NXP Semiconductors MPC8255ACVVMHBB

Overview

MPC8255ACVVMHBB from NXP (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core running at 266 MHz, integrated Communications Processor Module (CPM), 32-Kbyte dual-port RAM, and support for four TDM interfaces, two MII ports, and FCC1/FCC2 Ethernet controllers - deployed in carrier-grade DSLAMs, enterprise routers, and industrial gateways requiring deterministic real-time protocol offload.

For engineers reviewing the MPC8255ACVVMHBB datasheet, MPC8255ACVVMHBB pinout, MPC8255ACVVMHBB application, or MPC8255ACVVMHBB equivalent, this page delivers verified electrical specs (1.9–2.2 V core, 3.135–3.465 V I/O), thermal resistance (θJA = 83 °C/W, 4-layer board), CPM timing (FCC output delay ≤14 ns @ 66 MHz), and precise feature mapping to the MPC8255 variant within the MPC826xA family.

Technical Context

The MPC8255ACVVMHBB implements a split-clock architecture with independent PLLs for its G2 core (266 MHz) and CPM subsystem, enabling asynchronous operation optimized for power/performance trade-offs in telecom edge applications. It integrates a 32-bit RISC microcontroller-based CPM with dedicated firmware for HDLC, UART, and ATM SAR processing.

Its memory subsystem includes a 12-bank controller supporting SDRAM, SRAM, Flash, and EPROM with byte-select capability on both 64-bit 60x and 32-bit local buses; the CPM accesses shared resources via 32-Kbyte dual-port RAM and four virtual IDMA channels - critical for low-latency packet forwarding in multi-protocol environments.

Key Specifications

Pinout & Package

Package: 480-ball thin quad flat no-lead (TBGA), 35 mm × 35 mm body, 1.27 mm ball pitch, JEDEC MO-207AC compliant. Thermal pad on underside requires solder paste stencil design per IPC-7351B.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8255ACVVMHBB, MPC8260ACZQHBB adds PCI and TDM capacity at higher power cost, while MPC8272CZQHBB extends environmental robustness and IMA functionality - neither is pin-compatible, but all three share identical CPM register maps and GCC toolchain support.

Availability

MPC8255ACVVMHBB is available at Aetrix Electronics and suitable for carrier-grade DSLAMs, industrial protocol gateways, and secure remote access appliances requiring stable component supply across long-lifecycle deployments.

Supply support for MPC8255ACVVMHBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and networking markets, with heritage from Freescale's PowerQUICC portfolio.

The MPC8255ACVVMHBB belongs to the PowerQUICC™ II family - designed specifically for cost-sensitive, high-reliability communications infrastructure requiring integrated protocol acceleration without external co-processors.

FAQ

What is the maximum junction temperature specification for MPC8255ACVVMHBB?

The maximum junction temperature (Tj) for MPC8255ACVVMHBB is 105 °C under recommended operating conditions. This limit assumes proper thermal design - including use of a 4-layer PCB with dedicated VDD/GND planes and θJA = 83 °C/W. Exceeding this temperature risks permanent degradation of the CPM's TDM timing accuracy and FCC Ethernet link stability. MPC8255ACVVMHBB must be derated linearly above 70 °C ambient per Freescale's thermal model TJ = TA + (PD × θJA).

Does MPC8255ACVVMHBB support PCI interface functionality?

No, MPC8255ACVVMHBB does not include a PCI bridge. The PCI interface is exclusive to MPC8265 and MPC8266 variants within the MPC826xA family. MPC8255ACVVMHBB provides only 60x and local buses - with 64-bit 60x bus supporting up to 200 MHz operation and 32-bit local bus up to 83 MHz. Any PCI connectivity must be implemented externally via a companion bridge IC or FPGA logic interfaced through the local bus.

How many Fast Communications Controllers (FCCs) are implemented in MPC8255ACVVMHBB?

MPC8255ACVVMHBB implements two Fast Communications Controllers: FCC1 and FCC2. FCC3 is not present - it is reserved for MPC8260, MPC8264, MPC8265, and MPC8266 devices. Each FCC supports MII, UTOPIA Level 1, and transparent modes; FCC1 and FCC2 are fully functional for dual 10/100-Mbit Ethernet PHY interfacing or ATM SAR offload in MPC8255ACVVMHBB designs.

What is the purpose of the dual-port RAM in MPC8255ACVVMHBB?

The 32-Kbyte dual-port RAM in MPC8255ACVVMHBB serves as the shared memory conduit between the G2 core and the Communications Processor Module (CPM). It enables zero-copy data transfer for packet buffers, descriptor rings, and firmware variables - eliminating bus arbitration delays. The CPM accesses this RAM directly for HDLC frame assembly or ATM cell processing, while the G2 core reads status and writes commands, ensuring deterministic latency critical for real-time telecom applications using MPC8255ACVVMHBB.

Can MPC8255ACVVMHBB operate with different clock frequencies for its core and CPM subsystems?

Yes, MPC8255ACVVMHBB uses independent PLLs for the G2 core and CPM, allowing asynchronous clock domain operation. For example, the core can run at 266 MHz while the CPM operates at 133 MHz - optimizing power consumption during low-traffic periods without sacrificing real-time responsiveness for serial protocol handling. This configuration is set via the System Interface Unit (SIU) clock synthesizer registers and requires separate multiplier programming for each domain in MPC8255ACVVMHBB initialization code.