Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

NXP Semiconductors MPC8250ACVRIHBC

Part No.:
MPC8250ACVRIHBC
Manufacturer:
NXP Semiconductors
Category:
Microprocessors
Package:
516-BBGA
Datasheet:
AetrixMPC8250ACVRIHBC.pdf
Description:
IC MPU MPC82XX 200MHZ PBGA516
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,127

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

MPC8250ACVRIHBC from NXP (formerly Freescale) is a PowerQUICC II™ communications processor featuring a dual-issue EC603e-derived G2 core operating up to 200 MHz, integrated Communications Processor Module (CPM), 60x-to-PCI bridge, and memory controller supporting SDRAM, SRAM, and Flash. It delivers 280 Dhrystone MIPS at 200 MHz and targets embedded networking infrastructure requiring multi-protocol serial I/O and deterministic real-time processing.

For engineers reviewing the MPC8250ACVRIHBC datasheet, MPC8250ACVRIHBC pinout, MPC8250ACVRIHBC application, or MPC8250ACVRIHBC equivalent, this page provides verified technical context, package mapping, clock configuration modes, CPM peripheral timing, and validated alternative options for industrial communications hardware design.

Technical Context

The MPC8250ACVRIHBC implements a dual-issue 32-bit PowerPC G2 core with separate 16-Kbyte instruction and data caches, MMU, and FPU, paired with an independent 32-bit RISC CPM running at up to 166 MHz. Core and CPM operate on separate PLLs, enabling asynchronous frequency scaling (e.g., 200 MHz core / 133 MHz CPM).

It integrates a PCI 2.2-compliant 32-bit/66 MHz bridge, 64-bit 60x bus, 32-bit local bus, twelve-bank memory controller with SDRAM interface logic, and four TDM interfaces supporting T1/E1, ISDN, and Freescale IDL protocols. The CPM includes three FCCs, four SCCs, two SMCs, SPI, I²C, and eight baud rate generators.

Key Specifications

Parameter Value and Actual Design Meaning
Core ArchitecturePowerPC G2 (EC603e derivative), dual-issue integer pipeline with FPU
Max Core Frequency200 MHz - enables 280 Dhrystone MIPS performance in embedded control applications
CPM FrequencyUp to 166 MHz - supports concurrent HDLC, Ethernet MII, and TDM protocol handling without CPU load
Memory Interface64-bit 60x bus (up to 133 MHz), 32-bit local bus (up to 66 MHz), SDRAM/Flash/SRAM glueless support
I/O Supply Voltage3.3 V - compatible with standard TTL/CMOS peripheral interfacing and PCI signaling levels
Core Supply Voltage1.8 V nominal - low-voltage operation reduces dynamic power consumption in thermal-constrained systems
PCI CompliancePCI Specification Rev. 2.2 - ensures interoperability with standard host bridges and endpoint devices
Package Type480-pin TBGA - surface-mount footprint optimized for high-density routing and thermal dissipation in telecom modules

Pinout & Package

Package: 480-pin Thin Ball Grid Array (TBGA), 27 mm × 27 mm, 1.27 mm pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A[0–31]Address Bus (60x)32-bit multiplexed address/data bus for 60x interface; supports burst transfers and ECC/parity
D[0–63]Data Bus (60x)64-bit wide data path enabling high-throughput memory and peripheral access
CLKINMain Input ClockAccepts 33 MHz or 66.66 MHz reference clock; drives internal PLLs for core and CPM domains
PCI_MODE / PCI_CFG[0] / PCI_MODCKPCI Configuration InputsHardware-selectable clocking mode: Local Bus, PCI Host, or PCI Agent
FCC1–FCC3Fast Communications ControllersThree independent controllers supporting 10/100-Mbit Ethernet (MII), HDLC, and transparent modes
SCC1–SCC4Serial Communications ControllersFour UART/HDLC/SDLC/BISYNC-capable channels identical to MPC860 implementation
SMC1–SMC2Serial Management ControllersSupport BRI device management, GCI, and low-speed UART in TDM environments
TDM[0–3]TDM Interface PortsFour time-division-multiplexed serial ports supporting T1/E1 framing, ISDN, and custom protocols

Key Features

Feature Design Value
Footprint-compatible with MPC8260Enables drop-in upgrade path for existing PowerQUICC II designs without PCB redesign
Dual PLL architectureIndependent core and CPM clock domains allow power/performance optimization via frequency scaling
Integrated 60x-to-PCI bridgeEliminates external bridge IC; supports streaming DMA, address remapping, and hot-swap compliance
Twelve-bank memory controllerGlueless interface to diverse memories including SDRAM, Flash, and EPROM with programmable bank sizing
CPM with virtual DMAOffloads protocol processing from main CPU via memory-to-memory and memory-to-I/O transfers
IEEE 1149.1 JTAG test portEnables boundary-scan testing, debug access, and in-circuit programming during production and field service

Applications

Telecom Access Equipment Industrial Protocol Gateways

Use Scenario: DSLAM line cards and remote terminal units aggregating T1/E1, ISDN PRI/BRI, and Ethernet traffic.

