NXP Semiconductors MPC745CVT350LE

Overview

MPC745CVT350LE from Freescale Semiconductor is a 350 MHz PowerPC™ RISC microprocessor implementing the 60x bus architecture, featuring a 32 KB instruction and 32 KB data L1 cache, 0.22 µm CMOS process, 2.0 V core supply, and support for doze/nap/sleep power management modes - deployed in embedded networking and industrial control systems requiring deterministic real-time execution.

For engineers reviewing the MPC745CVT350LE datasheet, MPC745CVT350LE pinout, MPC745CVT350LE application, or MPC745CVT350LE equivalent, key selection criteria include its lack of L2 cache interface (vs. MPC755), PBGA-255 package, 350 MHz core frequency at 2.0 V, thermal sensor integration, and compatibility with 2.5 V / 3.3 V I/O buses using BVSEL configuration.

Technical Context

The MPC745CVT350LE implements the PowerPC instruction set with dual fixed-point units (FXU1/FXU2), a single-cycle latency floating-point unit supporting IEEE 754 single/double precision, and a 64-entry branch target instruction cache (BTIC) with 512-entry branch history table (BHT) for dynamic prediction. It executes two instructions per cycle via hardware dependency detection and dispatches to six independent execution units.

Its memory subsystem includes 128-entry two-way set-associative instruction and data TLBs, eight instruction/data BATs, and full virtual memory support up to 4 exabytes. The processor lacks the L2 cache controller and interface present in the MPC755, limiting external cache expansion - a defining architectural distinction confirmed across all documentation sections.

Key Specifications

Pinout & Package

Package: 255-ball plastic ball grid array (PBGA), surface-mount, 27 mm × 27 mm footprint, 1.27 mm ball pitch. Thermal resistance RθJA = 34°C/W (natural convection, single-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MPC745CVT350LE, the MPC745CVT400LE delivers higher deterministic throughput at increased thermal load, while the MPC755CVT350LE adds L2 cache capability at the cost of higher complexity and power - making MPC745CVT350LE optimal for cost-sensitive, thermally constrained embedded control where L1 cache suffices.

Availability

MPC745CVT350LE is available at Aetrix Electronics and suitable for industrial automation, telecom infrastructure, and medical electronics requiring stable component supply, long-term lifecycle support, and traceable sourcing for safety-critical deployments.

Supply support for MPC745CVT350LE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC745CVT350LE belongs to the PowerPC 7xx family - designed specifically for high-reliability embedded control applications demanding deterministic real-time performance, low-power operation, and robust thermal management in space-constrained environments.

FAQ

What is the maximum guaranteed operating frequency of the MPC745CVT350LE?

The MPC745CVT350LE is rated for a maximum guaranteed core frequency of 350 MHz under recommended operating conditions: VDD = 1.9–2.1 V, junction temperature ≤ 105°C, and SYSCLK between 25–100 MHz. This rating is validated per Table 8 in the MPC755EC Rev. 8 specification, which explicitly applies to the MPC745. Operation beyond this frequency is not characterized or supported.

Does the MPC745CVT350LE support an external L2 cache?

No, the MPC745CVT350LE does not support an external L2 cache. As stated in Section 1 ("Overview") and Section 2 ("Features"), it is identical to the MPC755 except for the omission of the L2 cache interface, L2 controller, and associated 17-bit L2 address bus and 64-bit L2 data bus. This architectural difference is fundamental and cannot be enabled via configuration.

What package type and ball count does the MPC745CVT350LE use?

The MPC745CVT350LE uses a 255-ball plastic ball grid array (PBGA) package, as confirmed in Section 7 ("Package Description") and Table 4 ("Package Thermal Characteristics"). Unlike the MPC755, which was offered in both CBGA-360 and PBGA-360 variants, the MPC745 is exclusively available in the PBGA-255 form factor with 27 mm × 27 mm body size and 1.27 mm ball pitch.

How is I/O voltage selected on the MPC745CVT350LE?

I/O voltage selection on the MPC745CVT350LE is controlled by the BVSEL pin, sampled during HRESET assertion. When BVSEL = 0, the processor defaults to 2.5 V I/O thresholds; when BVSEL = 1, it selects 3.3 V thresholds - as defined in Table 2 and Section 4.1. The OVDD supply must match the selected threshold, and BVSEL must remain stable during operation per Section 4.2.2 note 8.

What power management modes does the MPC745CVT350LE support?

The MPC745CVT350LE supports three static power-saving modes: doze (core clock gated, bus active), nap (core and bus clocks gated, memory retained), and sleep (all clocks stopped, minimal leakage). Dynamic power management adjusts voltage/frequency in real time. Power consumption in these modes is documented in Table 7: doze ≤ 2.0 W, nap ≤ 1.0 W, sleep ≤ 550 mW at 350 MHz.