NXP Semiconductors MPC8245TZU350D
- Part No.:
- MPC8245TZU350D
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 352-LBGA
- Datasheet:
-
MPC8245TZU350D.pdf
- Description:
- IC MPU MPC82XX 350MHZ 352TBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,164
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC8245TZU350D from Freescale Semiconductor is a 350 MHz integrated PowerPC™ MPC603e-based processor with on-chip PCI bridge, designed for embedded control and communications applications requiring high integration, deterministic real-time response, and PCI host interface capability. It operates at 1.9–2.2 V core supply and supports –40°C to +105°C junction temperature.
For engineers reviewing the MPC8245TZU350D datasheet, MPC8245TZU350D pinout, MPC8245TZU350D application, or MPC8245TZU350D equivalent, key selection considerations include verified core frequency (350 MHz), TBGA package type (ZU), extended temperature range, PCI bridge functionality, and PowerPC 603e instruction set compatibility.
Technical Context
The MPC8245TZU350D implements a superscalar, three-stage pipeline PowerPC 603e core with 16 KB instruction and 16 KB data L1 cache, tightly coupled to a PCI-to-processor bridge that supports PCI 2.2-compliant 33 MHz, 32-bit bus mastering and memory-mapped I/O transactions. It integrates memory controller logic for SDRAM/SDRAM and local bus peripherals.
Its architecture enables single-chip system-on-module designs where the processor core handles application code execution while the integrated PCI bridge manages peripheral expansion, DMA transfers, and host-side communication-eliminating need for external bridge logic in compact industrial controllers and telecom line cards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | PowerPC MPC603e, 350 MHz maximum operating frequency |
| Core Supply Voltage | 1.9 V to 2.2 V - defines minimum/maximum VDD tolerance for stable 350 MHz operation |
| Operating Temperature | –40°C to +105°C junction - qualified for extended-temperature industrial and telecom environments |
| Package Type | TBGA (ZU suffix) - 480-ball thin ball grid array, lead-free, for high-density PCB layout |
| PCI Interface | PCI 2.2-compliant, 33 MHz, 32-bit, bus-mastering bridge - enables direct connection to standard PCI peripherals without external logic |
| L1 Cache | 16 KB instruction + 16 KB data - reduces external memory access latency for real-time deterministic execution |
| Processor Version Register | 0x80811014 - identifies silicon revision and functional configuration per Freescale hardware specification |
Pinout & Package
Package: 480-ball TBGA (ZU), 27 mm × 27 mm, 1.0 mm ball pitch, lead-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKIN | Primary clock input | Accepts 33 MHz differential or single-ended reference for PLL generation of internal CPU and PCI clocks |
| VDD_CORE | Core power supply | Supplies regulated 1.9–2.2 V to CPU core and L1 cache; requires low-noise decoupling |
| VDD_IO | I/O power supply | Provides 3.3 V for PCI and local bus I/O buffers; independent from core rail |
| PCI_AD[31:0] | PCI address/data multiplexed bus | 32-bit time-multiplexed address/data lines compliant with PCI 2.2 timing requirements |
| PCI_C/BE[3:0]# | PCI command/byte enable | Defines transaction type (memory I/O/config) and active byte lanes during data phase |
| RESET# | Asynchronous reset input | Active-low signal asserting full chip reset including CPU core, PCI bridge, and memory controller logic |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Bridge | Eliminates external bridge IC, reducing BOM count and board area in PCI-based embedded systems |
| Extended Temperature Range | Validated operation from –40°C to +105°C enables deployment in uncontrolled industrial enclosures and outdoor telecom cabinets |
| PowerPC 603e Core Compatibility | Binary-compatible with existing MPC603e software toolchains and RTOS ports, easing migration from legacy designs |
| On-Chip Memory Controller | Direct support for SDRAM and local bus peripherals simplifies memory subsystem design and timing closure |
| Lead-Free TBGA Packaging | ZU package meets RoHS requirements and supports fine-pitch surface-mount assembly for high-reliability production |
Applications
| Industrial PLC Controller | Telecom Line Card |
|---|---|
Use Scenario: Real-time motion control and I/O scanning in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Central processing unit and PCI host bridge managing fieldbus interfaces (e.g., Profibus, CANopen) via PCI expansion cards. Use Value: Integrated PCI bridge and deterministic 350 MHz PowerPC core reduce latency in cyclic scan execution and eliminate external bridge logic cost and routing complexity. | Use Scenario: Protocol processing and packet forwarding in TDM-over-IP gateway line cards installed in central office switching equipment. IC Role / Device Role / Timing Role: Host processor executing signaling stack and controlling PCI-based DSP or framer daughterboards. Use Value: Extended temperature rating (–40°C to +105°C) ensures reliability in thermally constrained telecom chassis; 32-bit PCI interface enables high-bandwidth control plane communication with offload peripherals. |
| Medical Imaging Subsystem | Ruggedized Network Appliance |
Use Scenario: Image acquisition and preprocessing in portable ultrasound or X-ray console subsystems requiring compact, fanless operation. IC Role / Device Role / Timing Role: Embedded controller coordinating sensor interface, frame buffer management, and Ethernet or USB host connectivity. Use Value: On-chip memory controller supports direct SDRAM interfacing for real-time image buffering; 16 KB L1 caches minimize instruction fetch stalls during burst pixel processing. | Use Scenario: Secure remote management and firmware update engine in hardened network appliances deployed in utility substations or transportation infrastructure. IC Role / Device Role / Timing Role: Trusted boot host running secure bootloader and cryptographic services, interfacing with PCI-based crypto accelerators. Use Value: Lead-free ZU TBGA package withstands thermal cycling in wide-temperature deployments; PowerPC 603e ISA ensures long-term software maintainability across product generations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar integrated PowerPC processor with PCI bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8245TVV350D | Same core frequency (350 MHz) and architecture, but uses leaded TBGA (VV) package instead of lead-free ZU | Not suitable for RoHS-compliant production; requires different reflow profile and may not meet modern environmental compliance mandates | Select only if legacy assembly process prohibits lead-free solder or if ZU package availability is constrained |
| MPC8247TZU350D | Successor part with enhanced security features (e.g., secure boot ROM), same ZU TBGA package and 350 MHz core, but adds cryptographic acceleration block | Better suited for applications requiring hardware-enforced firmware integrity or encrypted data path handling | Prefer when security certification (e.g., FIPS, Common Criteria) is required; otherwise MPC8245TZU350D remains optimal for cost-sensitive deterministic control |
Compared with MPC8245TVV350D and MPC8247TZU350D, the MPC8245TZU350D delivers verified 350 MHz PowerPC performance in a RoHS-compliant package without added security overhead-making it ideal for cost-constrained, temperature-hardened industrial control where deterministic latency and legacy software compatibility are primary drivers.
