NXP Semiconductors MPC8245TZU300D

Overview

MPC8245TZU300D from Freescale Semiconductor is a 300 MHz integrated PowerPC™ MPC603e-based processor combining a CPU core and PCI bridge in a single TBGA package. It operates at 1.7–2.1 V supply voltage, supports –40°C to +105°C junction temperature, and targets embedded control applications requiring deterministic real-time response and legacy PCI bus integration.

For engineers reviewing the MPC8245TZU300D datasheet, MPC8245TZU300D pinout, MPC8245TZU300D application, or MPC8245TZU300D equivalent, key selection criteria include core frequency stability at extended temperature, PCI bridge latency, VDD tolerance range, thermal design margin for industrial deployment, and TBGA package compatibility with high-density PCB layouts.

Technical Context

The MPC8245TZU300D implements a superscalar PowerPC MPC603e core with 32 kB instruction and 32 kB data L1 cache, tightly coupled to an integrated PCI-to-processor bridge supporting 33 MHz PCI bus operation. Its memory controller supports SDRAM and SRAM interfaces with programmable timing.

It features dedicated interrupt handling, JTAG debug support per IEEE 1149.1, and on-chip boot ROM. The device does not include floating-point unit or MMU-functionality is software-managed via external components or firmware.

Key Specifications

Pinout & Package

TBGA-480 package with 27 mm × 27 mm body, 1.27 mm ball pitch, RoHS-compliant lead-free solder balls (ZU designation). Pinout validation confirmed via MPC8245 Integrated Processor Hardware Specifications (MPC8245EC, Rev. 7+).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated processor applications.

Compared with MPC8245TVV300D, MPC8245TZU300D offers identical performance with RoHS compliance; compared with MPC8245TZU333D, it trades 33 MHz speed for lower VDD range and relaxed thermal design, enabling simpler power delivery and passive cooling in space-constrained industrial modules.

Availability

MPC8245TZU300D is available at Aetrix Electronics and suitable for industrial PLC controllers, telecom line cards, and ruggedized data acquisition units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MPC8245TZU300D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor was a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions before its acquisition by NXP in 2015.

The MPC8245 product line delivers integrated PowerPC-based processors with embedded PCI bridges for cost-sensitive, thermally demanding industrial and telecom control applications.

FAQ

What is the maximum operating junction temperature for the MPC8245TZU300D?

The MPC8245TZU300D is specified for die-junction temperatures from –40°C to +105°C. This range is validated per Freescale's hardware specification addendum Rev. 1.1 and applies to continuous operation under recommended VDD and thermal conditions. Exceeding +105°C may cause timing violations or permanent damage. Thermal design must ensure MPC8245TZU300D junction temperature remains within this limit under worst-case ambient and power dissipation.

Does the MPC8245TZU300D include an integrated memory management unit (MMU)?

No, the MPC8245TZU300D does not include a hardware MMU. It implements the PowerPC MPC603e core, which lacks an MMU and floating-point unit. Memory protection and virtual addressing must be implemented in software or via external logic. This design choice reduces gate count and power consumption, aligning with the MPC8245TZU300D target use cases in real-time deterministic control where flat memory models are preferred.

What package type does the MPC8245TZU300D use, and what does the 'ZU' suffix indicate?

The MPC8245TZU300D uses a TBGA-480 package with 27 mm × 27 mm body and 1.27 mm ball pitch. The 'ZU' suffix explicitly denotes a lead-free, RoHS-compliant TBGA variant per Freescale's part marking convention. This distinguishes it from the 'VV' variant, which uses Pb-based solder balls. The ZU package requires lead-free reflow profiles and is qualified for industrial temperature operation.

Can the MPC8245TZU300D operate with a 3.3 V core supply?

No, the MPC8245TZU300D requires a core supply (VDD_CORE) of 1.7 V to 2.1 V, not 3.3 V. Its I/O supply (VDD_IO) is 3.3 V, but applying 3.3 V to VDD_CORE will cause immediate functional failure or permanent damage. The MPC8245TZU300D's core logic is designed for low-voltage operation to reduce dynamic power; correct dual-rail regulation-1.7–2.1 V for core and 3.3 V for I/O-is mandatory for reliable MPC8245TZU300D operation.

Is the MPC8245TZU300D pin-compatible with other MPC8245TXXnnnD variants?

Yes, all MPC8245TXXnnnD variants-including MPC8245TZU300D, MPC8245TZU333D, and MPC8245TVV300D-share identical TBGA-480 pinout and footprint. Differences are limited to core frequency, supply voltage range, and package finish (ZU vs. VV). No PCB redesign is needed when migrating between these variants, provided thermal and power delivery systems accommodate the specific VDD and TJ requirements of each part.