NXP Semiconductors MPC8245TZU266D

Overview

MPC8245TZU266D from Freescale Semiconductor is a 32-bit PowerPC-based integrated processor combining an MPC603e core and PCI bridge, operating at 266 MHz with 1.7–2.1 V core supply, rated for –40°C to +105°C junction temperature, and packaged in lead-free TBGA (ZU). It targets embedded control applications requiring PCI host-bridge functionality in industrial and telecom systems.

For engineers reviewing the MPC8245TZU266D datasheet, MPC8245TZU266D pinout, MPC8245TZU266D application, or MPC8245TZU266D equivalent, key selection criteria include its extended-temperature operation, TBGA package footprint, PowerPC 603e instruction set compatibility, and integrated PCI-to-processor bridging capability.

Technical Context

The MPC8245TZU266D implements a superscalar, three-stage-pipeline PowerPC 603e core with 16 KB instruction and 16 KB data caches, and integrates a full PCI 2.2-compliant bridge supporting both master and target transactions. Its memory controller supports SDRAM, SRAM, and flash interfaces with programmable timing.

It features a 64-bit, 33 MHz PCI bus interface, on-chip interrupt controller, programmable watchdog timer, and JTAG debug support. The device uses a 36-pin multiplexed address/data bus and requires external clock generation for CPU and PCI domains.

Key Specifications

Pinout & Package

Package: 352-ball TBGA (ZU), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated processor applications.

Compared with MPC8245TVV266D and MPC8245TZU300D, the MPC8245TZU266D provides optimal balance of thermal margin, power efficiency, and deterministic timing at 266 MHz in the same ZU TBGA package-ideal for cost-sensitive, thermally constrained embedded systems.

Availability

MPC8245TZU266D is available at Aetrix Electronics and suitable for industrial control, telecom infrastructure, and medical subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MPC8245TZU266D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions before its acquisition by NXP in 2015.

The MPC8245 series belongs to Freescale's PowerQUICC™ family of integrated communications processors, designed specifically for PCI-based embedded control and protocol processing in space-constrained, thermally demanding applications.

FAQ

What is the maximum operating junction temperature for the MPC8245TZU266D?

The MPC8245TZU266D is rated for a die-junction temperature range of –40°C to +105°C, as confirmed in the MPC8245 Hardware Specification Addendum Rev. 1.1. This extended temperature grade is validated for continuous operation under thermal stress conditions typical in industrial and telecom equipment. Thermal design must ensure that actual T_J remains within this limit using appropriate heatsinking and airflow. The MPC8245TZU266D datasheet specifies no derating is required up to +105°C when operated within recommended voltage and timing margins.

Does the MPC8245TZU266D support PCI 2.2 compliance?

Yes, the MPC8245TZU266D implements a fully compliant PCI 2.2 bridge, supporting both PCI master and target operations, 32-bit/33 MHz transactions, and configuration space access. Its PCI interface meets all mandatory timing, signaling, and protocol requirements defined in the PCI Local Bus Specification Revision 2.2. This compliance is documented in the MPC8245 Integrated Processor Hardware Specifications and verified in the MPC8245TZU266D-specific addendum. The MPC8245TZU266D requires no external glue logic to achieve PCI 2.2 interoperability.

What package type does the MPC8245TZU266D use, and is it lead-free?

The MPC8245TZU266D uses a 352-ball thin BGA (TBGA) package with ZU designation, indicating lead-free construction per RoHS Directive 2011/65/EU. The "ZU" suffix explicitly denotes the lead-free TBGA variant, and the part is marked accordingly per Freescale's packaging nomenclature in Figure 33 of the hardware specification addendum. The MPC8245TZU266D requires reflow soldering profiles compliant with IPC-J-STD-020 for moisture sensitivity level 3 (MSL3).

Is the MPC8245TZU266D pin-compatible with other MPC8245 variants like MPC8245TZU300D?

Yes, the MPC8245TZU266D is pin-compatible with other ZU-suffixed MPC8245 variants-including MPC8245TZU300D, MPC8245TZU333D, and MPC8245TZU350D-as they share identical 352-ball TBGA mechanical and electrical pinouts. Differences are limited to core frequency, voltage tolerance windows, and internal speed-binning; no PCB redesign is needed when upgrading within the ZU family. The MPC8245TZU266D maintains full signal and power pin equivalence across these variants.

What is the Processor Version Register value for the MPC8245TZU266D?

The Processor Version Register (PVR) value for the MPC8245TZU266D is 0x80811014, as specified in Table A of the MPC8245 Hardware Specification Addendum Rev. 1.1. This 32-bit identifier encodes the processor family (MPC82xx), revision level (0x14), and microarchitecture version, and is read during boot to configure software initialization sequences. Firmware must validate this PVR to ensure correct cache, MMU, and exception-handling behavior for the MPC8245TZU266D.