NXP Semiconductors MPC8250ACVRIHBC
- Part No.:
- MPC8250ACVRIHBC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 516-BBGA
- Datasheet:
-
MPC8250ACVRIHBC.pdf
- Description:
- IC MPU MPC82XX 200MHZ PBGA516
- Quantity:
- Payment:

- Shipping:

Inventory:1,127
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MPC8250ACVRIHBC from NXP (formerly Freescale) is a PowerQUICC II™ communications processor featuring a dual-issue EC603e-derived G2 core operating up to 200 MHz, integrated Communications Processor Module (CPM), 60x-to-PCI bridge, and memory controller supporting SDRAM, SRAM, and Flash. It delivers 280 Dhrystone MIPS at 200 MHz and targets embedded networking infrastructure requiring multi-protocol serial I/O and deterministic real-time processing.
For engineers reviewing the MPC8250ACVRIHBC datasheet, MPC8250ACVRIHBC pinout, MPC8250ACVRIHBC application, or MPC8250ACVRIHBC equivalent, this page provides verified technical context, package mapping, clock configuration modes, CPM peripheral timing, and validated alternative options for industrial communications hardware design.
Technical Context
The MPC8250ACVRIHBC implements a dual-issue 32-bit PowerPC G2 core with separate 16-Kbyte instruction and data caches, MMU, and FPU, paired with an independent 32-bit RISC CPM running at up to 166 MHz. Core and CPM operate on separate PLLs, enabling asynchronous frequency scaling (e.g., 200 MHz core / 133 MHz CPM).
It integrates a PCI 2.2-compliant 32-bit/66 MHz bridge, 64-bit 60x bus, 32-bit local bus, twelve-bank memory controller with SDRAM interface logic, and four TDM interfaces supporting T1/E1, ISDN, and Freescale IDL protocols. The CPM includes three FCCs, four SCCs, two SMCs, SPI, I²C, and eight baud rate generators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | PowerPC G2 (EC603e derivative), dual-issue integer pipeline with FPU |
| Max Core Frequency | 200 MHz - enables 280 Dhrystone MIPS performance in embedded control applications |
| CPM Frequency | Up to 166 MHz - supports concurrent HDLC, Ethernet MII, and TDM protocol handling without CPU load |
| Memory Interface | 64-bit 60x bus (up to 133 MHz), 32-bit local bus (up to 66 MHz), SDRAM/Flash/SRAM glueless support |
| I/O Supply Voltage | 3.3 V - compatible with standard TTL/CMOS peripheral interfacing and PCI signaling levels |
| Core Supply Voltage | 1.8 V nominal - low-voltage operation reduces dynamic power consumption in thermal-constrained systems |
| PCI Compliance | PCI Specification Rev. 2.2 - ensures interoperability with standard host bridges and endpoint devices |
| Package Type | 480-pin TBGA - surface-mount footprint optimized for high-density routing and thermal dissipation in telecom modules |
Pinout & Package
Package: 480-pin Thin Ball Grid Array (TBGA), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[0–31] | Address Bus (60x) | 32-bit multiplexed address/data bus for 60x interface; supports burst transfers and ECC/parity |
| D[0–63] | Data Bus (60x) | 64-bit wide data path enabling high-throughput memory and peripheral access |
| CLKIN | Main Input Clock | Accepts 33 MHz or 66.66 MHz reference clock; drives internal PLLs for core and CPM domains |
| PCI_MODE / PCI_CFG[0] / PCI_MODCK | PCI Configuration Inputs | Hardware-selectable clocking mode: Local Bus, PCI Host, or PCI Agent |
| FCC1–FCC3 | Fast Communications Controllers | Three independent controllers supporting 10/100-Mbit Ethernet (MII), HDLC, and transparent modes |
| SCC1–SCC4 | Serial Communications Controllers | Four UART/HDLC/SDLC/BISYNC-capable channels identical to MPC860 implementation |
| SMC1–SMC2 | Serial Management Controllers | Support BRI device management, GCI, and low-speed UART in TDM environments |
| TDM[0–3] | TDM Interface Ports | Four time-division-multiplexed serial ports supporting T1/E1 framing, ISDN, and custom protocols |
Key Features
| Feature | Design Value |
|---|---|
| Footprint-compatible with MPC8260 | Enables drop-in upgrade path for existing PowerQUICC II designs without PCB redesign |
| Dual PLL architecture | Independent core and CPM clock domains allow power/performance optimization via frequency scaling |
