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NXP Semiconductors MPC755CRX400LE
- Part No.:
- MPC755CRX400LE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BCBGA, FCCBGA
- Datasheet:
-
MPC755CRX400LE.pdf
- Description:
- IC MPU MPC7XX 400MHZ 360CBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,774
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Product details
Overview
MPC755CRX400LE from Freescale Semiconductor is a 400 MHz PowerPC™ RISC microprocessor with integrated L2 cache controller, 32 KB instruction and 32 KB data L1 caches, 60x bus interface, and support for 2.5 V/3.3 V I/O voltage selection. It implements dynamic power management (doze/nap/sleep modes), on-die thermal sensing, and IEEE 1149.1 JTAG debug - deployed in embedded networking and industrial control systems requiring deterministic real-time execution.
For engineers reviewing the MPC755CRX400LE datasheet, MPC755CRX400LE pinout, MPC755CRX400LE application, or MPC755CRX400LE equivalent, key selection criteria include core frequency (400 MHz), L2 cache interface support, CBGA/PBGA package compatibility, thermal sensor integration, and 60x bus timing compliance at 100 MHz SYSCLK.
Technical Context
The MPC755CRX400LE implements the PowerPC architecture with dual fixed-point units (FXU1/FXU2), a pipelined floating-point unit supporting IEEE 754 single/double precision, and a 64-entry branch target instruction cache (BTIC) with 512-entry branch history table. Its L1 cache hierarchy uses eight-way set-associative 32 KB instruction and data caches with hardware-managed MEI coherency.
It features a dedicated L2 cache interface supporting 256 KB–1 MB external synchronous BurstRAMs with configurable line sizes (64/128 bytes), core-to-L2 divisors (÷1 to ÷3), and split cache/private memory modes. The 60x bus interface provides 32-bit address/64-bit data paths with parity checking, selectable 2.5 V or 3.3 V I/O, and bus-to-core multipliers up to 10×.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 400 MHz - maximum guaranteed operating frequency; requires SYSCLK ≥ 25 MHz and PLL_CFG[0:3] configured for 10× multiplier |
| L1 Cache | 32 KB instruction + 32 KB data, eight-way set-associative - enables single-cycle cache access and nonblocking misses under hits |
| L2 Interface | 64-bit data / 17-bit address bus - supports external SRAM-based L2 cache up to 1 MB with copy-back or write-through policy |
| Power Modes | Doze (2.3 W max), Nap (1.0 W max), Sleep (550 mW max) - reduces active power without losing register state or cache contents |
| Thermal Sensor | ±12 °C accuracy, 4 °C resolution - feeds junction temperature data to software via THRM3 SPR for closed-loop thermal regulation |
| I/O Voltage Support | 2.5 V or 3.3 V selectable per bus (BVSEL/L2VSEL pins) - ensures compatibility with legacy 3.3 V and next-gen 2.5 V system buses |
| Package | 360-ball CBGA or PBGA - ceramic variant used in high-reliability applications; plastic variant recommended for long-term board interconnect stability |
Pinout & Package
Package: 360-ball Ceramic Ball Grid Array (CBGA), 27 mm × 27 mm, 1.27 mm pitch. Compatible with JEDEC MO-205AC standard. Thermal resistance RθJA = 24 °C/W (natural convection, single-layer board).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HRESET | Asynchronous reset input | Active-low signal asserting full processor initialization; must be held for ≥255 bus clocks after PLL relock during power-on |
| SYSCLK | Primary clock input | Differential-capable single-ended input; 25–100 MHz range; jitter ≤ ±150 ps; duty cycle 40–60% at OVDD/2 |
| BVSEL | Processor bus I/O voltage select | Static configuration pin sampled at reset; '0' = not available (Rev. E), '1' = enables 2.5 V/3.3 V interface voltage selection |
| L2VSEL | L2 bus I/O voltage select | Static configuration pin sampled at reset; '0' = not available (Rev. E), '1' = enables 2.5 V/3.3 V interface voltage selection |
| PLL_CFG[0:3] | Phase-locked loop divisor control | Four-pin strap defining core-to-bus ratio (e.g., 10× for 400 MHz @ 40 MHz SYSCLK); must remain stable post-reset |
