NXP Semiconductors MPC8250AVRIHBC

Overview

MPC8250AVRIHBC from Freescale Semiconductor is a PowerQUICC II™ communications processor featuring a dual-issue EC603e-derived G2 core operating at up to 200 MHz, integrated Communications Processor Module (CPM), 60x bus (64-bit/66 MHz), PCI bridge (32-bit/66 MHz), and memory controller supporting SDRAM, SRAM, Flash, and EPROM. It targets embedded networking and telecom infrastructure requiring concurrent protocol handling and deterministic real-time I/O.

For engineers reviewing the MPC8250AVRIHBC datasheet, MPC8250AVRIHBC pinout, MPC8250AVRIHBC application, or MPC8250AVRIHBC equivalent, this page delivers verified electrical specs, clock configuration modes, CPM peripheral timing, thermal resistance data (θJA = 13°C/W for 480 TBGA), and validated alternative parts for migration or sourcing continuity.

Technical Context

The MPC8250AVRIHBC implements a split-PLL architecture: one PLL drives the G2 core (1.5×–6× multiplier) and another independently clocks the CPM (2×–6×), enabling asynchronous operation for power/performance tuning. Core and CPM frequencies are set via MODCK[1–3] pins and MODCK_H bits during power-on reset.

It integrates a 32-bit RISC CPM with 32 KB dual-port RAM, three Fast Communications Controllers (FCCs), four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), SPI, I²C, and TDM support for up to four interfaces - all synchronized to configurable baud rate generators and external clocks.

Key Specifications

Pinout & Package

The MPC8250AVRIHBC is packaged in a 480-pin TBGA (Thin Ball Grid Array) with 1.0 mm ball pitch, designed for high-density routing and thermal performance in telecom line cards and industrial gateways.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8250AVRIHBC, MPC8260AZUUHBC offers higher performance within the same package footprint, while MPC8313EVRAGDB represents a generational shift toward QUICC Engine architecture - requiring firmware rewrite but delivering improved I/O flexibility and DDR2 support.

Availability

MPC8250AVRIHBC is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, VoIP media gateways, and wireless base station controllers requiring stable component supply across extended product lifecycles.

Supply support for MPC8250AVRIHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors for networking, automotive, and industrial applications, known for Power Architecture-based solutions.

The MPC8250AVRIHBC belongs to the PowerQUICC II family, engineered specifically for cost-sensitive, high-reliability communications infrastructure where integrated protocol acceleration and deterministic real-time I/O are critical.

FAQ

What is the maximum supported core frequency for MPC8250AVRIHBC?

The MPC8250AVRIHBC supports a maximum G2 core frequency of 200 MHz, as confirmed by Table 13 and Table 14 in the MPC8250 Hardware Specifications Rev. 2 document. This rating applies under recommended operating conditions: VDD = 1.7–1.9 V and ambient temperature ≤70°C. Exceeding 200 MHz requires voltage and thermal validation beyond datasheet limits and is not guaranteed. The MPC8250AVRIHBC achieves 280 Dhrystone MIPS at this frequency.

Does MPC8250AVRIHBC support PCI hot-swap functionality?

Yes, the MPC8250AVRIHBC supports hot-swap per PICMG 2.1 R1.0 (August 1998), as explicitly stated in Section 5 of the hardware specifications. Its PCI bridge includes dedicated circuitry for power sequencing, presence detection, and error reporting required for safe insertion/removal in live backplanes. This capability is inherent to the MPC8250AVRIHBC silicon and does not require external components.

What package type is used for MPC8250AVRIHBC?

The MPC8250AVRIHBC uses a 480-pin Thin Ball Grid Array (TBGA) package with 1.0 mm ball pitch, as specified in Section 4 ("Pinout") and Section 5 ("Package Description") of the MPC8250 Hardware Specifications Rev. 2. This package variant is distinct from the 516-pin PBGA option and has a thermal resistance θJA of 13°C/W under natural convection on a four-layer board.

Can MPC8250AVRIHBC operate with different core and CPM clock frequencies?

Yes, the MPC8250AVRIHBC features two independent PLLs - one for the G2 core and one for the CPM - allowing asynchronous clocking. Valid combinations include 200 MHz core with 133 MHz CPM (MODCK_H = 0010_100, MODCK[1–3] = 010), as shown in Table 14. This separation enables power/performance optimization, such as lowering CPM frequency during low-traffic periods while maintaining full core speed.

Which serial interfaces are supported by the CPM in MPC8250AVRIHBC?

The CPM in MPC8250AVRIHBC supports Fast Communications Controllers (FCCs) for 10/100-Mbps Ethernet (MII), HDLC, and transparent modes; four Serial Communications Controllers (SCCs) compatible with Ethernet, HDLC/SDLC, UART, and BISYNC; two Serial Management Controllers (SMCs) for BRI/GCI; SPI; I²C; and up to four TDM interfaces with 2 KB SI RAM. All are documented in Section 1 "Features" of the MPC8250 Hardware Specifications Rev. 2.