NXP Semiconductors MPC8250AZUPIBC

Overview

MPC8250AZUPIBC from NXP (formerly Freescale) is a PowerQUICC II™ communications processor featuring a dual-issue EC603e-derived G2 core operating at up to 200 MHz, integrated Communications Processor Module (CPM), 60x-to-PCI bridge, and memory controller supporting SDRAM, SRAM, and Flash. It delivers 280 Dhrystone MIPS at 200 MHz and targets embedded networking and telecom infrastructure.

For engineers reviewing the MPC8250AZUPIBC datasheet, MPC8250AZUPIBC pinout, MPC8250AZUPIBC application, or MPC8250AZUPIBC equivalent, key selection criteria include its 480-pin TBGA package, 1.8 V core / 3.3 V I/O supply separation, dual PLL architecture enabling independent CPM/core clocking, and support for IEEE 802.3 10/100-Mbit Ethernet via three FCCs with MII interfaces.

Technical Context

The MPC8250AZUPIBC integrates a PowerPC G2 integer core with separate 16-Kbyte four-way set associative instruction and data caches, an MMU compliant with PowerPC architecture, and a floating-point unit. Its CPM employs a dedicated 32-bit RISC microcontroller with 32-Kbyte dual-port RAM, virtual DMA, and protocol engines for HDLC, UART, SPI, I²C, and TDM.

It features a 64-bit 60x bus running up to 200 MHz, a 32-bit local bus up to 66 MHz, and a PCI 2.2-compliant 32-bit 66 MHz bridge with four DMA channels. Clock generation uses two independent PLLs-one for the G2 core (1.5:1 to 6:1 multipliers) and one for the CPM (2:1 to 6:1 multipliers)-enabling power/performance optimization through asynchronous domain operation.

Key Specifications

Pinout & Package

The MPC8250AZUPIBC is housed in a 480-pin Thin Ball Grid Array (TBGA) package measuring 27 mm × 27 mm with 1.27 mm ball pitch. This package supports thermal dissipation requirements up to 3 W at 70°C ambient when used on a four-layer PCB with dedicated VDD/VDDH/GND planes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8260AZUPJBC, the MPC8250AZUPIBC offers lower power and cost for mid-tier telecom edge applications; versus MPC8360EVRAGDB, it retains full CPM compatibility for legacy HDLC/TDM firmware but lacks DDR2 and USB.

Availability

MPC8250AZUPIBC is available at Aetrix Electronics and suitable for telecom access gateways, industrial protocol gateways, secure router appliances, and legacy system emulators requiring stable component supply across extended product lifecycles.

Supply support for MPC8250AZUPIBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep heritage in Power Architecture® processors.

The MPC8250AZUPIBC belongs to the PowerQUICC II family, designed specifically for cost-sensitive, power-efficient embedded communications infrastructure requiring integrated protocol acceleration and PCI expansion capability.

FAQ

What is the maximum operating frequency of the MPC8250AZUPIBC core?

The MPC8250AZUPIBC core is rated for a maximum operating frequency of 200 MHz under recommended conditions (VDD = 1.7–1.9 V, TA = 0–70°C). At this speed, it achieves 280 Dhrystone MIPS performance and supports SPEC95 benchmarks of 4.4–5.1. The actual achievable frequency depends on thermal design and voltage stability-exceeding 200 MHz requires validation per Table 5's power dissipation estimates and junction temperature limits.

Does the MPC8250AZUPIBC support PCI Express or only legacy PCI?

The MPC8250AZUPIBC supports only PCI Specification Revision 2.2 (32-bit, 33/66 MHz, 3.3 V), not PCI Express. Its integrated 60x-to-PCI bridge provides host or agent functionality, four DMA channels, and Hot-Swap compliance per PICMG 2.1, but lacks PCIe PHY, link training, or serial differential signaling. For PCIe-based designs, newer NXP QorIQ or Layerscape processors are required.

How does the CPM in the MPC8250AZUPIBC differ from the CPM in the MPC860?

The MPC8250AZUPIBC CPM is functionally identical to the MPC860 CPM in terms of SCC/SMC/SPI/I²C peripherals and protocol support (HDLC, UART, transparent, etc.), but adds a multichannel controller (MCC2) capable of handling 128 full-duplex 64-Kbps TDM channels and enhanced TDM interface support (up to four TDM ports with SI RAM). It also integrates more tightly with the G2 core via a 32-Kbyte dual-port RAM and improved virtual DMA capabilities.

What are the thermal management requirements for sustained operation of the MPC8250AZUPIBC?

Sustained operation of the MPC8250AZUPIBC requires adherence to its 105°C maximum junction temperature. With θJA = 13°C/W on a single-layer board or 8°C/W on a four-layer board, thermal design must limit power dissipation-e.g., at 200 MHz core/133 MHz CPM, PINT ≈ 2.0 W nominal. A four-layer PCB with dedicated VDD/VDDH/GND planes, ≥4 × 0.1 µF bypass capacitors, and optional heat sink is recommended for ambient temperatures above 50°C or power levels exceeding 3 W.

Can the MPC8250AZUPIBC operate with a 50 MHz input clock?

No-the MPC8250AZUPIBC is designed for 33 MHz or 66.66 MHz input clocks only, as defined in Tables 13 and 14 of the hardware specifications. Its PLL architecture accepts only these two frequencies to generate valid core and CPM clock ratios (e.g., 3×/4× multipliers). A 50 MHz input violates the clock configuration matrix and will result in undefined behavior or failure to initialize; external clock synthesis to 33/66.66 MHz is required.