NXP Semiconductors MPC8247ZQMIBA

Overview

MPC8247ZQMIBA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II integrated communications processor featuring a 32-bit Power Architecture® G2_LE core, dual 16 KB instruction/data caches, two Fast Communication Controllers (FCCs), three Serial Communication Controllers (SCCs), USB 2.0 full/low-speed controller, PCI bridge, and memory controller - all in a single 516-pin PBGA package. It operates at up to 400 MHz core frequency and targets embedded networking, industrial gateways, and telecom edge equipment requiring deterministic real-time communication processing.

For engineers reviewing the MPC8247ZQMIBA datasheet, MPC8247ZQMIBA pinout, MPC8247ZQMIBA application, or MPC8247ZQMIBA equivalent, key selection considerations include its 400 MHz G2_LE core performance, dual-FCC 10/100 Ethernet support, absence of integrated security engine (SEC), UTOPIA II port exclusion, and ZQ-package thermal characteristics for lead-sphere solder reflow compatibility.

Technical Context

The MPC8247ZQMIBA implements a dual-issue G2_LE core derived from the MPC603e architecture with physically addressed, four-way set-associative caches and a compliant MMU. Its CPM subsystem executes communications protocols independently via dedicated 16 KB data + 4 KB instruction RAM, supporting HDLC, UART, transparent, and QUICC multichannel modes across SCCs and SMCs.

It integrates a 60x-to-PCI bridge compliant with PCI Specification 2.2 (32-bit, 66 MHz, 3.3 V), supports burst/single transfers on a 64-bit data bus, and features separate 1.5 V core and 3.3 V I/O supplies with independent PLLs for core and CPM clock domains - enabling power/performance optimization through configurable clock multipliers (up to 8:1).

Key Specifications

Pinout & Package

Package: 516-pin Plastic Ball Grid Array (PBGA), ZQ variant - lead-sphere solder balls, JEDEC MO-251 compliant, 27 mm × 27 mm body, 1.27 mm ball pitch, thermal pad on underside for board-level heat conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8248ZQMIBA and MPC8271ZQMIBA, the MPC8247ZQMIBA delivers identical core performance, memory controller, dual-FCC Ethernet, and PCI bridge functionality but omits both the security engine and UTOPIA II interface - making it the optimal choice for cost-sensitive, non-encrypted, non-ATM embedded networking applications where those features are unnecessary.

Availability

MPC8247ZQMIBA is available at Aetrix Electronics and suitable for industrial gateways, enterprise branch routers, telecom access nodes, and remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC8247ZQMIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep heritage in Power Architecture® technology acquired from Freescale.

The MPC8247ZQMIBA belongs to the PowerQUICC II family - designed specifically for cost-optimized, real-time communications processing in embedded networking equipment where integrated Ethernet, serial, PCI, and memory control reduce system complexity without requiring cryptographic acceleration or ATM support.

FAQ

Does the MPC8247ZQMIBA include an integrated security engine (SEC)?

No, the MPC8247ZQMIBA does not include an integrated security engine. Unlike the MPC8248ZQMIBA and MPC8272ZQMIBA, this part omits hardware acceleration for DES, 3DES, AES, SHA-1, MD-5, and RNG functions. The MPC8247ZQMIBA is intended for applications where cryptographic processing is handled in software or by external co-processors. This omission reduces die size and cost while maintaining identical core, memory, and peripheral capabilities otherwise.

What is the maximum operating frequency of the MPC8247ZQMIBA core?

The MPC8247ZQMIBA supports a maximum core frequency of 400 MHz, achieved using an internal PLL with selectable multiplication ratios (up to 8:1) driven by a 50 MHz CLKIN source. This frequency is validated under recommended operating conditions (VDD = 1.425–1.575 V, TA = 0–70°C, junction temperature ≤105°C). Performance scales linearly with clock speed, enabling deterministic real-time packet processing for dual 10/100 Ethernet interfaces.

Which packages are available for the MPC8247ZQMIBA?

The MPC8247ZQMIBA is offered exclusively in the ZQ package: a 516-ball Plastic Ball Grid Array with lead-sphere solder finish, compliant with JEDEC MO-251. This package uses a 27 mm × 27 mm body with 1.27 mm ball pitch and includes an exposed thermal pad on the underside for enhanced board-level heat dissipation. The VR (lead-free) variant is not assigned to MPC8247ZQMIBA - only ZQ is valid per Freescale's ordering matrix.

Does the MPC8247ZQMIBA support UTOPIA II interface?

No, the MPC8247ZQMIBA does not support UTOPIA II. Table 1 in the MPC8272EC hardware specification explicitly lists "UTOPIA II Ports" as 0 for MPC8247, distinguishing it from the MPC8272 and MPC8271 which support one UTOPIA II port. This omission aligns with its target use case in non-ATM infrastructure. Engineers requiring UTOPIA II must select MPC8271ZQMIBA or MPC8272ZQMIBA instead.

What are the key power supply requirements for the MPC8247ZQMIBA?

The MPC8247ZQMIBA requires two independent regulated supplies: VDD (1.425–1.575 V, ±3% tolerance) for the core and PLLs, and VDDH (3.135–3.465 V, ±3% tolerance) for I/O buffers. Each supply must be decoupled with ≥0.1 µF ceramic capacitors per pin plus bulk capacitance (≥94 µF total: 47 µF for VDD, 47 µF for VDDH). Violating voltage limits or insufficient decoupling risks functional failure or accelerated electromigration in the ZQ-package solder balls.