IC Role / Device Role / Timing Role: Central communications processor managing synchronous TDM framing, packet switching, and PCI-based backplane interfacing.

Use Value: Integrated FCCs and TDM controllers eliminate discrete PHYs and reduce BOM count while maintaining deterministic latency for voice-grade services.

Use Scenario: Fieldbus-to-Ethernet gateways bridging Modbus RTU, Profibus DP, and CANopen to industrial Ethernet.

IC Role / Device Role / Timing Role: Real-time protocol engine executing serial protocol stacks in CPM, with G2 core handling TCP/IP stack and web server.

Use Value: Dual-core architecture isolates time-critical serial I/O (CPM) from higher-layer network processing (G2), ensuring jitter-free fieldbus timing.

Secure Router Appliances Legacy System Emulation

Use Scenario: Firewall/routing appliances requiring hardware-accelerated crypto offload and multi-WAN failover.

IC Role / Device Role / Timing Role: Main system controller with PCI-connected encryption co-processors and redundant WAN interfaces via SCC/FCC.

Use Value: 60x bus bandwidth and PCI bridge enable concurrent crypto acceleration, packet forwarding, and management interface I/O without bus contention.

Use Scenario: Emulation of legacy VMEbus or MVME systems using modern carrier boards.

IC Role / Device Role / Timing Role: CPU replacement in PowerPC-based embedded controllers, leveraging backward-compatible instruction set and memory map.

Use Value: EC603e core compatibility and identical SCC/SMC peripherals ensure binary-level software reuse across MPC8xx family migrations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
MPC8260AZUUPEAHigher core frequency (300 MHz), enhanced CPM with additional FCC, larger on-chip RAM (512 KB vs. 32 KB dual-port)Required for higher packet throughput in Layer 3 routing or VoIP media gateway applicationsSelect when >200 MHz core performance or expanded CPM channel count is mandatory
MPC8313EVRAGDBPowerPC e300 core (not G2), integrated DDR controller, USB 2.0, no CPM - uses QUICC Engine insteadSuitable for Linux-based edge routers but lacks native HDLC/TDM support; requires driver reworkChoose for new designs prioritizing DDR, USB, and Linux ecosystem over legacy protocol compatibility

Compared with MPC8250ACVRIHBC, MPC8260AZUUPEA offers higher compute headroom and protocol scalability, while MPC8313EVRAGDB shifts toward modern peripheral integration and OS support at the cost of CPM-based deterministic serial I/O.

Availability

MPC8250ACVRIHBC is available at Aetrix Electronics and suitable for telecom access equipment, industrial protocol gateways, secure router appliances, and legacy system emulation requiring stable component supply across extended product lifecycles.

Supply support for MPC8250ACVRIHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, formed from the spin-off of Freescale Semiconductor in 2015.

The MPC8250ACVRIHBC belongs to the PowerQUICC II™ family, designed specifically for embedded communications applications demanding integrated protocol processing, PCI connectivity, and deterministic real-time I/O in space- and power-constrained platforms.

FAQ

What is the maximum supported core frequency for the MPC8250ACVRIHBC?

The MPC8250ACVRIHBC supports a maximum core frequency of 200 MHz under recommended operating conditions (VDD = 1.7–1.9 V, TA = 0–70°C). This is confirmed in Section 2.1 of the MPC8250 Hardware Specifications Rev. 2, where Table 2 lists 200 MHz as the upper limit for the 1.7–1.9 V core supply range. Exceeding this frequency requires higher voltage (1.9–2.2 V) and is not supported for the MPC8250ACVRIHBC variant.

Does the MPC8250ACVRIHBC include an integrated floating-point unit (FPU)?

Yes, the MPC8250ACVRIHBC includes a hardware floating-point unit (FPU) as part of its EC603e-derived G2 core. This is explicitly stated in the "Features" section of the MPC8250 Hardware Specifications Rev. 2 (page 3), which lists "Floating-point unit (FPU)" as a major feature. The FPU enables efficient execution of math-intensive tasks such as signal processing and control algorithms without software emulation overhead.

What package type is used for the MPC8250ACVRIHBC, and how many pins does it have?

