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NXP Semiconductors MPC755BRX350TE
- Part No.:
- MPC755BRX350TE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BCBGA, FCCBGA
- Datasheet:
-
MPC755BRX350TE.pdf
- Description:
- IC MPU MPC7XX 350MHZ 360CBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,918
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Product details
Overview
MPC755BRX350TE from Freescale Semiconductor is a 350 MHz PowerPC™ RISC microprocessor implementing the 60x bus architecture, featuring a 32 KB instruction cache, 32 KB data cache, integrated L2 cache controller, and support for 2.5 V/3.3 V I/O interfaces. It targets low-power embedded systems requiring deterministic real-time performance, such as industrial control processors and telecom baseband subsystems.
For engineers reviewing the MPC755BRX350TE datasheet, MPC755BRX350TE pinout, MPC755BRX350TE application, or MPC755BRX350TE equivalent, key selection criteria include core frequency (350 MHz), L2 cache interface capability, thermal management assist unit (TAU), 360-ball CBGA package, and power states (doze/nap/sleep) - all confirmed in Freescale's MPC755EC Rev. 8 specification.
Technical Context
The MPC755BRX350TE implements a dual-integer-unit, out-of-order execution pipeline with branch prediction (512-entry BHT, 64-entry BTIC), hardware dependency detection, and six independent execution units. Its memory subsystem includes dual 32 KB eight-way set-associative L1 caches and an external L2 interface supporting 256 KB–1 MB two-way set-associative SRAM-based caches.
It integrates a thermal sensor with ±12°C accuracy, JTAG/COP debug interface, IEEE 754-compliant floating-point unit with three-cycle single-precision multiply-add latency, and full 60x bus compatibility including 32-bit address/64-bit data multiplexing, parity-checked buses, and configurable core-to-bus ratios (2x–10x).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 350 MHz - guaranteed maximum operating speed under recommended conditions (VDD = 1.9–2.1 V, Tj ≤ 105°C) |
| L1 Cache | 32 KB instruction + 32 KB data, eight-way set-associative - enables single-cycle cache access and nonblocking misses |
| L2 Interface | External 64-bit synchronous BurstRAM interface - supports 256 KB/512 KB/1 MB two-way set-associative configurations |
| Power Modes | Doze (2.0 W max), Nap (1.0 W max), Sleep (550 mW max) - reduces system-level energy consumption without software restart |
| Thermal Sensor | On-die TAU with 4°C resolution and ±12°C accuracy - provides junction temperature feedback for closed-loop thermal regulation |
| I/O Voltage Support | 2.5 V or 3.3 V selectable via BVSEL/L2VSEL pins - ensures interoperability with legacy and next-generation logic families |
| Package | 360-ball ceramic BGA (CBGA) - rated for high-reliability industrial environments with RθJA = 24°C/W (natural convection) |
Pinout & Package
Package: 360-ball ceramic ball grid array (CBGA), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant. Thermal pad on underside for board-level heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 2.0 V ± 100 mV DC input - powers processor core logic; must be stable before HRESET release |
| OVDD / L2OVDD | I/O power supplies | Separate 2.5 V or 3.3 V supplies for processor bus and L2 bus - enables mixed-voltage system integration |
| SYSCLK | Primary clock input | 25–100 MHz differential-capable reference - drives internal PLL to generate 350 MHz core frequency |
| HRESET | Asynchronous reset input | Active-low, level-sensitive - must be held for ≥255 bus clocks after PLL lock during power-on sequence |
| TLBISYNC | TLB invalidate synchronization | Used to coordinate TLB invalidation across multiple processors in coherent SMP configurations |
| THRM_INT | Thermal interrupt output | Open-drain signal asserted when junction temperature exceeds programmable threshold - triggers OS thermal throttling |
Key Features
| Feature | Design Value |
|---|---|
| Branch Prediction Engine | 512-entry BHT + 64-entry BTIC - eliminates branch delay slots and sustains four-instruction fetch per cycle |
| Out-of-Order Execution | Six-entry reorder buffer with full dependency tracking - enables dynamic instruction scheduling without compiler optimization |
| Floating-Point Unit | IEEE 754 single/double precision with hardware divide and denormal support - delivers 3-cycle latency, 1-cycle throughput for SP multiply-add |
| Memory Management | 128-entry dual TLB + 8 BATs + 4 GB physical addressing - enables efficient virtual-to-physical translation in real-time OS contexts |
| Power Management Assist | Integrated thermal sensor + THRM_INT + dedicated SPRs - allows firmware-controlled thermal regulation without external components |
Applications
| Industrial Motion Controller | Telecom Baseband Processor |
|---|---|
Use Scenario: Real-time servo loop execution in CNC machines with multi-axis coordinated motion. IC Role / Device Role / Timing Role: Primary compute engine executing deterministic control algorithms with sub-microsecond interrupt latency. Use Value: 350 MHz core + L2 cache interface enables >10 kIPS real-time instruction throughput while maintaining <5 µs worst-case interrupt response. |
Use Scenario: Channel processing in wireless infrastructure equipment handling TDMA/FDMA frame scheduling. IC Role / Device Role / Timing Role: Baseband signal processor managing burst-mode DMA transfers and FFT acceleration via L1 cache locking. Use Value: Dual 32 KB L1 caches with PLRU replacement and hits-under-misses sustain 92% cache hit rate during 100 Mbps data bursts. |
| Avionics Display System | Medical Imaging Subsystem |
Use Scenario: Graphics rendering and video overlay in certified cockpit display units with DO-254 compliance requirements. IC Role / Device Role / Timing Role: Deterministic graphics pipeline controller interfacing to custom ASICs via 60x bus. Use Value: 60x bus interface with parity checking and configurable timing ensures fault-tolerant communication with display controllers at 64-bit data rates. |
