NXP Semiconductors MPC8248ZQMIBA

Overview

MPC8248ZQMIBA from NXP Semiconductors (formerly Freescale) is a PowerQUICC II integrated communications processor combining a 32-bit Power Architecture G2_LE core (up to 400 MHz), dual Fast Communication Controllers (FCCs) for 10/100 Ethernet, three Serial Communication Controllers (SCCs), PCI bridge (32-bit, 66 MHz), and integrated Security Engine (SEC) supporting AES, DES, SHA-1, and RSA acceleration - deployed in telecom edge routers and industrial gateways requiring deterministic real-time packet processing and hardware crypto offload.

For engineers reviewing the MPC8248ZQMIBA datasheet, MPC8248ZQMIBA pinout, MPC8248ZQMIBA application, or MPC8248ZQMIBA equivalent, this page delivers verified package mapping (516-pin PBGA, ZQ lead-sphere variant), confirmed SEC-enabled functionality, validated 16 KB I/D cache configuration, exact clock multiplier ratios (core: 2–8×, CPM: 2–8×), and documented thermal resistance values (RθJA = 19°C/W on 4-layer board).

Technical Context

The MPC8248ZQMIBA implements a dual-issue G2_LE core with physically addressed, four-way set-associative 16 KB instruction and data caches, MMU support, and separate PLLs for core (266–400 MHz) and CPM (200–267 MHz) domains. Its CPM subsystem integrates a 32-bit RISC microcontroller with 16 KB dual-port RAM and 4 KB instruction RAM, enabling protocol offload for HDLC, UART, and TDM.

Hardware security is delivered via the integrated Security Engine (SEC), supporting DES/3DES, AES-128/192/256, SHA-1, MD-5, RC4, PKEU, and RNG - accessible through dedicated DMA channels and register-mapped control. The 60x bus (64-bit data, 32-bit address) interfaces with external memory and peripherals, while the PCI bridge operates at 3.3 V, 66 MHz, compliant with PCI Specification 2.2.

Key Specifications

Pinout & Package

Package: 516-ball PBGA (ZQ), 27 mm × 27 mm, 1.0 mm ball pitch, lead-sphere solder finish per J-STD-020. Thermal pad on underside requires solid ground plane connection for optimal heat transfer.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8272VR, MPC8248ZQMIBA offers identical functionality with optimized lead-sphere solder joints for improved thermal cycling reliability in extended-temperature deployments; versus MPC8360EVRAGDB, it provides proven stability and mature toolchain support for cost-sensitive, volume-manufactured edge devices without requiring architectural migration.

Availability

MPC8248ZQMIBA is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, and secure wireless backhaul units requiring stable component supply, long-lifecycle support, and traceable sourcing from authorized channels.

Supply support for MPC8248ZQMIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture technology acquired from Freescale.

The MPC8248ZQMIBA belongs to the PowerQUICC II family - designed specifically for cost-effective, low-power communications processing in carrier-class edge equipment and industrial control systems requiring hardware-accelerated crypto and deterministic real-time I/O.

FAQ

What is the maximum operating frequency of the MPC8248ZQMIBA core?

The MPC8248ZQMIBA core supports a maximum operating frequency of 400 MHz, achieved using a 4× internal clock multiplier on a 100 MHz CLKIN reference. This is confirmed in Section 1.1 "Features" of the MPC8272EC Rev. 3 specification, which explicitly lists "System core microprocessor supporting frequencies of 266–400 MHz" for all MPC8272-family SoCs including MPC8248ZQMIBA.

Does the MPC8248ZQMIBA include an integrated Security Engine (SEC)?

Yes, the MPC8248ZQMIBA includes a fully integrated Security Engine (SEC) supporting DES, 3DES, AES, SHA-1, MD-5, RC4, PKEU, and RNG in hardware. This is explicitly stated in Table 1 ("MPC8272 PowerQUICC II Family Functionality") and Figure 1's block diagram annotation, with the footnote "1 MPC8272/8248 only" confirming SEC presence exclusively in MPC8272 and MPC8248 variants.

What package type does the MPC8248ZQMIBA use, and what does 'ZQ' signify?

The MPC8248ZQMIBA uses a 516-ball PBGA package with 'ZQ' denoting the lead-sphere solder ball variant, as defined in Table 2 ("MPC8272 PowerQUICC II Device Packages"). ZQ packages employ spherical solder balls for enhanced thermal and mechanical reliability during reflow, distinct from VR (lead-free) variants, and share identical pinout and footprint with MPC8272ZQ and MPC8248VR.

Can the MPC8248ZQMIBA operate in PCI host mode?

Yes, the MPC8248ZQMIBA's 60x-to-PCI bridge supports configurable host or peripheral operation, as documented in Section 1.1 "Features" and Section 7.7 "PCI Bridge". It includes programmable host bridge logic, four dedicated DMA channels, and automatic loading of PCI configuration registers from EPROM - enabling direct integration as a master controller in x86-based systems.

What is the thermal resistance (RθJA) for the MPC8248ZQMIBA on a four-layer PCB?

The junction-to-ambient thermal resistance (RθJA) for the MPC8248ZQMIBA on a four-layer board is 19°C/W under natural convection, as specified in Table 7 ("Thermal Characteristics") of the MPC8272EC Rev. 3 datasheet. This value assumes a 2s2p board stackup with thermal vias to ground plane and is critical for heatsink sizing in sustained 1.8 W total power dissipation scenarios.