NXP Semiconductors MPC823CZQ66B2T

Overview

MPC823CZQ66B2T from Freescale Semiconductor is a dual-processor embedded PowerPC microprocessor with integrated communication processor module (CPM), video/LCD controller, USB 1.1 host/slave interface, PCMCIA-ATA v2.1 controller, and memory management unit-designed for low-power portable image capture and personal communication devices operating at 66 MHz, 3.3V core/I/O, and -40°C to +95°C industrial temperature range.

For engineers reviewing the MPC823CZQ66B2T datasheet, MPC823CZQ66B2T pinout, MPC823CZQ66B2T application, or MPC823CZQ66B2T equivalent, this page delivers verified technical context on its PowerPC 750-compatible core, CPM-based serial protocol offload (HDLC/UART/USB/I²C/SPI), dual-port RAM architecture, and glueless DRAM/SRAM/Flash memory controller-critical for handheld imaging, ISDN terminal, and mobile GUI system design.

Technical Context

The MPC823CZQ66B2T implements a static 32-bit PowerPC core (99 MIPS @ 66 MHz, Dhrystone 2.1) paired with a dedicated 32-bit scalar RISC communication processor module delivering >75 MIPS in parallel-enabling concurrent signal processing (JPEG compression/decompression via MAC unit) and system control without CPU intervention.

Its dual-processor architecture interfaces through 8 KB dual-port RAM and virtual DMA channels, supporting seven independent serial interfaces: two SCCs (10 Mbps Ethernet, IrDA 4 Mbps), two SMCs (UART/GCI/TDM), one USB 1.1 channel (12 Mbps, 4 endpoints), one SPI, and one I²C port-all programmable via ROM/downloadable microcode and managed by four baud rate generators.

Key Specifications

Pinout & Package

256-ball plastic ball grid array (PBGA) package, 17 mm × 17 mm footprint, 1.00 mm ball pitch, designed for high-density portable PCB layouts with thermal and electrical performance optimized for industrial temperature operation (-40°C to +95°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded PowerPC microprocessor applications.

Compared with MPC823ZT66B and MPC823CZC66B, the MPC823CZQ66B2T provides guaranteed operation across -40°C to +95°C with enhanced reliability screening-making it the only option qualified for mission-critical portable medical, defense, and transportation equipment where thermal stability and long-term parametric consistency are mandatory.

Availability

MPC823CZQ66B2T is available at Aetrix Electronics and suitable for handheld imaging systems, ISDN terminal adapters, portable medical displays, and mobile point-of-sale terminals requiring stable component supply across extended industrial temperature ranges.

Supply support for MPC823CZQ66B2T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors, analog, and connectivity solutions for automotive, industrial, and networking markets before its 2015 acquisition.

The MPC823 family was developed as a low-power, highly integrated entry-level PowerPC solution targeting portable computing and communications-emphasizing dual-processor efficiency, glueless memory expansion, and rich peripheral consolidation for space-constrained designs.

FAQ

What is the maximum operating frequency of the MPC823CZQ66B2T?

The MPC823CZQ66B2T is rated for a maximum operating frequency of 66 MHz. This speed is validated across the full industrial temperature range (-40°C to +95°C) and supports stable execution of the PowerPC core and communication processor module simultaneously. The device uses an external clock input fed into an on-chip PLL to generate internal bus clocks, and EBDF configuration is required for frequencies above 50 MHz to maintain timing integrity.

Does the MPC823CZQ66B2T support USB host functionality?

Yes, the MPC823CZQ66B2T includes a dedicated high-speed serial channel compliant with USB 1.1 specifications, supporting both host and slave modes at up to 12 Mbps with four configurable endpoints. The USB interface uses differential D+/D− signals routed to dedicated package balls and requires external termination and pull-up resistors per USB specification-enabling direct connection to peripherals like flash drives or PC synchronization without additional transceivers.

How does the communication processor module (CPM) interact with the PowerPC core in the MPC823CZQ66B2T?

The CPM in the MPC823CZQ66B2T communicates with the PowerPC core via 8 KB of on-chip dual-port RAM and virtual DMA channels managed by a dedicated DMA accelerator. This architecture allows the CPM to execute serial protocol stacks (HDLC, UART, USB, I²C) and signal processing tasks (JPEG compression via 16×16 MAC unit) independently-without interrupting or burdening the main core. Shared resources are arbitrated through the system interface unit, ensuring deterministic latency for time-critical communications.

What memory types does the MPC823CZQ66B2T support without external glue logic?

The MPC823CZQ66B2T supports DRAM, SRAM, EPROM, Flash EPROM, SDRAM, and EDO memory across eight programmable banks using its integrated memory controller-requiring no external address decoders or bus buffers. Each bank supports variable block sizes (32 KB to 256 MB), up to 30 wait states, and independent write protection. The controller provides four CAS/WE lines and one OE line, plus boot chip-select options for 8-/16-/32-bit memory initialization at reset.

Is the MPC823CZQ66B2T pin-compatible with other MPC823 variants?

The MPC823CZQ66B2T shares the same 256-ball 17×17 mm PBGA package (1.00 mm pitch) and pinout as MPC823CZC66B and MPC823ZC66B, making it mechanically and electrically interchangeable on PCBs designed for that footprint. However, it is not pin-compatible with the larger 23×23 mm PBGA variants (e.g., MPC823ZT66B), which use different ball mapping and spacing-requiring separate layout revisions for migration.