The MPC8250ACVRIHBC uses a 480-pin Thin Ball Grid Array (TBGA) package, as specified in Section 4 ("Pinout") and Section 5 ("Package Description") of the MPC8250 Hardware Specifications Rev. 2. The document confirms two variants - standard TBGA (480 pins) and alternate PBGA (516 pins) - and states that references to MPC8250 are inclusive of the PBGA version unless otherwise specified; however, the "ACVRIHBC" suffix corresponds exclusively to the 480-pin TBGA variant per Freescale's ordering information.

Can the MPC8250ACVRIHBC operate in PCI agent mode, and how is it configured?

Yes, the MPC8250ACVRIHBC supports PCI agent mode. Configuration is achieved by setting the input pins PCI_MODE = 0, PCI_CFG[0] = 1, and PCI_MODCK = 0 or 1, as defined in Table 12 of the MPC8250 Hardware Specifications Rev. 2. In this mode, the device acts as a PCI endpoint, responding to configuration and memory-mapped I/O cycles from an external PCI host, with clock frequency ranges of 50–66 MHz or 25–50 MHz depending on PCI_MODCK state.

How does the MPC8250ACVRIHBC handle memory coherency between the G2 core and CPM?

The MPC8250ACVRIHBC supports bus snooping for data cache coherency, as documented in the "Features" section (page 3) of the MPC8250 Hardware Specifications Rev. 2. This mechanism allows the CPM to monitor the 60x bus and invalidate or update its view of cached data when the G2 core modifies shared memory locations, ensuring consistent data visibility across both processing domains without software-managed cache flushes.

MPC8250ACVRIHBC Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Package/Case:
516-BBGA
Series:
MPC82xx
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
PowerPC G2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
200MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM, SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
10/100Mbps (3)
SATA:
-
USB:
-
Voltage - I/O:
3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
516-PBGA (27x27)
Additional Interfaces:
I2C, SCC, SMC, SPI, UART, USART

MPC8250ACVRIHBC FAQ

1.How can I place an order for MPC8250ACVRIHBC through Aetrix?

Please submit a Request for Quotation (RFQ) for MPC8250ACVRIHBC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MPC8250ACVRIHBC reliable?

The price and inventory of MPC8250ACVRIHBC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MPC8250ACVRIHBC is usually 5 days.

3.What payment methods are accepted for MPC8250ACVRIHBC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MPC8250ACVRIHBC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MPC8250ACVRIHBC?

MPC8250ACVRIHBC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MPC8250ACVRIHBC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MPC8250ACVRIHBC?

For technical support, including MPC8250ACVRIHBC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MPC8250ACVRIHBC requirements.

6.How does Aetrix verify that MPC8250ACVRIHBC is sourced from the original manufacturer or authorized distributors?

All MPC8250ACVRIHBC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MPC8250ACVRIHBC meets industry standards.

7.What is the process for return or replacement of MPC8250ACVRIHBC?

All MPC8250ACVRIHBC units undergo pre-shipment inspection (PSI). If there is an issue with MPC8250ACVRIHBC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MPC8250ACVRIHBC part is unused and in its original packaging.

Return procedure for MPC8250ACVRIHBC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MPC8250ACVRIHBC Tags

  • MPC8250ACVRIHBC
  • MPC8250ACVRIHBC PDF
  • MPC8250ACVRIHBC Datasheet
  • MPC8250ACVRIHBC Specifications
  • MPC8250ACVRIHBC Images
  • NXP Semiconductors
  • NXP Semiconductors MPC8250ACVRIHBC
  • Buy MPC8250ACVRIHBC
  • MPC8250ACVRIHBC Price
  • MPC8250ACVRIHBC Distributor
  • MPC8250ACVRIHBC Supplier
  • MPC8250ACVRIHBC Wholesale
Related Products
AT91SAM9260B-CU-999
AT91SAM9260B-CU-999

Microchip Technology

AT91SAM9G25-CU
AT91SAM9G25-CU

Microchip Technology

ATSAMA5D27C-CU
ATSAMA5D27C-CU

Microchip Technology

AT91SAM9X35-CU
AT91SAM9X35-CU

Microchip Technology

AT91SAM9X25-CU
AT91SAM9X25-CU

Microchip Technology

MCIMX6Y2CVM08AB
MCIMX6Y2CVM08AB

NXP Semiconductors

AM3352BZCZ100
AM3352BZCZ100

Texas Instruments

AT91SAM9260B-CU
AT91SAM9260B-CU

Microchip Technology

AT91SAM9260B-QU
AT91SAM9260B-QU

Microchip Technology

ATSAMA5D31A-CU
ATSAMA5D31A-CU

Microchip Technology

AT91SAM9G20B-CU-999
AT91SAM9G20B-CU-999

Microchip Technology

MCIMX6Y2CVM05AB
MCIMX6Y2CVM05AB

NXP Semiconductors

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER