NXP Semiconductors MPC8250AVVPIBC

Overview

MPC8250AVVPIBC from NXP (formerly Freescale) is a PowerQUICC II™ communications processor integrating a 200 MHz EC603e-derived dual-issue G2 core, a dedicated 32-bit RISC communications processor module (CPM), and integrated 60x-to-PCI bridge. It delivers 280 Dhrystone MIPS at 200 MHz, supports 10/100-Mbit Ethernet via three FCCs with MII, and targets embedded networking control in telecom access equipment, industrial gateways, and protocol-conversion platforms.

For engineers reviewing the MPC8250AVVPIBC datasheet, MPC8250AVVPIBC pinout, MPC8250AVVPIBC application, or MPC8250AVVPIBC equivalent, this page provides verified technical context on its dual-clock-domain architecture (separate G2 core and CPM PLLs), 480-pin TBGA package, 64-bit 60x bus, local bus timing, PCI 2.2 compliance, and CPM peripheral integration including four SCCs, two SMCs, SPI, I²C, and TDM support.

Technical Context

The MPC8250AVVPIBC implements a heterogeneous dual-processor architecture: a high-performance PowerPC G2 integer core (150–200 MHz) with 16 KB instruction and 16 KB data caches, and an autonomous 32-bit RISC CPM running at up to 133 MHz with 32 KB dual-port RAM. Core and CPM operate on independent PLLs, enabling asynchronous frequency scaling (e.g., 200 MHz core / 133 MHz CPM) for optimized power/performance trade-offs in real-time communication tasks.

Its system interface unit (SIU) integrates clock synthesis, JTAG test access, RTC, watchdog, and memory controller supporting SRAM, SDRAM, Flash, and EPROM. The 60x-to-PCI bridge complies with PCI Specification Rev. 2.2, operates at 33/66 MHz, and provides four DMA channels for bidirectional streaming between PCI and 60x address spaces - critical for host-offload and packet forwarding applications.

Key Specifications

Pinout & Package

Package: 480-pin Thin Ball Grid Array (TBGA), 19 mm × 19 mm, 1.27 mm ball pitch, RoHS-compliant. Thermal resistance θJA = 13°C/W (natural convection, single-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8250AVVPIBC, MPC8260AZUUPEA offers higher compute headroom and pin-compatible scalability, while MPC8313EVRAGDB shifts focus to security and DDR integration at the cost of CPM-based serial protocol flexibility - making MPC8250AVVPIBC uniquely suited for legacy telecom infrastructure requiring TDM, HDLC, and multi-FCC Ethernet convergence.

Availability

MPC8250AVVPIBC is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, VoIP media gateway control cards, and cellular base station controllers requiring stable component supply across extended product lifecycles.

Supply support for MPC8250AVVPIBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors (formerly Freescale Semiconductor) is a global leader in secure connectivity solutions for automotive, industrial, and networking applications, with deep expertise in Power Architecture® processors and communications silicon.

The MPC8250AVVPIBC belongs to the PowerQUICC II family, designed specifically for cost-sensitive, high-reliability embedded communications systems requiring integrated protocol processing, PCI host/offload capability, and long-term industrial temperature support.

FAQ

What is the maximum operating frequency of the MPC8250AVVPIBC core?

The MPC8250AVVPIBC core operates at up to 200 MHz under recommended conditions (1.7–1.9 V core supply, ambient temperature ≤70°C). This frequency is achieved using a 33 MHz input clock with a 6:1 internal multiplier or a 66.66 MHz input with a 3:1 ratio. Performance is validated at 280 Dhrystone MIPS and SPEC95 scores of 4.4–5.1, confirming deterministic real-time execution capability for telecom control applications.

Does the MPC8250AVVPIBC support PCI hot-swap functionality?

Yes, the MPC8250AVVPIBC supports hot-swap per PICMG 2.1 R1.0 (August 1998) through its PCI bridge logic. Its design includes power sequencing awareness, configuration space registers for slot status reporting, and robust signal integrity for insertion/removal under power. This enables use in carrier-class chassis where field-replaceable line cards must be serviced without system downtime - a key requirement validated in Freescale's hardware specifications document MPC8250EC Rev. 2.

How does the CPM in the MPC8250AVVPIBC differ from the main G2 core?

The CPM in the MPC8250AVVPIBC is a fully autonomous 32-bit RISC microcontroller with 32 KB dual-port RAM, separate instruction ROM, and dedicated serial peripherals (FCCs, SCCs, SMCs). Unlike the G2 core - which executes general-purpose code - the CPM handles time-critical serial protocol processing (e.g., HDLC framing, UART, TDM slot assignment) without CPU cycles or OS scheduling. This hardware offload is confirmed in Section 1 of the MPC8250 Hardware Specifications, enabling deterministic latency for telecom applications.

What package type is used for the MPC8250AVVPIBC?

The MPC8250AVVPIBC uses a 480-pin Thin Ball Grid Array (TBGA) package measuring 19 mm × 19 mm with 1.27 mm ball pitch. This matches the standard PowerQUICC II footprint defined in Section 4 ("Pinout") and Section 5 ("Package Description") of the MPC8250EC Rev. 2 specification. It is distinct from the alternate 516-pin PBGA variant, and all electrical and thermal characteristics in the datasheet apply specifically to this TBGA configuration unless otherwise noted.

Can the MPC8250AVVPIBC operate with different core and CPM clock frequencies?

Yes, the MPC8250AVVPIBC features separate PLLs for the G2 core and CPM, allowing independent frequency selection. For example, it can run the core at 200 MHz (6×33 MHz) while the CPM operates at 133 MHz (4×33 MHz), or both at 166 MHz using different multipliers. This dual-clock-domain architecture is explicitly documented in the "Features" section of MPC8250EC Rev. 2 and enables dynamic power/performance optimization - such as lowering CPM frequency during low-traffic periods while maintaining full core speed for control tasks.