-shifter redesign.