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NXP Semiconductors MPC755CVT400LE
- Part No.:
- MPC755CVT400LE
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 360-BBGA, FCBGA
- Datasheet:
-
MPC755CVT400LE.pdf
- Description:
- IC MPU MPC7XX 400MHZ 360FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,504
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Product details
Overview
MPC755CVT400LE from Freescale Semiconductor is a 400 MHz PowerPC™ RISC microprocessor implementing the 60x bus architecture, featuring integrated L2 cache controller, 32 KB instruction and 32 KB data L1 caches, and support for 2.0 V core voltage with 2.5 V/3.3 V I/O interface options. It targets low-power embedded control and communications systems requiring deterministic real-time execution, thermal management, and legacy PowerPC software compatibility.
For engineers reviewing the MPC755CVT400LE datasheet, MPC755CVT400LE pinout, MPC755CVT400LE application, or MPC755CVT400LE equivalent, key selection considerations include its 360-ball CBGA package, 400 MHz core frequency with 100 MHz SYSCLK limit, L2 cache interface capability, thermal sensor integration, and PowerPC ABI compliance for legacy firmware migration.
Technical Context
The MPC755CVT400LE implements a dual-issue, out-of-order execution PowerPC core with branch prediction (512-entry BHT), two fixed-point units, one floating-point unit, and hardware-managed MEI cache coherency. Its L1 cache hierarchy supports copy-back or write-through modes per page, while the dedicated L2 interface supports 256 KB–1 MB external synchronous BurstRAMs with configurable line sizes and core-to-L2 divisors (÷1 to ÷3).
It integrates a thermal management assist unit (TAU) with on-die temperature sensor (±12°C accuracy), programmable interrupt thresholds, and dedicated SPRs for junction temperature monitoring. Power states include doze, nap, and sleep modes - with sleep mode consuming only 550 mW at 400 MHz - alongside dynamic power management controlled via system software.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Frequency | 400 MHz maximum - enables high-throughput deterministic processing in real-time control loops and packet forwarding engines. |
| L1 Cache | 32 KB instruction + 32 KB data, eight-way set-associative - reduces memory latency for time-critical code and data access without software cache management. |
| L2 Interface | Dedicated 64-bit bus with internal tags - supports external SRAM-based L2 cache up to 1 MB, enabling scalable performance without on-die L2 silicon cost. |
| Thermal Sensor | On-die analog thermal sensor with 4°C resolution and ±12°C accuracy - provides real-time junction temperature feedback for adaptive thermal throttling in sealed enclosures. |
| Power Modes | Doze (2.3 W), Nap (1.0 W), Sleep (0.55 W) - allows fine-grained energy control in battery-backed or fanless industrial gateways. |
| I/O Voltage Support | 2.5 V or 3.3 V selectable via BVSEL/L2VSEL pins - ensures interoperability with legacy 3.3 V peripherals and modern 2.5 V ASIC interfaces. |
| Package | 360-ball ceramic BGA (CBGA), 27 mm × 27 mm - delivers superior thermal dissipation (RθJA = 24°C/W) and long-term reliability in harsh environments. |
Pinout & Package
The MPC755CVT400LE is housed in a 360-ball ceramic ball grid array (CBGA) package with 1.27 mm pitch, designed for high-reliability industrial and telecom applications. Thermal performance is optimized via low-junction-to-board resistance (RθJB = 8°C/W) and compatibility with standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| HRESET | Asynchronous reset input | Asserted low to initialize processor state; must be held for ≥255 bus clocks after PLL lock during power-on. |
| SYSCLK | Primary clock input | Differential-capable single-ended input; 25–100 MHz range; jitter ≤ ±150 ps - defines system timing base for all internal operations. |
| BVSEL / L2VSEL | I/O voltage select inputs | Sampled at reset to configure 2.5 V or 3.3 V thresholds for processor and L2 buses - must remain static during operation. |
| PLL_CFG[0:3] | PLL multiplier configuration | Four-pin strap setting determining core/bus ratio (e.g., 4×, 4.5×, 5×, etc.) - sets 400 MHz core from 100 MHz SYSCLK. |