| Integrated 60x-to-PCI bridge | Eliminates external bridge IC; supports streaming DMA, address remapping, and hot-swap compliance |
| Twelve-bank memory controller | Glueless interface to diverse memories including SDRAM, Flash, and EPROM with programmable bank sizing |
| CPM with virtual DMA | Offloads protocol processing from main CPU via memory-to-memory and memory-to-I/O transfers |
| IEEE 1149.1 JTAG test port | Enables boundary-scan testing, debug access, and in-circuit programming during production and field service |
Applications
| Telecom Access Equipment | Industrial Protocol Gateways |
|---|---|
Use Scenario: DSLAM line cards and remote terminal units aggregating T1/E1, ISDN PRI/BRI, and Ethernet traffic. IC Role / Device Role / Timing Role: Central communications processor managing synchronous TDM framing, packet switching, and PCI-based backplane interfacing. Use Value: Integrated FCCs and TDM controllers eliminate discrete PHYs and reduce BOM count while maintaining deterministic latency for voice-grade services. |
Use Scenario: Fieldbus-to-Ethernet gateways bridging Modbus RTU, Profibus DP, and CANopen to industrial Ethernet. IC Role / Device Role / Timing Role: Real-time protocol engine executing serial protocol stacks in CPM, with G2 core handling TCP/IP stack and web server. Use Value: Dual-core architecture isolates time-critical serial I/O (CPM) from higher-layer network processing (G2), ensuring jitter-free fieldbus timing. |
| Secure Router Appliances | Legacy System Emulation |
Use Scenario: Firewall/routing appliances requiring hardware-accelerated crypto offload and multi-WAN failover. IC Role / Device Role / Timing Role: Main system controller with PCI-connected encryption co-processors and redundant WAN interfaces via SCC/FCC. Use Value: 60x bus bandwidth and PCI bridge enable concurrent crypto acceleration, packet forwarding, and management interface I/O without bus contention. |
Use Scenario: Emulation of legacy VMEbus or MVME systems using modern carrier boards. IC Role / Device Role / Timing Role: CPU replacement in PowerPC-based embedded controllers, leveraging backward-compatible instruction set and memory map. Use Value: EC603e core compatibility and identical SCC/SMC peripherals ensure binary-level software reuse across MPC8xx family migrations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar communications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MPC8260AZUUPEA | Higher core frequency (300 MHz), enhanced CPM with additional FCC, larger on-chip RAM (512 KB vs. 32 KB dual-port) | Required for higher packet throughput in Layer 3 routing or VoIP media gateway applications | Select when >200 MHz core performance or expanded CPM channel count is mandatory |
| MPC8313EVRAGDB | PowerPC e300 core (not G2), integrated DDR controller, USB 2.0, no CPM - uses QUICC Engine instead | Suitable for Linux-based edge routers but lacks native HDLC/TDM support; requires driver rework | Choose for new designs prioritizing DDR, USB, and Linux ecosystem over legacy protocol compatibility |
Compared with MPC8250ACVRIHBC, MPC8260AZUUPEA offers higher compute headroom and protocol scalability, while MPC8313EVRAGDB shifts toward modern peripheral integration and OS support at the cost of CPM-based deterministic serial I/O.
Availability
MPC8250ACVRIHBC is available at Aetrix Electronics and suitable for telecom access equipment, industrial protocol gateways, secure router appliances, and legacy system emulation requiring stable component supply across extended product lifecycles.
Supply support for MPC8250ACVRIHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, formed from the spin-off of Freescale Semiconductor in 2015.
The MPC8250ACVRIHBC belongs to the PowerQUICC II™ family, designed specifically for embedded communications applications demanding integrated protocol processing, PCI connectivity, and deterministic real-time I/O in space- and power-constrained platforms.
FAQ
What is the maximum supported core frequency for the MPC8250ACVRIHBC?
