NXP Semiconductors MPC8245TVV300D

Overview

MPC8245TVV300D from Freescale Semiconductor is a PowerPC-based integrated processor combining an MPC603e core and PCI bridge, operating at 300 MHz with 1.7–2.1 V core supply, rated for –40°C to +105°C junction temperature, and packaged in lead-free TBGA (VV). It targets embedded control and communications infrastructure where deterministic real-time processing and PCI host bridging are required.

For engineers reviewing the MPC8245TVV300D datasheet, MPC8245TVV300D pinout, MPC8245TVV300D application, or MPC8245TVV300D equivalent, key selection considerations include its extended-temperature operation, TBGA package footprint, 300 MHz core frequency, PCI bridge integration, and compatibility with legacy PowerPC 603e software ecosystems.

Technical Context

The MPC8245TVV300D implements a superscalar, three-issue PowerPC 603e core with 16 KB instruction and 16 KB data L1 cache, tightly coupled to an integrated PCI-to-PCI bridge supporting 32-bit/33 MHz PCI bus mastering and target operations. Its memory controller supports SDRAM, SRAM, and flash interfaces with programmable timing.

It operates under industrial temperature range (–40°C to +105°C), requires 1.7–2.1 V VDD supply, and uses a 484-pin TBGA package (VV) with lead-free finish. The Processor Version Register value is 0x80811014, confirming MPC8245T revision-level silicon.

Key Specifications

Pinout & Package

Package: 484-pin Thin Ball Grid Array (TBGA), lead-free, 27 mm × 27 mm, 1.27 mm ball pitch, with thermal pad on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated processor applications.

Compared with MPC8245TVV300D, MPC8245TZU300D offers identical functionality without lead-free compliance, while MPC8245TVV333D provides higher performance within the same package and thermal envelope-enabling scalable performance tuning without PCB redesign.

Availability

MPC8245TVV300D is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and network appliance applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MPC8245TVV300D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions before its acquisition by NXP in 2015. It pioneered PowerPC-based integrated processors for communications and industrial markets.

The MPC8245 product line delivers highly integrated PowerPC-based SoCs targeting cost-sensitive, thermally constrained embedded systems requiring PCI connectivity and deterministic real-time execution.

FAQ

What is the maximum operating junction temperature for the MPC8245TVV300D?

The MPC8245TVV300D is rated for a die-junction temperature range of –40°C to +105°C. This specification is validated per Freescale's recommended operating conditions and applies to continuous operation under specified voltage and loading conditions. Thermal design must ensure the junction does not exceed +105°C under worst-case ambient and power dissipation scenarios. The MPC8245TVV300D datasheet defines this limit in Table 2 of the MPC8245ECS01AD addendum.

Does the MPC8245TVV300D support PCI bus mastering?

Yes, the MPC8245TVV300D integrates a full PCI-to-PCI bridge capable of both bus mastering and target operations. It supports 32-bit/33 MHz PCI transactions, including memory and I/O reads/writes, configuration space access, and interrupt assertion. This capability is inherent to the silicon and requires no external components. The MPC8245TVV300D hardware specification confirms master-mode operation in Section 4.2.1 of the MPC8245EC document.

What does the "VV" suffix indicate in MPC8245TVV300D?

"VV" denotes a lead-free 484-pin TBGA package per Freescale's part numbering convention. It replaces the older "ZU" (standard TBGA) variant and complies with RoHS Directive 2002/95/EC. The VV package shares identical mechanical dimensions and pinout with ZU but requires Pb-free solder reflow profiles. This designation is documented in Figure 33 and Section 9.3 of the MPC8245ECS01AD specification.

Is the MPC8245TVV300D pin-compatible with other MPC8245 variants?

Yes, all MPC8245TXXnnnD variants-including MPC8245TVV300D, MPC8245TZU300D, and MPC8245TVV333D-share identical 484-pin TBGA footprints and pin assignments. Differences are limited to package finish (VV vs. ZU) and core frequency/voltage specifications. No PCB layout change is needed when substituting within the same package family, as confirmed in Table A and Section 5 of the MPC8245EC hardware specification.

What PowerPC core version is implemented in the MPC8245TVV300D?

The MPC8245TVV300D implements the PowerPC MPC603e core, a superscalar, three-issue implementation compliant with the PowerPC Book III architecture. It features 16 KB instruction and 16 KB data L1 caches, FPU support, and backward compatibility with PowerPC 603 binaries. The Processor Version Register value 0x80811014, reported at reset, confirms this core revision and is defined in the MPC8245EC specification Section 3.3.2.