| THRM_INT | Thermal interrupt output | Open-drain signal asserted when junction temperature exceeds programmed threshold - triggers OS-level thermal mitigation. |
| VDD / AVDD / L2AVDD | Power supply pins | Separate 2.0 V core (VDD), 2.0 V PLL (AVDD), and 2.0 V L2 DLL (L2AVDD) supplies - decoupling critical for noise-sensitive analog blocks. |
Key Features
| Feature | Design Value |
|---|---|
| Branch Prediction | 512-entry BHT + 64-entry BTIC eliminates branch delay slots and sustains four-instruction fetch per cycle under speculative execution. |
| Floating-Point Unit | IEEE 754 single/double precision with hardware divide, denormal support, and three-cycle multiply-add latency - accelerates signal processing math without coprocessor overhead. |
| Memory Management | 128-entry dual TLB, eight BATs, and hardware tablewalk support - enables efficient virtual-to-physical translation for multitasking RTOS environments. |
| Cache Coherency | Hardware-enforced MEI protocol for L1 data cache - maintains consistency across multiple masters without software intervention or cache flush penalties. |
| JTAG Debug | IEEE 1149.1-compliant boundary scan and COP interface - enables in-circuit debugging, flash programming, and production test without dedicated debug headers. |
Applications
| Industrial PLC Controller | Telecom Baseband Processor |
|---|---|
Use Scenario: Real-time motion control logic executing cyclic tasks at 1–10 ms intervals in factory automation cabinets. IC Role / Device Role / Timing Role: Primary application processor managing I/O scanning, PID loop execution, and EtherCAT master timing. Use Value: Deterministic 400 MHz execution with L1 cache locking ensures sub-millisecond jitter in control cycles, while thermal sensor prevents derating in unventilated enclosures. |
Use Scenario: Channel bonding and modulation/demodulation in wireless infrastructure base stations operating in ambient temperatures up to 85°C. IC Role / Device Role / Timing Role: Baseband signal processor handling FFT, filtering, and MAC-layer scheduling with strict latency budgets. Use Value: L2 cache interface enables fast access to large coefficient tables; TAU-triggered dynamic frequency scaling maintains throughput within thermal envelope. |
| Avionics Data Concentrator | Medical Imaging Subsystem |
Use Scenario: ARINC 429/664 data aggregation unit in flight deck displays requiring DO-254 compliance and fault containment. IC Role / Device Role / Timing Role: Safety-critical host processor running partitioned RTOS with time-triggered scheduling and watchdog supervision. Use Value: Dual-issue out-of-order core delivers predictable worst-case execution time (WCET); JTAG/COP enables certified in-field diagnostics and firmware updates. |
Use Scenario: DICOM image preprocessing pipeline in portable ultrasound devices with battery life constraints and EMI-sensitive analog front ends. IC Role / Device Role / Timing Role: Embedded compute engine performing real-time beamforming, noise reduction, and display rendering. Use Value: Nap/sleep modes reduce idle power to 1.0 W/0.55 W; 2.5 V I/O compatibility minimizes level-shifting components near RF sections. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RISC microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC745CVT400LE | Identical core and package but lacks L2 cache interface - no external L2 SRAM support. | Suitable for cost-sensitive designs where L2 bandwidth is unnecessary and software manages larger working sets via DDR. | Select when L2 cache is not required and BOM cost reduction is prioritized over future scalability. |
| MPC7447ACZQH | 45 nm PowerPC e600 core, 1.0 GHz max, integrated L2 cache (512 KB), supports DDR2, lacks on-die thermal sensor. | Targets higher-performance networking and media applications with modern memory subsystems and no thermal monitoring requirement. | Choose for new designs needing >400 MHz throughput and DDR2 interface, accepting absence of integrated thermal sensing. |
Compared with MPC755CVT400LE, MPC745CVT400LE removes L2 interface capability but retains identical pinout and power profile, while MPC7447ACZQH offers higher clock rate and integrated L2 at the expense of thermal monitoring and legacy 60x bus compatibility.