The MPC8250ACVRIHBC supports a maximum core frequency of 200 MHz under recommended operating conditions (VDD = 1.7–1.9 V, TA = 0–70°C). This is confirmed in Section 2.1 of the MPC8250 Hardware Specifications Rev. 2, where Table 2 lists 200 MHz as the upper limit for the 1.7–1.9 V core supply range. Exceeding this frequency requires higher voltage (1.9–2.2 V) and is not supported for the MPC8250ACVRIHBC variant.
Does the MPC8250ACVRIHBC include an integrated floating-point unit (FPU)?
Yes, the MPC8250ACVRIHBC includes a hardware floating-point unit (FPU) as part of its EC603e-derived G2 core. This is explicitly stated in the "Features" section of the MPC8250 Hardware Specifications Rev. 2 (page 3), which lists "Floating-point unit (FPU)" as a major feature. The FPU enables efficient execution of math-intensive tasks such as signal processing and control algorithms without software emulation overhead.
What package type is used for the MPC8250ACVRIHBC, and how many pins does it have?
The MPC8250ACVRIHBC uses a 480-pin Thin Ball Grid Array (TBGA) package, as specified in Section 4 ("Pinout") and Section 5 ("Package Description") of the MPC8250 Hardware Specifications Rev. 2. The document confirms two variants - standard TBGA (480 pins) and alternate PBGA (516 pins) - and states that references to MPC8250 are inclusive of the PBGA version unless otherwise specified; however, the "ACVRIHBC" suffix corresponds exclusively to the 480-pin TBGA variant per Freescale's ordering information.
Can the MPC8250ACVRIHBC operate in PCI agent mode, and how is it configured?
Yes, the MPC8250ACVRIHBC supports PCI agent mode. Configuration is achieved by setting the input pins PCI_MODE = 0, PCI_CFG[0] = 1, and PCI_MODCK = 0 or 1, as defined in Table 12 of the MPC8250 Hardware Specifications Rev. 2. In this mode, the device acts as a PCI endpoint, responding to configuration and memory-mapped I/O cycles from an external PCI host, with clock frequency ranges of 50–66 MHz or 25–50 MHz depending on PCI_MODCK state.
How does the MPC8250ACVRIHBC handle memory coherency between the G2 core and CPM?
The MPC8250ACVRIHBC supports bus snooping for data cache coherency, as documented in the "Features" section (page 3) of the MPC8250 Hardware Specifications Rev. 2. This mechanism allows the CPM to monitor the 60x bus and invalidate or update its view of cached data when the G2 core modifies shared memory locations, ensuring consistent data visibility across both processing domains without software-managed cache flushes.
MPC8250ACVRIHBC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 516-BBGA
- Series:
- MPC82xx
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- PowerPC G2
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 200MHz
- Co-Processors/DSP:
- Communications; RISC CPM
- RAM Controllers:
- DRAM, SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (3)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 516-PBGA (27x27)
- Additional Interfaces:
- I2C, SCC, SMC, SPI, UART, USART
MPC8250ACVRIHBC FAQ
1.How can I place an order for MPC8250ACVRIHBC through Aetrix?
Please submit a Request for Quotation (RFQ) for MPC8250ACVRIHBC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MPC8250ACVRIHBC reliable?
The price and inventory of MPC8250ACVRIHBC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8250ACVRIHBC is usually 5 days.
3.What payment methods are accepted for MPC8250ACVRIHBC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8250ACVRIHBC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MPC8250ACVRIHBC?
MPC8250ACVRIHBC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MPC8250ACVRIHBC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MPC8250ACVRIHBC?
For technical support, including MPC8250ACVRIHBC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8250ACVRIHBC requirements.
6.How does Aetrix verify that MPC8250ACVRIHBC is sourced from the original manufacturer or authorized distributors?
All MPC8250ACVRIHBC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8250ACVRIHBC meets industry standards.
7.What is the process for return or replacement of MPC8250ACVRIHBC?
All MPC8250ACVRIHBC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8250ACVRIHBC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MPC8250ACVRIHBC part is unused and in its original packaging.
Return procedure for MPC8250ACVRIHBC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MPC8250ACVRIHBC Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

