NXP Semiconductors MPC8250ACVVMHBC

Overview

MPC8250ACVVMHBC from NXP (formerly Freescale) is a PowerQUICC II™ communications processor integrating a dual-issue EC603e-derived G2 core (up to 200 MHz), a dedicated 32-bit RISC communications processor module (CPM), and a 60x-to-PCI bridge. It features separate 16-Kbyte instruction and data caches, on-chip memory controller for SDRAM/Flash/SRAM, and integrated serial interfaces including three FCCs (10/100-Mbit Ethernet), four SCCs, two SMCs, SPI, I²C, and TDM support - deployed in carrier-grade access routers and multi-service edge platforms.

For engineers reviewing the MPC8250ACVVMHBC datasheet, MPC8250ACVVMHBC pinout, MPC8250ACVVMHBC application, or MPC8250ACVVMHBC equivalent, key selection considerations include its 480-pin TBGA package, 1.8 V core / 3.3 V I/O supply separation, dual PLL architecture enabling independent CPM/core clock scaling, PCI 2.2 compliance at 66 MHz, and hardware support for HDLC, UART, transparent, and MII-based Ethernet protocols.

Technical Context

The MPC8250ACVVMHBC implements a split-architecture design: the G2 core handles general-purpose control and packet processing, while the autonomous CPM offloads protocol-intensive serial communications using its own 32-Kbyte dual-port RAM and virtual DMA engine. Its 60x bus operates at up to 200 MHz with 64-bit data width and supports burst transfers, ECC/parity, and multi-master arbitration.

System-level timing is managed by the SIU, which integrates a clock synthesizer, real-time clock, watchdog timer, IEEE 1149.1 JTAG interface, and programmable reset controller. The memory controller provides glueless interfacing to SDRAM, Flash, SRAM, and EPROM across twelve banks, with dedicated SDRAM pipeline logic and byte-select capability for both 64-bit (60x) and 32-bit (local bus) widths.

Key Specifications

Pinout & Package

Package: 480-pin Thin Ball Grid Array (TBGA), 19 mm × 19 mm body, 1.27 mm ball pitch, JEDEC MO-245 compliant. Thermal resistance θJA = 13°C/W (natural convection, single-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8250ACVVMHBC, MPC8260ACZQHBC delivers higher compute density and expanded PCI addressing for complex security gateways, while MPC8313EVRAGDB trades CPM-based serial offload for modern DDR/USB integration - making it suitable only where legacy protocol support is not required.

Availability

MPC8250ACVVMHBC is available at Aetrix Electronics and suitable for DSLAM line cards, enterprise VoIP gateways, industrial protocol gateways, and legacy network bridges requiring stable component supply and long-term lifecycle assurance.

Supply support for MPC8250ACVVMHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with deep heritage in Power Architecture® technology.

The MPC8250ACVVMHBC belongs to the PowerQUICC II family - designed specifically for carrier-class communications infrastructure requiring hardware-accelerated protocol processing, deterministic real-time response, and multi-interface integration in space-constrained platforms.

FAQ

What is the maximum operating frequency of the MPC8250ACVVMHBC core?

The MPC8250ACVVMHBC core supports a maximum operating frequency of 200 MHz under recommended conditions (VDD = 1.7–1.9 V, TA = 0–70°C). At this speed, it achieves approximately 280 Dhrystone MIPS and SPEC95 scores of 4.4–5.1. Higher frequencies require increased core voltage per Table 2 in the MPC8250EC Rev. 2 datasheet, and the MPC8250ACVVMHBC variant is rated for 200 MHz operation.

Does the MPC8250ACVVMHBC support PCI Express?

No, the MPC8250ACVVMHBC does not support PCI Express. It implements a PCI 2.2-compliant parallel bus interface operating at 32 bits and up to 66 MHz. The device supports both PCI host and agent modes but lacks PCIe PHY, link layer, or configuration space extensions. For PCIe connectivity, designers must use external bridge chips or migrate to later-generation QorIQ processors.

How many serial communication controllers does the MPC8250ACVVMHBC integrate?

The MPC8250ACVVMHBC integrates four Serial Communications Controllers (SCC1–SCC4), two Serial Management Controllers (SMC1–SMC2), three Fast Communications Controllers (FCC1–FCC3), one SPI, and one I²C controller. All SCCs are functionally identical to those on the MPC860 and support UART, HDLC, BISYNC, and Ethernet framing - enabling concurrent multi-protocol serial interfacing without external components.

What package type is used for the MPC8250ACVVMHBC?

The MPC8250ACVVMHBC uses a 480-pin Thin Ball Grid Array (TBGA) package measuring 19 mm × 19 mm with 1.27 mm ball pitch. This package is distinct from the 516-pin PBGA option and is specified in Section 4 ("Pinout") and Section 5 ("Package Description") of the MPC8250EC Rev. 2 datasheet. Thermal resistance is θJA = 13°C/W under natural convection on a single-layer board.

Can the MPC8250ACVVMHBC operate with a 2.5 V I/O supply?

No, the MPC8250ACVVMHBC requires a nominal 3.3 V I/O supply (VDDH = 3.135–3.465 V) and is not rated for 2.5 V operation. Table 2 in the MPC8250EC Rev. 2 datasheet specifies absolute maximum VDDH as 4.0 V and minimum as –0.3 V, but recommended operation is strictly 3.3 V ±3.5%. Using 2.5 V violates DC electrical specifications and may cause signal integrity failures on PCI, local bus, and serial interfaces.