NXP Semiconductors MPC8255ACZUMIBB

Overview

MPC8255ACZUMIBB from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core, 16-Kbyte instruction and data caches, and a dedicated Communications Processor Module (CPM). It operates at up to 300 MHz, supports 10/100-Mbit Ethernet via two MII ports, four SCCs for HDLC/UART/SDLC, and four TDM interfaces - deployed in telecom access equipment, DSLAMs, and industrial gateways requiring deterministic real-time protocol handling.

For engineers reviewing the MPC8255ACZUMIBB datasheet, MPC8255ACZUMIBB pinout, MPC8255ACZUMIBB application, or MPC8255ACZUMIBB equivalent, key selection criteria include CPM-based offload capability for serial protocols, 60x bus timing compatibility with legacy PowerPC systems, thermal derating above 70°C ambient, and validation of I/O supply sequencing (VDDH vs. VDD/VCCSYN tracking).

Technical Context

The MPC8255ACZUMIBB integrates a G2 core and CPM with independent PLLs, enabling asynchronous clock domains: core frequencies up to 300 MHz (1.9–2.2 V) and CPM frequencies up to 200 MHz. Its memory controller supports glueless interfacing to SDRAM, SRAM, Flash, and EPROM with programmable bank sizes and byte-select logic for both 64-bit 60x and 32-bit local buses.

CPM functionality includes three FCCs (FCC1/FCC2 only), two MCCs (MCC2 only), four SCCs, two SMCs, SPI, I²C, eight baud rate generators, and four 16-bit timers. The device implements four TDM interfaces (not eight), lacks PCI bridge and TC-layer hardware, and omits FCC3, MCC1, and UTOPIA-2 support - differentiating it from MPC8266/MPC8265 variants.

Key Specifications

Pinout & Package

Package: 480-pin TBGA (19 mm × 19 mm, 1.0 mm pitch), RoHS-compliant, thermal resistance θJA = 83°C/W (4-layer board, 1 m/s airflow).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8260AZUUPE and MPC8313EVRAGDB, the MPC8255ACZUMIBB offers optimal balance of proven CPM-based serial offload, compact 480-pin TBGA packaging, and cost efficiency for fixed-function telecom edge devices - without over-provisioning PCI or DDR capabilities.

Availability

MPC8255ACZUMIBB is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, telecom edge routers, and secure remote terminal units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MPC8255ACZUMIBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with heritage in Freescale's PowerQUICC portfolio.

The MPC8255ACZUMIBB belongs to the PowerQUICC™ II family, designed specifically for cost-sensitive, high-reliability communications infrastructure where deterministic CPM offload and PowerPC compatibility outweigh raw CPU performance.

FAQ

What is the maximum operating frequency of the MPC8255ACZUMIBB core?

The MPC8255ACZUMIBB core supports up to 300 MHz, but this requires VDD ≥ 1.9 V and junction temperature ≤ 105°C. At 200 MHz, operation is guaranteed down to VDD = 1.7 V. Frequency scaling is controlled by internal PLL multipliers (1.5:1 to 6:1 for core, 2:1 to 6:1 for CPM), and actual achievable speed depends on thermal design and voltage stability - verified in the MPC8260AEC Rev. 2.0 datasheet section 2.1.

Does the MPC8255ACZUMIBB include a PCI interface?

No, the MPC8255ACZUMIBB does not include a PCI bridge. PCI interface capability is exclusive to MPC8265 and MPC8266 variants per the MPC8260AEC Rev. 2.0 documentation (section 1, Features). The MPC8255ACZUMIBB provides only 60x and local buses - use MPC8255ACZUMIBB where PCI expansion is unnecessary and cost/area optimization is critical.

How many TDM interfaces does the MPC8255ACZUMIBB support?

The MPC8255ACZUMIBB supports exactly four TDM interfaces, not eight. This is explicitly stated in the "Notes" box of Figure 1 (MPC8266 Block Diagram) and confirmed in section 1 Features: "4 TDM ports on the MPC8255". Full 8-TDM capability requires MPC8264/MPC8266 derivatives with TC-layer hardware - absent in MPC8255ACZUMIBB.

What is the function of the DP pins on the MPC8255ACZUMIBB?

The DP[0–7] pins on the MPC8255ACZUMIBB serve dual roles: DP(0)–DP(3) implement JTAG test access (TCK/TMS/TDI/TDO), while DP(4)–DP(7) function as IRQ6–IRQ7 inputs and chip-select enables (CSE0/CSE1). They are not general-purpose I/O by default and require configuration via SIU registers - detailed in MPC8260AEC Rev. 2.0 section 4 (Pinout) and section 5 (Package Description).

Is the MPC8255ACZUMIBB suitable for extended temperature applications?

Yes, the "MIBB" suffix in MPC8255ACZUMIBB denotes extended temperature grade (–40°C to +85°C ambient), validated per Freescale's qualification standards. Junction temperature must remain ≤ 105°C, requiring thermal design with θJA ≤ 83°C/W (4-layer board, 1 m/s airflow) - specified in Table 4 of MPC8260AEC Rev. 2.0 and confirmed in ordering information section 6.