NXP Semiconductors MPC755BVT350LE

Overview

MPC755BVT350LE from Freescale Semiconductor is a 350 MHz PowerPC™ RISC microprocessor implementing the 60x bus architecture, featuring a 32 KB instruction cache, 32 KB data cache, integrated L2 cache controller, and support for 2.5 V/3.3 V I/O with 2.0 V core supply. It delivers up to 6.0 W maximum power in full-power mode and supports doze, nap, and sleep power management states for embedded control and communications systems.

For engineers reviewing the MPC755BVT350LE datasheet, MPC755BVT350LE pinout, MPC755BVT350LE application, or MPC755BVT350LE equivalent, key selection criteria include confirmed 350 MHz core frequency, CBGA/PBGA package compatibility, L2 cache interface presence, thermal sensor integration (TAU), and 60x bus timing compliance at 100 MHz SYSCLK.

Technical Context

The MPC755BVT350LE implements a dual-integer-unit, floating-point-capable superscalar PowerPC core with out-of-order execution, six-entry reorder buffer, and hardware dependency detection. Its L1 cache subsystem includes separate 32 KB eight-way set-associative instruction and data caches with single-cycle access and PLRU replacement.

It integrates a dedicated L2 cache interface supporting 256 KB–1 MB external synchronous BurstRAMs, configurable core-to-L2 divisors (÷1 to ÷3), and selectable copy-back/write-through policies. The on-die thermal management assist unit (TAU) provides junction temperature monitoring via calibrated digital output with ±12 °C accuracy and 4 °C resolution.

Key Specifications

Pinout & Package

The MPC755BVT350LE is available in a 360-ball ceramic ball grid array (CBGA) package with 1.27 mm pitch, designed for high-reliability industrial and telecom applications requiring stable thermal performance and long-term board interconnect integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RISC microprocessor applications.

Compared with MPC755BVT350LE, MPC745BVT350LE omits L2 interface capability-limiting cache scalability-while MPC750LVR350LE trades ceramic package robustness for PBGA cost savings and slightly reduced thermal margin, making each alternative suitable only for specific mechanical and functional constraints.

Availability

MPC755BVT350LE is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics, and medical imaging systems requiring stable component supply, long-lifecycle support, and verified thermal performance in convection-cooled environments.

Supply support for MPC755BVT350LE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC755BVT350LE belongs to the PowerPC 7xx family, designed specifically for cost-optimized, thermally constrained embedded systems requiring high integer throughput, IEEE-compliant floating-point, and seamless 60x bus integration.

FAQ

What is the maximum guaranteed operating frequency of the MPC755BVT350LE?

The MPC755BVT350LE is factory-sorted and guaranteed to operate at 350 MHz under all recommended conditions: core supply VDD = 1.9–2.1 V, junction temperature ≤105 °C, and SYSCLK frequency between 25–100 MHz. This rating is validated per Table 8 in the MPC755EC Rev. 8 specification and applies only when PLL_CFG[0:3] is configured for 3.5× multiplication.

Does the MPC755BVT350LE support both 2.5 V and 3.3 V I/O interfaces simultaneously?

No-the MPC755BVT350LE supports either 2.5 V or 3.3 V I/O on each bus independently, selected by BVSEL (processor bus) and L2VSEL (L2 bus) strap pins sampled at reset. Both buses may be set to the same voltage or different voltages, but each bus's input thresholds and output swing are fixed per its respective selection and cannot be dynamically changed during operation.

Is the L2 cache interface present on all MPC755BVT350LE units?

Yes-the L2 cache interface is a defining feature of the MPC755 family and is fully implemented on every MPC755BVT350LE device. Unlike the MPC745 variant, the MPC755BVT350LE includes an internal L2 tag array, L2 bus interface unit, and configurable L2CR register set, enabling direct connection to external synchronous BurstRAMs for 256 KB–1 MB cache expansion.

How does the thermal management assist unit (TAU) function in the MPC755BVT350LE?

The TAU in the MPC755BVT350LE integrates an on-die thermal sensor, comparator, and dedicated SPRs (THRM0–THRM3). It outputs a raw 8-bit digital value proportional to junction temperature, calibrated in software using AN1800/D. The THRM_INT pin asserts when temperature exceeds thresholds programmed into THRM3, enabling autonomous thermal throttling without host CPU polling.

What package types are available for the MPC755BVT350LE?

The MPC755BVT350LE is offered exclusively in a 360-ball ceramic ball grid array (CBGA) package with 1.27 mm pitch and 27 mm × 27 mm body size. While Freescale documented PBGA variants for other MPC755 speed grades, the "BVT350LE" suffix specifically denotes the CBGA configuration optimized for high-reliability, thermally demanding applications such as telecom baseband and avionics.