Availability
MPC755CVT400LE is available at Aetrix Electronics and suitable for industrial PLC controllers, telecom baseband processors, avionics data concentrators, medical imaging subsystems, and embedded test equipment requiring stable component supply across extended product lifecycles.
Supply support for MPC755CVT400LE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, connectivity, and analog solutions for automotive, industrial, and networking markets.
The MPC755CVT400LE belongs to the PowerPC 7xx family, designed specifically for deterministic real-time embedded applications demanding low power, thermal resilience, and binary compatibility with legacy PowerPC software stacks.
FAQ
What is the maximum supported SYSCLK frequency for MPC755CVT400LE?
The MPC755CVT400LE supports a maximum SYSCLK frequency of 100 MHz, which - when combined with PLL_CFG[0:3] settings - yields its rated 400 MHz core frequency. This 4× multiplication ratio is validated across temperature and voltage ranges per Table 8 in the hardware specifications. Exceeding 100 MHz SYSCLK violates AC timing and may cause metastability in the PLL lock circuitry of the MPC755CVT400LE.
Does MPC755CVT400LE support both big-endian and little-endian operation?
Yes, the MPC755CVT400LE supports both big-endian and little-endian byte addressing through the MSR[LE] bit in the Machine State Register. This mode is configurable at boot time and can be changed dynamically in supervisor mode, enabling interoperability with heterogeneous peripheral subsystems and legacy PowerPC software that assumes either endianness. The load/store unit handles alignment and conversion transparently for the MPC755CVT400LE.
Can MPC755CVT400LE operate with 2.5 V I/O and 2.0 V core simultaneously?
Yes, the MPC755CVT400LE is explicitly designed for mixed-voltage operation: 2.0 V ±100 mV on VDD/AVDD/L2AVDD and 2.5 V ±100 mV on OVDD/L2OVDD when BVSEL and L2VSEL are strapped low. This configuration is validated in Table 3 and enables direct interfacing with 2.5 V FPGAs or ASICs while maintaining optimal core efficiency - a key design feature of the MPC755CVT400LE.
What thermal management features are integrated into MPC755CVT400LE?
The MPC755CVT400LE integrates a thermal management assist unit (TAU) with an on-die temperature sensor, comparator, and dedicated SPRs (THRM0–THRM3). It provides 4°C resolution and ±12°C accuracy across 0–127°C, generating THRM_INT interrupts when junction temperature exceeds programmable thresholds. This enables closed-loop thermal regulation in fanless systems - a distinguishing capability of the MPC755CVT400LE not present in earlier PowerPC variants.
Is MPC755CVT400LE pin-compatible with MPC745CVT400LE?
Yes, the MPC755CVT400LE and MPC745CVT400LE share identical 360-ball CBGA packages and pin assignments, including power, clock, reset, and bus signals. The only functional difference is the presence of L2 interface signals (L2CLK, L2AD[16:0], L2D[63:0], etc.) on the MPC755CVT400LE - which are no-connects on the MPC745CVT400LE. This allows drop-in replacement where L2 functionality is unused.
MPC755CVT400LE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 360-BBGA, FCBGA
- Series:
- MPC7xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 360-FCPBGA (25x25)
- Additional Interfaces:
- -
MPC755CVT400LE FAQ
1.How can I place an order for MPC755CVT400LE through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC755CVT400LE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC755CVT400LE reliable?
The price and inventory of MPC755CVT400LE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC755CVT400LE is usually 5 days.
3.What payment methods are accepted for MPC755CVT400LE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC755CVT400LE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC755CVT400LE?
MPC755CVT400LE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC755CVT400LE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC755CVT400LE?
For technical support, including MPC755CVT400LE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC755CVT400LE requirements.
6.How does Aetrix verify that MPC755CVT400LE is sourced from the original manufacturer or authorized distributors?
All MPC755CVT400LE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC755CVT400LE meets industry standards.
7.What is the process for return or replacement of MPC755CVT400LE?
All MPC755CVT400LE units undergo pre-shipment inspection (PSI). If there is an issue with MPC755CVT400LE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC755CVT400LE part is unused and in its original packaging.
Return procedure for MPC755CVT400LE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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