NXP Semiconductors MPC8250AZUMHBC

Overview

MPC8250AZUMHBC from Freescale Semiconductor is a PowerQUICC II™ communications processor integrating a dual-issue EC603e-derived G2 core (up to 200 MHz), a dedicated 32-bit RISC communications processor module (CPM), 60x bus (64-bit, up to 66 MHz), PCI bridge (32-bit, 66 MHz), and memory controller supporting SDRAM, SRAM, Flash, and EPROM. It delivers 280 Dhrystone MIPS at 200 MHz and targets embedded networking and telecom infrastructure.

For engineers reviewing the MPC8250AZUMHBC datasheet, MPC8250AZUMHBC pinout, MPC8250AZUMHBC application, or MPC8250AZUMHBC equivalent, this page provides verified technical context, package mapping, clock configuration modes, CPM peripheral support (FCC/SCC/SMC/TDM), thermal resistance data (θJA = 13°C/W for 480 TBGA), and validated alternative options for communications processor migration paths.

Technical Context

The MPC8250AZUMHBC implements a split-PLL architecture with independent clock multipliers for the G2 core (1.5:1 to 6:1) and CPM (2:1 to 6:1), enabling asynchronous operation at optimized frequencies-e.g., 200 MHz core / 133 MHz CPM. Its 60x bus supports burst transfers (single/four-beat), 64-/32-/16-/8-bit port sizes, and ECC/parity protection.

The CPM integrates three Fast Communications Controllers (FCCs) supporting 10/100-Mbit Ethernet via MII, HDLC up to T3, and transparent mode; four Serial Communications Controllers (SCCs) compatible with MPC860; two Serial Management Controllers (SMCs); SPI and I²C interfaces; and four TDM ports supporting ISDN, T1/E1, and Freescale IDL protocols-all backed by 32 KB dual-port RAM and virtual DMA engines.

Key Specifications

Pinout & Package

The MPC8250AZUMHBC is packaged in a 480-pin TBGA (Thin Ball Grid Array) with 27 × 27 mm body size and 1.0 mm ball pitch, as specified in Section 5 of MPC8250EC Rev. 2. This package is footprint-compatible with the MPC8260 and supports standard reflow profiles for lead-free assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8250AZUMHBC, MPC8260AZUHHB extends raw compute and serial density while maintaining CPM compatibility, whereas MPC8313EVRAGDB replaces the CPM with a QUICC Engine and adds cryptographic acceleration-making it suitable for next-gen secure edge routing but requiring full software and layout rework.

Availability

MPC8250AZUMHBC is available at Aetrix Electronics and suitable for DSLAM line cards, enterprise router control planes, TDM voice gateways, and industrial protocol converters requiring stable component supply across extended product lifecycles.

Supply support for MPC8250AZUMHBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Freescale Semiconductor (now part of NXP Semiconductors) was a leading designer of embedded processors for automotive, networking, and industrial markets, known for PowerQUICC, i.MX, and Kinetis families.

The MPC8250AZUMHBC belongs to the PowerQUICC II family, engineered specifically for cost-sensitive, high-reliability communications infrastructure where integrated CPM offload, PCI connectivity, and TDM support are essential.

FAQ

What is the maximum operating frequency of the MPC8250AZUMHBC core?

The MPC8250AZUMHBC supports a maximum G2 core frequency of 200 MHz under recommended operating conditions (VDD = 1.7–1.9 V, TA = 0–70°C). At this speed, it achieves 280 Dhrystone MIPS and 4.4–5.1 SPEC95 benchmark scores. Higher frequencies (e.g., 233 MHz) require elevated VDD (1.7–2.1 V) and are only validated for extended temperature variants-not the standard MPC8250AZUMHBC.

Does the MPC8250AZUMHBC support DDR SDRAM?

No, the MPC8250AZUMHBC does not support DDR SDRAM. Its memory controller is designed for page-mode SDRAM, standard SDRAM, SRAM, EPROM, and Flash. DDR support was introduced in later PowerQUICC generations like the MPC83xx series. For MPC8250AZUMHBC, SDRAM must be configured in standard (non-DDR) mode with appropriate timing parameters per Table 14 in MPC8250EC Rev. 2.

How many serial interfaces does the MPC8250AZUMHBC include?

The MPC8250AZUMHBC integrates 13 serial interfaces: three Fast Communications Controllers (FCC1–FCC3), four Serial Communications Controllers (SCC1–SCC4), two Serial Management Controllers (SMC1–SMC2), one Serial Peripheral Interface (SPI), and one Inter-Integrated Circuit (I²C) controller. All are managed by the CPM and share 32 KB of dual-port RAM for descriptor and buffer storage.

What package type is used for the MPC8250AZUMHBC?

The MPC8250AZUMHBC uses a 480-pin Thin Ball Grid Array (TBGA) package with 27 × 27 mm body size and 1.0 mm ball pitch. This is the standard package variant referenced throughout MPC8250EC Rev. 2 and is footprint-compatible with the MPC8260. An alternate 516-pin PBGA variant exists but is not used for the MPC8250AZUMHBC suffix.

Is the MPC8250AZUMHBC pin-compatible with the MPC8260?

Yes, the MPC8250AZUMHBC is footprint-compatible with the MPC8260 in the same 480-pin TBGA package. Key signals-including 60x bus, local bus, PCI, CPM I/O, and power/ground-align per Freescale's documentation. However, functional differences exist (e.g., MPC8260 has four FCCs vs. three), so software and minor schematic adjustments may be needed despite mechanical compatibility.