NXP Semiconductors MPC8255AZUMHBB

Overview

MPC8255AZUMHBB from NXP Semiconductors (formerly Freescale) is a PowerQUICC™ II integrated communications processor featuring a dual-issue EC603e core, 16-Kbyte instruction and data caches, and a dedicated Communications Processor Module (CPM) for offloading protocol processing. It operates at up to 266 MHz core frequency with 1.9–2.2 V core supply, supports 4 TDM ports and 2 MII Ethernet interfaces, and targets telecom edge routers and industrial gateways requiring deterministic real-time packet handling.

For engineers reviewing the MPC8255AZUMHBB datasheet, MPC8255AZUMHBB pinout, MPC8255AZUMHBB application, or MPC8255AZUMHBB equivalent, this page delivers verified electrical specs, validated package mapping, confirmed CPM peripheral configuration, and precise functional differentiation versus related MPC826xA family members - all grounded in the official MPC8260AEC Rev. 2.0 hardware specification.

Technical Context

The MPC8255AZUMHBB implements a split-architecture design: a high-performance G2 core (PowerPC-compliant MMU, FPU, 60x bus) handles system control and packet forwarding, while the autonomous 32-bit RISC-based CPM executes serial protocol stacks (HDLC, UART, SPI, I²C, ATM TC-layer functions) via 32-Kbyte dual-port RAM and dedicated DMA channels. Core and CPM operate on independent PLLs, enabling asynchronous clocking (e.g., 266 MHz core / 133 MHz CPM) for power/performance tuning.

Its 480-pin TBGA package integrates a 12-bank memory controller supporting SDRAM, SRAM, Flash, and EPROM; a system interface unit (SIU) with RTC, watchdog, JTAG, and clock synthesis; and configurable I/O banks (PA/PB/PC/PD) with programmable drive strength and slew rate. The device omits the PCI bridge and second MCC found in MPC8265/8266, confirming its role as a cost-optimized, communications-focused variant within the HiP4 process family.

Key Specifications

Pinout & Package

Package: 480-pin TBGA (27 mm × 27 mm, 1.27 mm pitch), RoHS-compliant, thermal pad exposed on underside for heatsink attachment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar communications processor applications.

Compared with MPC8260AZUHBB, MPC8255AZUMHBB trades PCI expandability and extra TDM capacity for lower power, reduced BOM cost, and simpler thermal management - making it the preferred choice for fixed-function edge routers. Against MPC8313EVRAGDB, it retains hardware-accelerated legacy telecom protocols but lacks USB and DDR support, preserving investment in existing CPM-based firmware.

Availability

MPC8255AZUMHBB is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, and secure remote terminal units requiring stable component supply across extended product lifecycles.

Supply support for MPC8255AZUMHBB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors, headquartered in Eindhoven, Netherlands, designs secure, scalable semiconductor solutions for automotive, industrial, and networking markets - with annual R&D investment exceeding $1.4 billion.

The MPC8255AZUMHBB belongs to the PowerQUICC™ II family, engineered specifically for deterministic, low-latency communications processing in carrier-class edge equipment where hardware-accelerated protocol offload and long-term supply stability are critical.

FAQ

What is the maximum operating frequency of the MPC8255AZUMHBB core?

The MPC8255AZUMHBB supports a maximum core frequency of 266 MHz when operated at 1.9–2.2 V VDD supply voltage, as specified in Table 5 of the MPC8260AEC Rev. 2.0 datasheet. This frequency is achievable with appropriate thermal management - junction temperature must not exceed 105°C under continuous load. The MPC8255AZUMHBB achieves 1.90 Dhrystone MIPS/MHz at this speed, delivering predictable real-time performance for telecom control-plane tasks.

Does the MPC8255AZUMHBB include a PCI interface?

No, the MPC8255AZUMHBB does not include a PCI bridge. Per Figure 1 notes and Section 1 features of the MPC8260AEC Rev. 2.0 document, PCI functionality is exclusive to the MPC8265 and MPC8266 variants. The MPC8255AZUMHBB omits the 60x-to-PCI bridge block entirely, reducing pin count and power consumption - confirming its positioning as a cost-optimized, communications-focused member of the MPC826xA family.

How many TDM interfaces does the MPC8255AZUMHBB support?

The MPC8255AZUMHBB supports exactly four TDM interfaces, as explicitly stated in the "Notes" section of Figure 1 and reiterated in the Features chapter (page 5) of the MPC8260AEC Rev. 2.0 specification. This is half the eight TDM ports available on the MPC8264/8266, aligning with its target use case in mid-density telecom access nodes where four T1/E1 lines represent typical deployment scale.

What package type and dimensions does the MPC8255AZUMHBB use?

The MPC8255AZUMHBB is packaged in a 480-pin TBGA (Thin Ball Grid Array) measuring 27 mm × 27 mm with 1.27 mm ball pitch, as documented in Section 5 "Package Description" of the MPC8260AEC Rev. 2.0 datasheet. Thermal resistance values (θJA = 83°C/W for 4-layer board, 1 m/s airflow) are provided in Table 4, defining minimum copper area and thermal via requirements for reliable operation at 105°C junction temperature.

Is the MPC8255AZUMHBB pin-compatible with other MPC826xA family members?

The MPC8255AZUMHBB shares the same 480-pin TBGA footprint and core signal assignments (60x bus, local bus, CLKIN, reset, JTAG) with MPC8260/8264/8265/8266 devices, enabling mechanical compatibility. However, it is not functionally pin-compatible due to omitted signals - notably PCI-related pins (AD[0–31], C/BE[0–3], FRAME, IRDY, TRDY) and second MCC control lines are NC (no-connect) on MPC8255AZUMHBB per pinout diagrams in Section 4 of MPC8260AEC Rev. 2.0.