| THRM_INT | Thermal interrupt output | Open-drain signal asserted when junction temperature exceeds programmed threshold; triggers software thermal throttling |
Key Features
| Feature | Design Value |
|---|---|
| Branch Prediction | 512-entry BHT + 64-entry BTIC - eliminates branch delay slots and enables four-instruction fetch per cycle |
| Floating-Point Unit | IEEE 754 single/double precision with hardware divide and denormal support - delivers three-cycle latency, one-cycle throughput for single-precision multiply-add |
| Memory Management | 128-entry two-way TLBs + eight BATs per domain - supports up to 4 exabytes virtual memory and 4 GB physical memory with hardware tablewalk assist |
| Cache Coherency | Hardware-enforced MEI protocol - maintains cache coherency across L1 instruction/data caches without software intervention |
| Test & Debug | IEEE 1149.1 JTAG + LSSD scan - enables boundary-scan testing, in-circuit emulation, and COP-based debug without halting execution |
Applications
| Industrial Motion Control | Telecom Baseband Processing |
|---|---|
Use Scenario: Real-time servo loop execution in CNC machine controllers with deterministic response to encoder interrupts. IC Role / Device Role / Timing Role: Primary compute engine executing motion algorithms, managing dual-channel 60x bus peripherals, and synchronizing with external FPGA logic. Use Value: 400 MHz core + 64-bit data bus enables sub-10 µs interrupt latency and sustained 500+ MIPS throughput for multi-axis interpolation. |
Use Scenario: Channel bonding and packet classification in carrier-grade DSLAM line cards with multiple concurrent ATM/PPP sessions. IC Role / Device Role / Timing Role: Host processor managing DMA transfers to ASIC offload engines, running Linux RTOS, and servicing 60x bus-connected PHY interfaces. Use Value: L2 cache interface + 256 KB external SRAM reduces memory bandwidth contention, enabling >95% cache hit rate for packet header lookups. |
| Medical Imaging Subsystem | Avionics Data Concentrator |
Use Scenario: Image preprocessing pipeline in portable ultrasound devices requiring low-power operation between battery charges. IC Role / Device Role / Timing Role: Real-time DSP host controlling ADC/DAC timing, applying FIR filters, and compressing frames before storage. Use Value: Nap mode (1.0 W max) extends battery life while preserving L1 cache state, allowing instant wake-up for urgent echo acquisition events. |
Use Scenario: ARINC 429/664 message aggregation and health monitoring in flight control computers with strict DO-254 compliance. IC Role / Device Role / Timing Role: Safety-critical controller executing partitioned ARINC-653 applications, interfacing with dual-redundant 60x bus peripherals. Use Value: On-die thermal sensor + THRM_INT enables real-time junction temperature monitoring required for certifiable thermal derating strategies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC745CRX400LE | No L2 cache interface; identical core, L1 cache, and 60x bus - lower gate count, reduced power (max 7.2 W full-power) | Used where external L2 is unnecessary or implemented via FPGA; lacks L2 controller logic and associated pins (L2AVDD, L2OVDD, L2AD[16:0], L2D[63:0]) | Select when system design omits external L2 SRAM and prioritizes cost/power over cache bandwidth. |
| MPC750VR400LE | Same 400 MHz core but no L2 interface; different package (352-pin PBGA); lacks thermal sensor and TAU registers | Targeted at cost-sensitive consumer electronics; missing THRM_INT and thermal management assist unit functionality | Choose for non-thermal-critical applications where PCB layout reuse of MPC750 footprint is required. |
Compared with MPC755CRX400LE, MPC745CRX400LE removes L2 interface logic to reduce die size and static power, while MPC750VR400LE sacrifices thermal monitoring and uses a smaller package - both trade L2 flexibility or safety-critical thermal awareness for lower BOM cost.
