NXP Semiconductors MPC8250ACZUMHBC

Overview

MPC8250ACZUMHBC from NXP Semiconductors (formerly Freescale) is a PowerQUICC II™ communications processor integrating a dual-issue EC603e-derived G2 core (200 MHz max), a dedicated 32-bit RISC communications processor module (CPM), and a 60x-to-PCI bridge. It delivers 280 Dhrystone MIPS at 200 MHz, supports 10/100-Mbit Ethernet via three FCCs with MII, and targets embedded networking control planes in telecom access equipment and industrial gateways.

For engineers reviewing the MPC8250ACZUMHBC datasheet, MPC8250ACZUMHBC pinout, MPC8250ACZUMHBC application, or MPC8250ACZUMHBC equivalent, key selection criteria include its 480-pin TBGA package, separate 1.8 V core / 3.3 V I/O supplies, dual PLL architecture enabling independent CPM/core clocking, and integrated support for HDLC, TDM (up to four interfaces), UART, SPI, and I²C protocols.

Technical Context

The MPC8250ACZUMHBC implements a split-architecture design: the G2 core handles general-purpose processing and memory management (MMU, 16-KB I/D caches), while the CPM offloads serial protocol handling-including three Fast Communications Controllers (FCCs) for Ethernet/HDLC, four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), and TDM routing across up to four interfaces. Its 60x bus operates at up to 200 MHz with 64-bit data width and supports burst transfers and ECC/parity.

Power management is implemented via independent PLLs for the G2 core and CPM, allowing frequency scaling (e.g., 200 MHz core + 133 MHz CPM) and dynamic power/performance optimization. The SIU provides system-level functions including JTAG test access, real-time clock, watchdog timer, and clock synthesis, all synchronized to a single CLKIN input.

Key Specifications

Pinout & Package

The MPC8250ACZUMHBC is packaged in a 480-pin TBGA (Thin Ball Grid Array) with 1.27 mm pitch, designed for high-density PCB layouts and thermal performance in telecom infrastructure applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8260AZUU and MPC8313EVRAGDB, the MPC8250ACZUMHBC offers optimal cost-performance balance for legacy telecom control plane and industrial protocol gateway applications where 200 MHz processing, integrated TDM, and proven field reliability are prioritized over raw throughput or hardware security.

Availability

MPC8250ACZUMHBC is available at Aetrix Electronics and suitable for DSLAM line card control, industrial protocol gateway, wireless base station controller, and secure remote terminal unit (RTU) applications requiring stable component supply across extended product lifecycles.

Supply support for MPC8250ACZUMHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial & IoT, mobile, and communication infrastructure solutions.

The MPC8250ACZUMHBC belongs to the PowerQUICC II family of integrated communications processors, designed specifically for cost-sensitive, high-reliability embedded networking applications requiring flexible serial protocol support and deterministic real-time control.

FAQ

What is the maximum operating frequency of the MPC8250ACZUMHBC core?

The MPC8250ACZUMHBC core is rated for a maximum operating frequency of 200 MHz under recommended conditions (VDD = 1.7–1.9 V, TA = 0–70°C). This frequency is achieved using a 33 MHz input clock with a 6× internal multiplier. At 200 MHz, the device delivers 280 Dhrystone MIPS and supports SPEC95 benchmarks of 4.4–5.1. Exceeding this frequency requires higher core voltage and is not guaranteed per specification.

Does the MPC8250ACZUMHBC support PCI Express or only PCI 2.2?

The MPC8250ACZUMHBC supports only PCI Specification Revision 2.2 (32-bit, 33/66 MHz, 3.3 V), not PCI Express. Its integrated 60x-to-PCI bridge provides host or agent functionality, DMA streaming, and hot-swap compliance per PICMG 2.1, but lacks PCIe lanes, transaction layers, or link training logic. For PCIe interfaces, newer PowerQUICC III or QorIQ families must be considered.

How many independent TDM interfaces does the MPC8250ACZUMHBC support?

The MPC8250ACZUMHBC supports up to four independent TDM interfaces through its CPM, with dedicated routing, frame synchronization, and bit/byte resolution. These interfaces handle standards including T1/E1, ISDN basic/primary rate, CEPT, T3/E3, and Freescale's interchip digital link (IDL), enabling simultaneous voice channel aggregation and backplane interconnect in telecom access equipment.

What are the power supply requirements for the MPC8250ACZUMHBC?

The MPC8250ACZUMHBC requires three distinct supply domains: 1.8 V ±5% for core logic (VDD) and PLL (VCCSYN), and 3.3 V ±3.5% for I/O (VDDH). All three supplies must track directionally (±0.1 Vdc and ±5% relative variation). Input voltage on any pin must not exceed VDDH by more than 2.5 V during normal operation, and VIN must remain between GND –0.3 V and 3.465 V.

Is the MPC8250ACZUMHBC pin-compatible with the MPC8260 series?

Yes, the MPC8250ACZUMHBC is footprint-compatible with the MPC8260 series, sharing the same 480-pin TBGA package and signal mapping for core buses, memory interfaces, and peripheral controllers. However, functional differences exist - such as CPM capabilities, on-chip RAM size, and peripheral count - so firmware and layout validation is required before substitution. The MPC8250ACZUMHBC documentation explicitly states this compatibility as a key feature.