NXP Semiconductors MPC8245LVV300D

Overview

MPC8245LVV300D from Freescale Semiconductor is a 32-bit PowerPC™ MPC603e-based integrated processor combining a superscalar CPU core with PCI bridge, SDRAM memory controller, DUART, DMA, I2C, and interrupt controller in a single TBGA package. It operates at 300 MHz CPU frequency with 1.8–2.0 V core supply, supports 66 MHz PCI bus and up to 133 MHz memory bus, and targets embedded control systems requiring PCI-hosted peripheral integration.

For engineers reviewing the MPC8245LVV300D datasheet, MPC8245LVV300D pinout, MPC8245LVV300D application, or MPC8245LVV300D equivalent, key selection criteria include confirmed 300 MHz CPU speed grade, 352-pin TBGA package compatibility, PCI 2.2 compliance, LVTTL I/O voltage tolerance (3.3 V), and dynamic power management modes (doze/nap/sleep) for thermal-constrained industrial designs.

Technical Context

The MPC8245LVV300D implements a dual-PLL architecture: one PLL clocks the MPC603e core independently from the peripheral logic PLL, enabling asynchronous operation of CPU and PCI/memory subsystems while maintaining synchronous bus coherency. Its peripheral logic block integrates a full 32-bit PCI interface with DAC support, two-channel DMA, message unit with I2O capability, and programmable memory controller supporting up to 2 GB SDRAM across 1–8 banks.

It features a 64-bit peripheral logic bus decoupling address and data paths for pipelined access, store-gathering for PCI writes, hardware-enforced coherency, and dual UARTs with programmable timing. The core includes 16 KB instruction and 16 KB data caches with lockable ways, FPU (software-enabled), MMU, and IEEE 1149.1 JTAG debug support.

Key Specifications

Pinout & Package

Package: 352-pin Tape Ball Grid Array (TBGA), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant, thermal pad on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated processor applications.

Compared with MPC8245LVV300D, MPC8241LVV266D offers identical functionality at lower frequency and power, making it suitable for cost- and thermal-sensitive deployments, while MPC8247ZQH333B extends capabilities with DDR and USB but demands mechanical and layout changes - neither is pin-compatible, and both require validation against original timing and thermal constraints.

Availability

MPC8245LVV300D is available at Aetrix Electronics and suitable for telecom line card control, industrial PLC backplane interface, medical imaging subsystems, and avionics data acquisition units requiring stable component supply across extended product lifecycles.

Supply support for MPC8245LVV300D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC8245LVV300D belongs to Freescale's PowerQUICC™ II family of integrated communications processors, designed specifically for cost-sensitive, high-reliability embedded control applications requiring PCI-hosted peripheral integration without external bridge logic.

FAQ

What CPU core does the MPC8245LVV300D use, and what is its confirmed operating frequency?

The MPC8245LVV300D uses the PowerPC™ MPC603e superscalar core. Its confirmed operating frequency is 300 MHz, as indicated by the "300" in the ordering suffix "LVV300D". This speed grade is validated under 1.8–2.0 V ±100 mV core supply and requires PCI_SYNC_IN at 50 MHz with appropriate PLL_CFG[0:4] settings per Table 7 and Section 6 of the hardware specification.

Does the MPC8245LVV300D support DDR SDRAM?

No, the MPC8245LVV300D supports only SDR SDRAM, not DDR. Its memory controller is designed for single-data-rate SDRAM devices with programmable timing for 16-, 64-, 128-, 256-, or 512-Mbit densities across 1–8 banks. DDR support was introduced in later derivatives such as the MPC8247, not in the MPC8245LVV300D.

What is the package type and pin count of the MPC8245LVV300D?

The MPC8245LVV300D uses a 352-pin Tape Ball Grid Array (TBGA) package, measuring 27 mm × 27 mm with 1.27 mm pitch. This surface-mount package includes an exposed thermal pad on the underside and is RoHS-compliant. Pinout is fully documented in Section 5 of the MPC8245 Hardware Specifications Rev. 10.

Can the MPC8245LVV300D operate in PCI agent mode?

Yes, the MPC8245LVV300D supports both PCI host and PCI agent modes. In agent mode, it responds to memory-mapped and I/O-space accesses initiated by another PCI bus master, enabling use as a peripheral controller in systems where a separate host processor manages the PCI bus hierarchy.

What power management modes are available on the MPC8245LVV300D, and what are their typical power draws at 300 MHz?

The MPC8245LVV300D supports doze (1.2–1.4 W), nap (0.4–0.6 W), and sleep (0.2–0.3 W) modes at 300 MHz operation. These values are measured at VDD = 2.0 V, OVDD = 3.3 V, and include core, PLL, and logic power - excluding I/O supply contributions. Mode entry/exit is controlled via MSR[POW] bit and requires proper sequencing of HRST_CPU/HRST_CTRL per Section 4.3.