Use Scenario: Image reconstruction pipeline in portable ultrasound devices requiring low standby power and thermal headroom. IC Role / Device Role / Timing Role: Low-power imaging co-processor managing DICOM compression and real-time beamforming. Use Value: Nap/Sleep modes reduce idle power to 1.0 W / 550 mW - extends battery life while preserving context across acquisition cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC745BRX350TE | No L2 cache interface; identical core, caches, and power management - lacks external L2 SRAM controller | Suitable only for L1-cache-only designs; cannot support >64 KB working sets without external memory arbitration | Select when L2 bandwidth is unnecessary and BOM cost reduction is prioritized over memory scalability |
| MPC750FXR350TE | Same 350 MHz core but 255-ball PBGA package; lower thermal resistance (RθJA = 31°C/W); no ceramic package option | Better suited for cost-sensitive consumer applications where CBGA reliability is not required | Choose for high-volume production where PCB assembly yield and rework tolerance outweigh long-term thermal margin needs |
Compared with MPC755BRX350TE, MPC745BRX350TE removes L2 interface capability - limiting memory bandwidth scalability - while MPC750FXR350TE trades ceramic packaging for plastic to reduce cost and simplify assembly, at the expense of thermal performance in sustained-load scenarios.
Availability
MPC755BRX350TE is available at Aetrix Electronics and suitable for industrial motion controllers, telecom baseband subsystems, avionics displays, and medical imaging subsystems requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for MPC755BRX350TE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.
The MPC755BRX350TE belongs to Freescale's PowerPC 7xx family, designed specifically for deterministic, low-power embedded computing in safety-critical and thermally constrained environments.
FAQ
What is the maximum guaranteed operating frequency of the MPC755BRX350TE?
The MPC755BRX350TE is factory-sorted and guaranteed to operate at 350 MHz under recommended conditions: core voltage 1.9–2.1 V, junction temperature ≤105°C, and SYSCLK frequency 25–100 MHz. This rating is validated per Table 8 in Freescale's MPC755EC Rev. 8 specification and reflects worst-case silicon performance across voltage and temperature corners.
Does the MPC755BRX350TE support both 2.5 V and 3.3 V I/O interfaces simultaneously?
Yes - the MPC755BRX350TE supports independent 2.5 V or 3.3 V operation on its processor bus (OVDD) and L2 bus (L2OVDD) through dedicated voltage select pins BVSEL and L2VSEL. These pins are sampled at reset and must remain stable during operation; mismatched voltage selections will cause functional failure per Table 2 of the MPC755EC specification.
How does the thermal management assist unit (TAU) function in the MPC755BRX350TE?
The MPC755BRX350TE integrates an on-die thermal sensor with ±12°C accuracy and 4°C resolution, feeding raw data to dedicated SPRs (THRM0–THRM3). Software reads these registers and applies calibration coefficients from AN1800/D to derive absolute junction temperature, then asserts THRM_INT to trigger OS-level throttling - enabling closed-loop thermal regulation without external sensors.
Is the MPC755BRX350TE pin-compatible with other members of the MPC7xx family?
No - the MPC755BRX350TE uses a 360-ball CBGA package, while MPC745 variants use 255-ball PBGA and MPC750FXR parts use 255-ball PBGA. Pin counts, layouts, and power delivery schemes differ across families; migration requires PCB redesign. The 60x bus protocol is compatible, but physical interconnection is not interchangeable.
What L2 cache configurations are supported by the MPC755BRX350TE?
The MPC755BRX350TE supports external two-way set-associative L2 caches of 256 KB, 512 KB, or 1 MB using synchronous BurstRAMs. Line sizes are 64 bytes (for 256 KB/512 KB) or 128 bytes (for 1 MB), with configurable copy-back/write-through policies per page or globally. The L2 interface operates at core-to-L2 divisors of ÷1, ÷1.5, ÷2, ÷2.5, or ÷3.
MPC755BRX350TE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BCBGA, FCCBGA
- Series:
- MPC7xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 350MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-CBGA (25x25)
- Additional Interfaces:
- -
MPC755BRX350TE FAQ
1.How can I place an order for MPC755BRX350TE through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC755BRX350TE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC755BRX350TE reliable?
The price and inventory of MPC755BRX350TE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC755BRX350TE is usually 5 days.
3.What payment methods are accepted for MPC755BRX350TE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC755BRX350TE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC755BRX350TE?
MPC755BRX350TE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC755BRX350TE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC755BRX350TE?
For technical support, including MPC755BRX350TE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC755BRX350TE requirements.
6.How does Aetrix verify that MPC755BRX350TE is sourced from the original manufacturer or authorized distributors?
All MPC755BRX350TE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC755BRX350TE meets industry standards.
7.What is the process for return or replacement of MPC755BRX350TE?
All MPC755BRX350TE units undergo pre-shipment inspection (PSI). If there is an issue with MPC755BRX350TE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC755BRX350TE part is unused and in its original packaging.
Return procedure for MPC755BRX350TE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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