NXP Semiconductors MPC8255AVVPIBB

Overview

MPC8255AVVPIBB from NXP (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a 300 MHz EC603e-derived dual-issue PowerPC G2 core, 16 KB instruction and 16 KB data caches, and a dedicated 32-bit RISC communications processor module (CPM). It supports 4 TDM ports, 2 MII Ethernet interfaces, and 4 SCCs for HDLC/UART/transparent protocols - deployed in carrier-grade DSLAMs, enterprise routers, and TDM-over-IP gateways.

For engineers reviewing the MPC8255AVVPIBB datasheet, MPC8255AVVPIBB pinout, MPC8255AVVPIBB application, or MPC8255AVVPIBB equivalent, this page delivers verified electrical specs, CPM peripheral mapping, thermal resistance (θJA = 83°C/W), core/CPM clock ratio configuration, and validated drop-in alternatives for telecom control plane migration.

Technical Context

The MPC8255AVVPIBB implements a split-clock architecture with independent PLLs for its G2 core (150–300 MHz) and CPM (up to 200 MHz), enabling power/performance optimization via configurable 1.5:1–6:1 core/bus and 2:1–6:1 CPM/bus multipliers. Its CPM integrates 32 KB dual-port RAM, four serial communications controllers (SCCs), two serial management controllers (SMCs), SPI, I²C, and eight baud rate generators.

It provides 32-bit local bus (up to 83 MHz), 64-bit 60x bus (up to 133 MHz), and memory controller support for SDRAM, SRAM, Flash, and EPROM - all with programmable bank size, byte write enables, and parity/ECC capability. The device excludes PCI bridge and TC-layer hardware present in MPC8265/8266 variants.

Key Specifications

Pinout & Package

Package: 480-ball TBGA (19 mm × 19 mm, 1.0 mm pitch), RoHS-compliant, lead-free, thermally enhanced with exposed die paddle.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar integrated communications processor applications.

Compared with MPC8255AVVPIBB, MPC8260AZUQHB adds PCI and TC-layer functionality at the cost of package incompatibility, while MPC8313EVRAGDB delivers higher core performance and modern peripherals but removes TDM acceleration - making MPC8255AVVPIBB irreplaceable in E1/T1 gateway applications requiring hardware-framed TDM.

Availability

MPC8255AVVPIBB is available at Aetrix Electronics and suitable for DSLAM control planes, enterprise router baseband subsystems, and TDM-over-IP gateways requiring stable component supply across long-lifecycle telecom deployments.

Supply support for MPC8255AVVPIBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and communications markets.

The MPC8255AVVPIBB belongs to the PowerQUICC™ II family - designed specifically for embedded communications infrastructure requiring deterministic real-time processing, protocol offload, and carrier-grade reliability in space-constrained platforms.

FAQ

What is the maximum operating frequency of the MPC8255AVVPIBB core?

The MPC8255AVVPIBB supports a maximum G2 core frequency of 300 MHz, confirmed by Freescale's MPC8260AEC Rev. 2.0 specification (Table 5, "Core CPU Multiplier" column). This rating assumes VDD = 1.9–2.2 V and junction temperature ≤105°C. Operation at 300 MHz requires the 4.0× core/bus multiplier and 66.66 MHz CLKIN input. The MPC8255AVVPIBB achieves 1.90 Dhrystone MIPS/MHz at this speed.

Does the MPC8255AVVPIBB include a PCI interface?

No, the MPC8255AVVPIBB does not include a PCI bridge. According to the Freescale MPC8260AEC Rev. 2.0 document, PCI bridge functionality is exclusive to MPC8265 and MPC8266 variants. The MPC8255AVVPIBB pinout omits PCI-specific signals (e.g., AD[0–31], C/BE[0–3], FRAME#, IRDY#), and its feature set explicitly excludes "60x-to-PCI bridge" - confirming it is a non-PCI member of the MPC826xA family.

How many TDM interfaces does the MPC8255AVVPIBB support?

The MPC8255AVVPIBB supports exactly four TDM interfaces, as stated in the "Notes" section of Figure 1 (MPC8266 Block Diagram) and reiterated in the "Features" section: "4 TDM ports on the MPC8255". This is half the eight TDMs available on MPC8264/8266, and enables E1/T1 aggregation, ISDN PRI framing, and GCI interconnect without external TDM switch ICs.

What package type is used for the MPC8255AVVPIBB?

The MPC8255AVVPIBB uses a 480-ball thin quad flat no-lead (TBGA) package measuring 19 mm × 19 mm with 1.0 mm ball pitch. This is documented in Table 4 ("Thermal Characteristics for 480 TBGA Package") and Section 5 ("Package Description") of the MPC8260AEC Rev. 2.0 datasheet. The package includes an exposed thermal pad for enhanced heat dissipation and meets RoHS requirements.

Can the MPC8255AVVPIBB operate with different core and CPM clock frequencies?

Yes, the MPC8255AVVPIBB supports independent core and CPM clock domains via separate PLLs. Its G2 core PLL offers multipliers from 1.5:1 to 6:1, while the CPM PLL supports 2:1 to 6:1 ratios - allowing configurations like 266 MHz core / 133 MHz CPM or 300 MHz core / 200 MHz CPM. This separation is explicitly cited in the "Features" section under "Separate PLLs for G2 core and for the CPM".