NXP Semiconductors MPC8250AZQIHBC

Overview

MPC8250AZQIHBC from Freescale Semiconductor is a PowerQUICC II™ communications processor featuring a dual-issue EC603e-derived G2 core operating at up to 200 MHz, integrated Communications Processor Module (CPM), 60x-to-PCI bridge, and memory controller supporting SDRAM, SRAM, and Flash. It delivers 280 Dhrystone MIPS at 200 MHz and targets embedded networking, telecom access equipment, and industrial gateways requiring deterministic real-time protocol handling.

For engineers reviewing the MPC8250AZQIHBC datasheet, MPC8250AZQIHBC pinout, MPC8250AZQIHBC application, or MPC8250AZQIHBC equivalent, this page provides verified technical context on its dual-clock-domain architecture (G2 core + CPM), 480-pin TBGA package, IEEE 802.3-compliant MII Ethernet support, HDLC/TDM protocol acceleration, and PCI 2.2 host/agent mode operation - all critical for board-level integration and power-aware system design.

Technical Context

The MPC8250AZQIHBC implements a split-PLL architecture: one PLL drives the G2 core (1.5×–6× multiplier) and another independently clocks the CPM (2×–6×), enabling asynchronous frequency scaling for power/performance optimization. Its 64-bit 60x bus supports burst transfers and ECC/parity, while the 32-bit local bus interfaces gluelessly to SDRAM and peripherals via a programmable 12-bank memory controller.

Protocol offload is handled by the embedded 32-bit RISC CPM with 32 KB dual-port RAM, four SCCs (HDLC/UART/Ethernet), three FCCs (10/100-Mbit MII), one MCC2 (128-channel TDM), two SMCs, SPI, I²C, and four TDM interfaces supporting T1/E1, ISDN, and Freescale IDL. All serial channels use dedicated baud rate generators and clock inputs.

Key Specifications

Pinout & Package

Package: 480-pin Thin Ball Grid Array (TBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Thermal resistance θJA = 13°C/W (natural convection, single-layer board).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8250AZQIHBC, MPC8260AZUHBC offers higher compute headroom and enhanced PCI scalability, while MPC8360EVRAGDB replaces the CPM with a more flexible QUICC Engine but requires migration from CPM-specific firmware stacks - making MPC8250AZQIHBC optimal for maintaining legacy telecom protocol implementations with minimal redesign.

Availability

MPC8250AZQIHBC is available at Aetrix Electronics and suitable for telecom access gateways, industrial protocol converters, VoIP media gateways, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC8250AZQIHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and connectivity solutions for automotive, industrial, and networking markets.

The MPC8250AZQIHBC belongs to the PowerQUICC II family, designed specifically for cost-sensitive, high-reliability communications infrastructure requiring hardware-accelerated protocol handling and deterministic real-time response.

FAQ

What is the maximum supported core frequency for the MPC8250AZQIHBC?

The MPC8250AZQIHBC supports a maximum core frequency of 200 MHz under recommended operating conditions (VDD = 1.7–1.9 V, ambient temperature ≤70°C). This is confirmed in Table 2 of the MPC8250 Hardware Specifications Rev. 2 document, where 200 MHz is explicitly listed as the upper limit for the 1.7–1.9 V core supply range. Higher frequencies require voltage scaling beyond 1.9 V and are not validated for MPC8250AZQIHBC.

Does the MPC8250AZQIHBC support PCI Express or only legacy PCI?

The MPC8250AZQIHBC supports only PCI Specification Revision 2.2 (32-bit, 33/66 MHz, 3.3 V), not PCI Express. Its PCI bridge lacks PCIe PHY, transaction layer, or configuration space extensions. The hardware specifications document explicitly states compliance with PCI Rev. 2.2 and includes features like PCI-to-60x streaming DMA and message registers - all consistent with parallel PCI, not serial PCIe. MPC8250AZQIHBC cannot be used in PCIe slots or systems requiring PCIe enumeration.

How many independent Ethernet MACs does the MPC8250AZQIHBC integrate?

The MPC8250AZQIHBC integrates three independent Fast Communications Controllers (FCC1–FCC3), each capable of full-duplex 10/100-Mbit Ethernet operation via MII. These are physically separate MACs with dedicated registers, DMA channels, and buffer descriptors - confirmed in Section 1 "Features" and Figure 1 block diagram. No fourth FCC is present; SCCs support Ethernet only in legacy 10-Mbit transparent or HDLC modes, not MII.

Is the MPC8250AZQIHBC pin-compatible with the MPC8260 series?

Yes, the MPC8250AZQIHBC is footprint-compatible with the MPC8260 in the 480-pin TBGA package, as stated in the "Features" section: "Footprint-compatible with the MPC8260". However, pin functions differ for certain signals (e.g., additional PCI arbitration pins on MPC8260), and electrical characteristics (e.g., core voltage tolerance) are not identical. PCB layout reuse is possible, but signal integrity validation and firmware adaptation are required before substitution.

What type of memory interface does the MPC8250AZQIHBC provide for SDRAM?

The MPC8250AZQIHBC provides a dedicated, glueless SDRAM interface via its 12-bank memory controller, supporting page-mode SDRAM with programmable timing parameters (CAS latency, RAS-to-CAS delay, refresh rate). The controller includes built-in logic for SDRAM command generation and refresh scheduling - detailed in Section 1 "Features" and Section 3 "Memory Controller". It does not require external SDRAM controller logic or address multiplexing circuitry.