NXP Semiconductors MPC8255AVVMHBB

Overview

MPC8255AVVMHBB from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core running at 266 MHz, 16 KB instruction and 16 KB data caches, and a dedicated Communications Processor Module (CPM) with four SCCs, two SMCs, one SPI, one I²C, two FCCs, one MCC2, and four TDM ports. It targets telecom edge routers, DSLAM line cards, and industrial protocol gateways requiring deterministic real-time packet processing.

For engineers reviewing the MPC8255AVVMHBB datasheet, MPC8255AVVMHBB pinout, MPC8255AVVMHBB application, or MPC8255AVVMHBB equivalent, this page delivers verified core frequency, CPM peripheral count, memory controller support, thermal resistance, and I/O voltage specs - all confirmed for the exact MPC8255AVVMHBB variant in the HiP4 480-pin TBGA package.

Technical Context

The MPC8255AVVMHBB implements a split-architecture design: the G2 core handles general-purpose control and protocol stack execution, while the CPM offloads time-critical serial communications tasks including HDLC, UART, Ethernet MII, and TDM framing. Core and CPM operate on independent PLLs, enabling asynchronous clocking - e.g., 266 MHz core / 133 MHz CPM - for optimized power/performance trade-offs.

Its memory subsystem includes a 12-bank controller supporting SRAM, SDRAM, Flash, and EPROM with glueless interfacing, byte-write enables, and programmable bank sizing. The 60x bus provides 64-bit/32-bit address/data width up to 83 MHz, while the local bus operates at 32-bit/18-bit width up to 83 MHz - both with burst transfer and parity/ECC support.

Key Specifications

Pinout & Package

Package: 480-ball thin quad flat no-lead (TBGA), 27 mm × 27 mm, 1.27 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil opening and ground plane connection per JEDEC JESD51-8.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8260AZUUHBB and MPC8313EVRAGDB, the MPC8255AVVMHBB uniquely balances CPM-accelerated serial I/O density, thermal efficiency in fanless enclosures, and proven qualification for telecom NEBS Level 3 environments - making it irreplaceable in legacy carrier infrastructure upgrades.

Availability

MPC8255AVVMHBB is available at Aetrix Electronics and suitable for DSLAM line cards, industrial protocol gateways, VoIP media gateways, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC8255AVVMHBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and maintains full technical support, documentation, and long-term supply for the PowerQUICC™ II family.

The MPC8255AVVMHBB belongs to the PowerQUICC™ II communications processor line, designed specifically for carrier-grade and industrial edge networking equipment requiring hardware-accelerated serial protocol handling and deterministic real-time performance.

FAQ

What is the maximum operating frequency of the MPC8255AVVMHBB core?

The MPC8255AVVMHBB features a G2 core rated for 266 MHz operation under recommended conditions (VDD = 1.9–2.2 V, TA ≤ 70 °C). This frequency is validated in the MPC8260AEC Rev. 2.0 datasheet for the HiP4 480-pin TBGA variant, with thermal derating required above 70 °C ambient. The MPC8255AVVMHBB does not support 300 MHz operation like the MPC8260AZUUHBB.

Does the MPC8255AVVMHBB include a PCI interface?

No, the MPC8255AVVMHBB does not include a PCI bridge. According to the MPC8260AEC Rev. 2.0 documentation, PCI functionality is exclusive to the MPC8265 and MPC8266 variants. The MPC8255AVVMHBB relies on its 60x and local buses for interconnect, with no PCI configuration registers, DMA channels, or physical pins allocated for PCI signaling.

How many TDM ports does the MPC8255AVVMHBB support?

The MPC8255AVVMHBB supports exactly four TDM ports, as explicitly stated in the "Notes" section of Figure 1 and confirmed in the Features chapter of the MPC8260AEC Rev. 2.0 datasheet. This is a key differentiator from the MPC8266 (eight TDM ports) and MPC8264 (four TDM ports with TC layer), and directly impacts time-division multiplexing capacity in E1/T1 line cards.

What is the function of the CPM in the MPC8255AVVMHBB?

The Communications Processor Module (CPM) in the MPC8255AVVMHBB is a dedicated 32-bit RISC microcontroller that offloads serial protocol processing from the main G2 core. It manages all SCC, SMC, FCC, SPI, I²C, and TDM peripherals - executing HDLC framing, UART timing, MII packet assembly, and TDM slot assignment independently to ensure deterministic latency below 10 µs.

Is the MPC8255AVVMHBB pin-compatible with other PowerQUICC II devices?

No, the MPC8255AVVMHBB is not pin-compatible with other PowerQUICC II devices such as the MPC8260 or MPC8266. While all HiP4 devices use the same 480-pin TBGA footprint, signal assignments differ significantly - for example, MPC8266 exposes PCI pins and eight TDM channels, whereas MPC8255AVVMHBB routes those balls to reserved or no-connect functions. PCB layout must be specific to MPC8255AVVMHBB.