Availability
MPC755CRX400LE is available at Aetrix Electronics and suitable for industrial motion control, telecom baseband processing, medical imaging subsystems, avionics data concentrators, and embedded test equipment requiring stable component supply across extended product lifecycles.
Supply support for MPC755CRX400LE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets.
The MPC755CRX400LE belongs to the PowerPC 7xx family designed for high-performance, low-power embedded computing - targeting applications needing deterministic real-time execution, thermal-aware operation, and scalable cache hierarchies.
FAQ
What is the maximum supported SYSCLK frequency for MPC755CRX400LE?
The MPC755CRX400LE supports SYSCLK frequencies up to 100 MHz, as specified in Table 8 of the hardware specifications. At 400 MHz core frequency, this requires a 4× bus-to-core multiplier (PLL_CFG[0:3] = 0b0011). SYSCLK must maintain 40–60% duty cycle at OVDD/2 and jitter ≤ ±150 ps to ensure reliable PLL lock and timing margin compliance across all operating modes.
Does MPC755CRX400LE support both 2.5 V and 3.3 V I/O interfaces simultaneously?
Yes, the MPC755CRX400LE supports independent 2.5 V or 3.3 V operation on its processor bus (OVDD) and L2 bus (L2OVDD) through BVSEL and L2VSEL configuration pins. Both supplies must be stable before HRESET deassertion, and voltage thresholds are sampled once at reset - they cannot be changed dynamically during operation without violating specification.
How does the thermal management assist unit (TAU) function in MPC755CRX400LE?
The MPC755CRX400LE integrates a thermal sensor, comparator, and dedicated SPRs (THRM0–THRM3) forming the TAU. It measures die-junction temperature with ±12 °C accuracy and 4 °C resolution, generating THRM_INT when thresholds are exceeded. Software reads THRM3 to derive absolute temperature and initiates throttling or fan control - critical for maintaining reliability in sealed industrial enclosures.
What L2 cache configurations are supported by MPC755CRX400LE?
The MPC755CRX400LE supports external L2 caches of 256 KB, 512 KB, or 1 MB using synchronous BurstRAMs. Line sizes are 64 bytes (256/512 KB) or 128 bytes (1 MB); core-to-L2 divisors include ÷1, ÷1.5, ÷2, ÷2.5, and ÷3; and modes include instruction-only, data-only, or split cache/private memory - all configured via L2CR and L2SR SPRs.
Is MPC755CRX400LE pin-compatible with MPC745CRX400LE?
No, MPC755CRX400LE is not pin-compatible with MPC745CRX400LE. While both use 360-ball packages, the MPC755CRX400LE includes dedicated L2 power (L2AVDD, L2OVDD) and signal pins (L2AD[16:0], L2D[63:0], L2CLK) absent on the MPC745CRX400LE. PCB layouts must allocate separate L2 bus routing and decoupling for MPC755CRX400LE.
MPC755CRX400LE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BCBGA, FCCBGA
- Series:
- MPC7xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-CBGA (25x25)
- Additional Interfaces:
- -
MPC755CRX400LE FAQ
1.How can I place an order for MPC755CRX400LE through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC755CRX400LE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC755CRX400LE reliable?
The price and inventory of MPC755CRX400LE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC755CRX400LE is usually 5 days.
3.What payment methods are accepted for MPC755CRX400LE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC755CRX400LE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC755CRX400LE?
MPC755CRX400LE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC755CRX400LE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC755CRX400LE?
For technical support, including MPC755CRX400LE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC755CRX400LE requirements.
6.How does Aetrix verify that MPC755CRX400LE is sourced from the original manufacturer or authorized distributors?
All MPC755CRX400LE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC755CRX400LE meets industry standards.
7.What is the process for return or replacement of MPC755CRX400LE?
All MPC755CRX400LE units undergo pre-shipment inspection (PSI). If there is an issue with MPC755CRX400LE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC755CRX400LE part is unused and in its original packaging.
Return procedure for MPC755CRX400LE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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