Availability
MPC8245TZU350D is available at Aetrix Electronics and suitable for industrial PLC controllers, telecom line cards, medical imaging subsystems, and ruggedized network appliances requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MPC8245TZU350D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor was a fabless semiconductor company specializing in embedded processors, analog, and connectivity solutions before its acquisition by NXP Semiconductors in 2015. It pioneered PowerPC-based integrated processors for industrial and communications markets.
The MPC8245 product line was engineered to deliver single-chip PowerPC computing with integrated PCI bridging for space-constrained, high-reliability embedded systems-targeting applications where minimizing external logic, ensuring thermal robustness, and maintaining software compatibility were critical design goals.
FAQ
What is the maximum guaranteed operating frequency of the MPC8245TZU350D?
The MPC8245TZU350D is fully characterized and guaranteed to operate at 350 MHz under specified conditions: core voltage 1.9–2.2 V and junction temperature –40°C to +105°C. This frequency is confirmed in Freescale's MPC8245 Hardware Specification Addendum Rev. 1.1 and corresponds to the "350" suffix in the part number. The MPC8245TZU350D does not support overclocking beyond this rated speed without violating electrical and thermal specifications.
Does the MPC8245TZU350D support PCI Express or only legacy PCI?
The MPC8245TZU350D supports only PCI 2.2-compliant 33 MHz, 32-bit parallel bus operation-not PCI Express. Its integrated bridge implements conventional PCI signaling, arbitration, and configuration space access. The MPC8245TZU350D lacks PCIe PHY, link training, or serial lane infrastructure; any PCIe interface would require an external PCIe-to-PCI bridge, which is not supported by the MPC8245TZU350D's native architecture.
Is the MPC8245TZU350D pin-compatible with other MPC8245 variants like MPC8245TVV350D?
Yes-the MPC8245TZU350D and MPC8245TVV350D share identical pinout and ball map within the 480-ball TBGA footprint. Both use the same mechanical outline and signal assignment per Freescale's MPC8245 Integrated Processor Hardware Specifications. The only physical difference is ZU (lead-free) versus VV (leaded) solder composition; no PCB redesign is needed when substituting between them, though reflow profiles must be adjusted accordingly.
What does the 'T' and 'ZU' in MPC8245TZU350D signify?
In MPC8245TZU350D, 'T' denotes extended temperature grade (–40°C to +105°C), and 'ZU' specifies the lead-free thin ball grid array package per Freescale's part numbering convention. The '350' indicates maximum core frequency of 350 MHz, and 'D' is the revision level. These identifiers are defined in Section 9.3 ("Part Marking") and Table A of the MPC8245 Hardware Specification Addendum Rev. 1.1.
Can the MPC8245TZU350D execute PowerPC e300 or Book E instructions?
No-the MPC8245TZU350D implements the original PowerPC 603e core architecture, which supports the PowerPC Book III (32-bit user mode) and Book II (MMU) instruction sets-but not e300 or Book E extensions. It lacks the enhanced branch prediction, variable-length encoding, or SPE/AltiVec units introduced in later cores. Software targeting MPC8245TZU350D must be compiled for PowerPC 603e compatibility, not e300 or Book E.
MPC8245TZU350D Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 352-LBGA
- Series:
- MPC82xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC 603e
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 350MHz
- Co-Processors/DSP:
- -
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 352-TBGA (35x35)
- Additional Interfaces:
- I2C, I²O, PCI, UART
MPC8245TZU350D FAQ
1.How can I place an order for MPC8245TZU350D through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8245TZU350D on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8245TZU350D reliable?
The price and inventory of MPC8245TZU350D are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8245TZU350D is usually 5 days.
3.What payment methods are accepted for MPC8245TZU350D?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8245TZU350D transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8245TZU350D?
MPC8245TZU350D orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8245TZU350D order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8245TZU350D?
For technical support, including MPC8245TZU350D datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8245TZU350D requirements.
6.How does Aetrix verify that MPC8245TZU350D is sourced from the original manufacturer or authorized distributors?
All MPC8245TZU350D products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8245TZU350D meets industry standards.
7.What is the process for return or replacement of MPC8245TZU350D?
All MPC8245TZU350D units undergo pre-shipment inspection (PSI). If there is an issue with MPC8245TZU350D, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8245TZU350D part is unused and in its original packaging.
Return procedure for MPC8245TZU350D:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC8245TZU350D Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

